| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/15/1998 | US5808355 Lead frame of a semiconductor device and a method for designing it |
| 09/15/1998 | US5808354 Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface |
| 09/15/1998 | US5808351 Programmable/reprogramable structure using fuses and antifuses |
| 09/15/1998 | US5808330 Polydirectional non-orthoginal three layer interconnect architecture |
| 09/15/1998 | US5808325 Optical transmitter package assembly including lead frame having exposed flange with key |
| 09/15/1998 | US5808320 Contact openings and an electronic component formed from the same |
| 09/15/1998 | US5808240 Low-inductance planar bus arrangement |
| 09/15/1998 | US5808236 High density heatsink attachment |
| 09/15/1998 | US5807959 For semiconductors |
| 09/15/1998 | US5807910 Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive |
| 09/15/1998 | US5807791 Methods for fabricating multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes |
| 09/15/1998 | US5807786 Amorphous silicon layer with thin protective coating during patterning |
| 09/15/1998 | US5807785 Low dielectric constant silicon dioxide sandwich layer |
| 09/15/1998 | US5807768 Method for fabricating a heat sink-integrated semiconductor package |
| 09/15/1998 | US5807767 Technique for attaching die to leads |
| 09/15/1998 | US5807766 Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process |
| 09/15/1998 | US5807762 Multi-chip module system and method of fabrication |
| 09/15/1998 | US5807626 Ceramic circuit board |
| 09/15/1998 | US5807611 Forming protective ceramic coating |
| 09/15/1998 | US5807508 Copper oxide, polymer composite |
| 09/15/1998 | US5807453 Fabrication of leads on semiconductor connection components |
| 09/15/1998 | US5807432 Process for producing diamond covered member |
| 09/15/1998 | US5807118 IC socket |
| 09/15/1998 | US5806583 For separating a high temperature fluid and low temperature fluid |
| 09/15/1998 | US5806571 Apparatus and method for forming the external leads of an integrated circuit |
| 09/15/1998 | US5806318 For electronic equipment |
| 09/15/1998 | CA2123287C Pin-fin heat sink |
| 09/11/1998 | WO1998039956A1 Heatsink assembly with adjustable retaining clip |
| 09/11/1998 | WO1998039803A2 Circuit configuration comprising semi-conductor components which has devices for monitoring junction temperature |
| 09/11/1998 | WO1998039795A1 Method of checking for the presence of connection balls |
| 09/11/1998 | WO1998039784A1 Ceramic multilayer printed circuit boards with embedded passive components |
| 09/11/1998 | WO1998039781A1 Vertically interconnected electronic assemblies and compositions useful therefor |
| 09/10/1998 | DE19758452A1 Metal-ceramic substrate for electrical circuit |
| 09/10/1998 | DE19735170A1 Chip module esp. for chip card with contacts with adjacent chips |
| 09/10/1998 | DE19735074A1 Power module |
| 09/10/1998 | DE19708653A1 Verfahren zur Bestimmung der Junktion-Temperatur von gehäusten Halbleiterbauelementen Method for determining the temperature of Junktion-packaged semiconductor components |
| 09/09/1998 | EP0863696A2 Electronic unit |
| 09/09/1998 | EP0863551A2 Housing for microoptical and/or microelectronic devices |
| 09/09/1998 | EP0863550A2 Metallurgical interconnect composite |
| 09/09/1998 | EP0863549A2 Semiconductor device comprising a wiring substrate |
| 09/09/1998 | EP0863548A2 Mounting assembly of integrated circuit device and method for production thereof |
| 09/09/1998 | EP0863547A2 Gate unit for a hard-driven GTO |
| 09/09/1998 | EP0863546A1 Pseudo-fuse and its use in a circuit for setting a bistable flip-flop |
| 09/09/1998 | EP0862794A1 Sealing material with wavelength converting effect, application and production process |
| 09/09/1998 | EP0862791A1 Method of manufacturing and transferring metallic droplets |
| 09/09/1998 | EP0862790A1 Electronic control module having fluid-tight seals |
| 09/09/1998 | EP0862789A1 Semiconductor package with ground or power ring |
| 09/09/1998 | EP0862788A2 Vertically integrated semiconductor component and method of producing the same |
| 09/09/1998 | EP0832438A4 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| 09/09/1998 | EP0694220B1 Solder-bearing lead |
| 09/09/1998 | EP0637080B1 Pressure contact type semiconductor device |
| 09/09/1998 | CN2290933Y Radiating device of diode |
| 09/09/1998 | CN1192825A Top loading socket for ball grid arrays |
| 09/09/1998 | CN1192594A Planar dielectric integrated circuit |
| 09/09/1998 | CN1192583A Semiconductor device, semiconductor equipment, and method for mfg. same |
| 09/09/1998 | CN1192582A 半导体器件 Semiconductor devices |
| 09/09/1998 | CN1192578A Semiconductor apparatus and electronic apparatus having the same |
| 09/08/1998 | US5805430 Zero force heat sink |
| 09/08/1998 | US5805427 Ball grid array electronic package standoff design |
| 09/08/1998 | US5805426 Microelectronic assemblies including Z-axis conductive films |
| 09/08/1998 | US5805425 Microelectronic assemblies including Z-axis conductive films |
| 09/08/1998 | US5805424 Microelectronic assemblies including Z-axis conductive films |
| 09/08/1998 | US5805422 Semiconductor package with flexible board and method of fabricating the same |
| 09/08/1998 | US5805421 Semiconductor substrate having alignment marks for locating circuitry on the substrate |
| 09/08/1998 | US5805419 Low-profile socketed packaging system with land-grid array and thermally conductive slug |
| 09/08/1998 | US5805418 Cooling cap method and apparatus for tab packaged integrated circuits |
| 09/08/1998 | US5805043 High Q compact inductors for monolithic integrated circuit applications |
| 09/08/1998 | US5805013 Non-volatile memory device having a floating gate with enhanced charge retention |
| 09/08/1998 | US5804884 Surface electrical field delimiting structure for an integrated circuit |
| 09/08/1998 | US5804883 Bonding pad in semiconductor device |
| 09/08/1998 | US5804882 Semiconductor device having a semiconductor chip electrically connected to a wiring substrate |
| 09/08/1998 | US5804880 For electrical connection to a die |
| 09/08/1998 | US5804879 Aluminum scandium alloy interconnection |
| 09/08/1998 | US5804878 Electronic circuit |
| 09/08/1998 | US5804876 Electronic circuit bonding interconnect component and flip chip interconnect bond |
| 09/08/1998 | US5804875 Computer system with heat sink having an integrated grounding tab |
| 09/08/1998 | US5804874 Stacked chip package device employing a plurality of lead on chip type semiconductor chips |
| 09/08/1998 | US5804873 Heatsink for surface mount device for circuit board mounting |
| 09/08/1998 | US5804872 Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof |
| 09/08/1998 | US5804871 Lead on chip semiconductor device having bus bars and crossing leads |
| 09/08/1998 | US5804870 Hermetically sealed integrated circuit lead-on package configuration |
| 09/08/1998 | US5804869 Clamp disposed at edge of a dielectric structure in a semiconductor device and method of forming same |
| 09/08/1998 | US5804865 Package for optical semiconductor element and method for manufacturing the same |
| 09/08/1998 | US5804862 Semiconductor device having contact hole open to impurity region coplanar with buried isolating region |
| 09/08/1998 | US5804771 For an integrated circuit package assembly |
| 09/08/1998 | US5804631 Curing a mixture of an alkoxy-substituted organopolysiloxane, an alkenyl-substituted organopolysiloxane and an organopolysiloxane with at least two silicon-bonded hydrogen atoms |
| 09/08/1998 | US5804509 Filling spaces the metal interconnectors by vapor depositing tetraethoxysilane and ozone gas |
| 09/08/1998 | US5804508 Method of making a low dielectric constant material for electronics |
| 09/08/1998 | US5804505 Method of producing semiconductor device having buried contact structure |
| 09/08/1998 | US5804504 Method for forming wiring of semiconductor device |
| 09/08/1998 | US5804503 Method and structure for reducing microelectronic short circuits using spin-on glass as part of the interlayer dielectric |
| 09/08/1998 | US5804502 Tungsten plugs for integrated circuits and methods for making same |
| 09/08/1998 | US5804501 Fomring dielectric layer over semiconductor substrate and a contact hole on dielectric layer by photo etching, covering with barrier metal layer, chemical vapor depositing first wiring layer and sputtering second wiring layer |
| 09/08/1998 | US5804500 Forming conductive electrode over dielectric layer; dielectric layer over upper surface of electrode; forming aperture, plugging; chemical mechanical polishing of raised outer edge, make upper electrode. |
| 09/08/1998 | US5804499 Forming in vacuum tungsten silicide doped polysilicon interconnect structure, depositing amorphous silicon layer, forming native oxide |
| 09/08/1998 | US5804474 Method for forming a V-shaped gate electrode in a semiconductor device, and the structure of the electrode |
| 09/08/1998 | US5804469 Semiconductor device and method for producing a semiconductor device |
| 09/08/1998 | US5804468 Process for manufacturing a packaged semiconductor having a divided leadframe stage |
| 09/08/1998 | US5804467 Semiconductor device and method of producing the same |
| 09/08/1998 | US5804464 Semiconductor chip kerf clear method for forming semiconductor chips and electronic module therefore |