Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1998
09/23/1998CN1194058A Electronic component and method of production thereof
09/23/1998CN1194030A Pre-application of grease to heat sinks with a protective coating
09/23/1998CN1193886A Mounted base board
09/23/1998CN1193825A Planar dielectric integrated circuit
09/23/1998CN1193815A Tape carrier package
09/23/1998CN1193811A Method for manufacturing semiconductor device in which etching end point is monitored and multi-layer wiring structure formed by the same
09/22/1998US5812570 Laser diode component with heat sink and method of producing a plurality of laser diode components
09/22/1998US5812381 Lead frame and integrated circuit package using the lead frame
09/22/1998US5812380 Mesh planes for multilayer module
09/22/1998US5812379 Small diameter ball grid array pad size for improved motherboard routing
09/22/1998US5812378 Microelectronic connector for engaging bump leads
09/22/1998US5812376 Mounting assembly for electrical components and heat sinks
09/22/1998US5812039 Apparatus for providing a ground for circuits on carriers
09/22/1998US5811883 Design for flip chip joint pad/LGA pad
09/22/1998US5811882 On-chip shielding coaxial conductors for mixed-signal IC
09/22/1998US5811880 Design for mounting discrete components inside an integrated circuit package for frequency governing of microprocessors
09/22/1998US5811879 Stacked leads-over-chip multi-chip module
09/22/1998US5811877 Semiconductor device structure
09/22/1998US5811876 Semiconductor device with film carrier package structure
09/22/1998US5811875 Lead frames including extended tie-bars, and semiconductor chip packages using same
09/22/1998US5811874 Semiconductor chip package device having a rounded or chamfered metal layer guard ring
09/22/1998US5811872 Semiconductor device and method of farbricating the same
09/22/1998US5811870 Antifuse structure
09/22/1998US5811869 Laser antifuse using gate capacitor
09/22/1998US5811868 Integrated high-performance decoupling capacitor
09/22/1998US5811863 Transistors having dynamically adjustable characteristics
09/22/1998US5811849 Semiconductor device and manufacturing process thereof
09/22/1998US5811845 Semiconductor apparatus and horizontal register for solid-state image pickup apparatus with protection circuit for bypassing an excess signal
09/22/1998US5811837 For an electro-optical device
09/22/1998US5811486 Phosphorus-free epoxy resin and an epoxy-free hardener comprising a conversion product of a phosphonic acid anhydride and an alcohol having at least two hydroxyl groups
09/22/1998US5811375 Superconducting multilayer interconnection formed of oxide superconductor material and method for manufacturing the same
09/22/1998US5811353 Semiconductor device and manufacturing method thereof
09/22/1998US5811352 Method of making reliable metal leads in high speed LSI semiconductors using dummy leads
09/22/1998US5811351 Semiconductor device and method of manufacturing the same
09/22/1998US5811350 Method of forming contact openings and an electronic component formed from the same and other methods
09/22/1998US5811330 Forming first conductive layer over insulating layer, etching first aperture in conductive layer, depositing second insulating and second conductive layers, selectively etching second aperture in second layer through first aperture
09/22/1998US5811318 Method for manufacturing a liquid crystal display
09/22/1998US5811317 Underfill thermosetting resin is not completely cured therfore, solder joints and die do not experience much stress
09/22/1998US5811316 Method of forming teos oxide and silicon nitride passivation layer on aluminum wiring
09/22/1998US5811314 Magnetic ink and method for manufacturing and sifting out of defective dice by using the same
09/22/1998US5811188 For dielectrics, prepregs or other electrical equipmewnt
09/22/1998US5810926 Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
09/22/1998US5810608 Contact pad extender for integrated circuit packages
09/22/1998US5810607 Interconnector with contact pads having enhanced durability
09/22/1998US5810072 Forced air cooler system
09/22/1998US5809641 Method for printed circuit board repair
09/22/1998CA2137388C Ceramic substrate for semiconductor device
09/17/1998WO1998041076A2 Device for cooling electronic components
09/17/1998WO1998040915A1 Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board
09/17/1998WO1998040914A1 Printed wiring board and method for manufacturing the same
09/17/1998WO1998040912A1 Chip arrangement and method for the production of the same
09/17/1998WO1998040910A1 Wiring forming method for semiconductor device and semiconductor device
09/17/1998WO1998040909A2 Method of forming etched structures comprising implantation steps
09/17/1998WO1998040431A1 Thermally conductive film and method for the preparation thereof
09/17/1998WO1998029669A3 Cooling using a cryogenic liquid and a contacting gas
09/17/1998DE4143616C2 Semiconductor arrangement with self-aligned contact windows
09/17/1998DE19810546A1 Notch-free marked wafer production
09/17/1998DE19810545A1 Wafer with mirror polished bevelled edge
09/17/1998DE19709985A1 Smart card for data transmission using contact- or contactless technology
09/16/1998EP0865083A2 Electrode for semiconductor device and method of manufacturing it
09/16/1998EP0865082A1 Semiconductor device, process for producing the same, and packaged substrate
09/16/1998EP0865081A2 Process for fabricating electronic elements
09/16/1998EP0865075A2 Process for the fabrication of spatially structured devices
09/16/1998EP0864249A1 Surface mount socket for an electronic package and contact for use therewith
09/16/1998EP0864184A1 Device with circuit element and transmission line
09/16/1998EP0864175A1 Novel metallization sidewall passivation technology for deep sub-half micrometer ic applications
09/16/1998EP0864173A1 A method and device for chip assembly
09/16/1998EP0843892A4 Top loading socket for ball grid arrays
09/16/1998EP0833578A4 Fan attachment clip for heat sink
09/16/1998EP0758487A4 Tape application platform and processes therefor
09/16/1998CN2291721Y Radiator for transistor and transistor module
09/16/1998CN2291720Y Radiator for power semiconductor device
09/16/1998CN1193189A Interconnection system in semiconductor device
09/16/1998CN1193188A Semiconductor device, assembling method, and circuit baseboard and soft baseboard and mfg. method therefor
09/16/1998CN1193187A Device for processing lead-wire frame and processing method thereof
09/16/1998CN1193186A Carrier sheet and integrated circuit device using same
09/15/1998US5809211 Ramping susceptor-wafer temperature using a single temperature input
09/15/1998US5808951 Semiconductor memory
09/15/1998US5808947 Integrated circuit that supports and method for wafer-level testing
09/15/1998US5808897 Integrated circuit device having interchangeable terminal connection
09/15/1998US5808878 Circuit substrate shielding device
09/15/1998US5808877 Multichip package having exposed common pads
09/15/1998US5808875 Integrated circuit solder-rack interconnect module
09/15/1998US5808874 Microelectronic connections with liquid conductive elements
09/15/1998US5808873 Electronic component assembly having an encapsulation material and method of forming the same
09/15/1998US5808872 Semiconductor package and method of mounting the same on circuit board
09/15/1998US5808870 Plastic pin grid array package
09/15/1998US5808868 Electronic module with power components
09/15/1998US5808853 Capacitor with multi-level interconnection technology
09/15/1998US5808519 Hermetically sealed millimeter-wave device
09/15/1998US5808366 Integrated circuits, and methods of fabricating same, which take into account capacitive loading by the integrated circuit potting material
09/15/1998US5808365 Semiconductor device and method of manufacturing the same
09/15/1998US5808364 Semiconductor device
09/15/1998US5808363 Semiconductor device and method of fabricating the same
09/15/1998US5808361 Intergrated circuit interconnect via structure having low resistance
09/15/1998US5808360 Microbump interconnect for bore semiconductor dice
09/15/1998US5808359 Semiconductor device having a heat sink with bumpers for protecting outer leads
09/15/1998US5808358 Packaging electrical circuits
09/15/1998US5808357 Semiconductor device having resin encapsulated package structure
09/15/1998US5808356 Used in a semiconductor device
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