Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/10/2013US20130264702 Semiconductor unit
10/10/2013US20130264701 Integrated cold plate for electronics
10/10/2013US20130264700 Semiconductor device with embedded heat spreading
10/10/2013US20130264699 Contact element, in particular a solder tab and photovoltaic junction box with contact element, in particular a solder tab
10/10/2013US20130264698 Semiconductor device with heat dissipation
10/10/2013US20130264697 Semiconductor device
10/10/2013US20130264696 Semiconductor device
10/10/2013US20130264695 Stacked semiconductor device and method of manufacturing the same
10/10/2013US20130264694 Electronic package structure having exposed lands and method
10/10/2013US20130264693 Lead frame with grooved lead finger
10/10/2013US20130264692 Integrated circuit package and method of forming the same
10/10/2013US20130264691 Integrated circuit and method of manufacturing the same
10/10/2013US20130264686 Semiconductor wafer processing
10/10/2013US20130264684 Methods and Apparatus of Wafer Level Package for Heterogeneous Integration Technology
10/10/2013US20130264681 Integrated circuit chip with reduced ir drop
10/10/2013US20130264676 Semiconductor package with through silicon via interconnect and method for fabricating the same
10/10/2013US20130264675 Apparatus for forming memory lines and vias in three dimensional memory arrays using dual damascene process and imprint lithography
10/10/2013US20130264655 Semiconductor device, designing method therefor, and manufacturing method therefor
10/10/2013US20130264638 Semiconductor device having dc structure
10/10/2013US20130264616 Semiconductor device and manufacturing method thereof
10/10/2013US20130264615 Semiconductor Device and Method of Formation
10/10/2013DE112011103926T5 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
10/10/2013DE112010003323B4 Von oben zu betätigendes Halterungssystem mit Kraftbegrenzung für Kühlkörper From top-actuated suspension system with force limiter for heat sink
10/10/2013DE112004001654T5 Verfahren des Verarbeitens dicker ILD Schichten mit Hilfe von Spritzbeschichten oder Laminieren für einen C4 integrierten Dickmetallprozeßablauf auf Waferebene Method of processing thicker ILD layers using spray coating or lamination for a C4 integrated metal thickness at the wafer level process flow
10/10/2013DE10297785B4 Elektronikbaugruppe mit einer dichteren Kontaktanordnung, die eine Zuleitungsführung zu den Kontakten erlaubt Electronics module with a denser contact arrangement that allows a cable guide to the contacts
10/10/2013DE10245152B4 Integrierte Testschaltungsanordnung und Testverfahren Integrated test circuitry and test methods
10/10/2013DE102013206057A1 Integriertes schaltbauelement mit parallelem gleichrichterelement Integrated switching-device with parallel rectifier element
10/10/2013DE102013103378A1 Integrierte Schaltung mit Leistungstransistorzellen und einer Verbindungsleitung Integrated circuit with power transistor cells and a connecting line
10/10/2013DE102013103351A1 Elektronikmodul Electronics module
10/10/2013DE102013103300A1 Halbleitervorrichtungen mit einem Schutzring und zugehörige Halbleitersysteme Semiconductor devices with a guard ring and related semiconductor systems
10/10/2013DE102013103119A1 Pcb-basierter fensterrahmen für hf-leistungspackage Pcb-based window frame for hf-performance package
10/10/2013DE102013102857A1 Klemmrahmen-Halbleitergehäuse und Verfahren zu ihrer Herstellung Clamping frame semiconductor package and process for its preparation
10/10/2013DE102012207470B3 Method for manufacturing semiconductor module arrangement i.e. converter, involves cooling body such that recess is reduced and composite is developed between semiconductor module and body, where sides exhibit surface of preset size
10/10/2013DE102012205590A1 Power module for use with inverter for engine mounted in e.g. electric vehicle, has capillary and/or porous element which is provided with three common boundary surfaces for mold compound, circuit carrier and heat sinks respectively
10/10/2013DE102012205463A1 Cooling device for power semiconductor component, has resonance pipe arranged between sonotrode element and cooling body, where distance between element and body corresponds to integral multiples of quarter of predetermined wavelength
10/10/2013DE102012102959A1 Umgossene Heat-Pipe Overmolded heat pipe
10/10/2013DE102009042920B4 Verfahren zur Herstellung eines Halbleiter-Bauelements und Verfahren zur Herstellung mehrerer Halbleiter-Bauelemente A process for producing a semiconductor device and methods for manufacturing a plurality of semiconductor devices
10/10/2013DE102008008513B4 Vorrichtung mit Zentrifuge zum Herstellen verlängerter Lothügel und zugehöriges Verfahren Centrifuge device for producing extended solder bumps and associated method
10/10/2013DE102006056777B4 Zusammenstellung umfassend ein Trägerelement mit einer Abschirmschicht und einen Chip Compilation comprising a support member having a shield and a chip
10/09/2013EP2648218A1 Integrated circuit and method of manufacturing the same
10/09/2013EP2648217A1 Cooling apparatus for electronic components and method for manufacturing same
10/09/2013EP2648216A2 Semiconductor unit
10/09/2013EP2648215A2 Method and apparatus providing integrated circuit system with interconnected stacked device wafers
10/09/2013EP2648214A1 Semiconductor device with interconnection via in the substrate and method of production
10/09/2013EP2648212A1 Semiconductor device
10/09/2013EP2647686A2 Resin Composition And Semiconductor Device Produced By Using The Same
10/09/2013EP2647685A1 Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet
10/09/2013EP2647667A1 Curable epoxy resin composition
10/09/2013EP2647269A1 Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
10/09/2013EP2647058A1 Photovoltaic module with a controlled vacuum, use of an oxygen getter in a photovoltaic module and method for manufacturing such a module
10/09/2013EP2647047A1 Semiconductor device with stacked power converter
10/09/2013EP2647046A1 Stacked microelectronic assembly having interposer connecting active chips
10/09/2013EP2647045A2 Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same
10/09/2013EP2647044A1 Microelectronic assembly with plural stacked active chips having through - silicon vias formed in stages
10/09/2013EP2647040A2 Stacked microelectronic assembly with tsvs formed in stages and carrier above chip
10/09/2013EP2646604A1 Heat exchanger for a system for solidifying and/or crystallizing a semiconductor
10/09/2013CN203233352U EPS DC motor drive circuit module
10/09/2013CN203232868U 智能功率模块 Intelligent Power Module
10/09/2013CN203232867U Semiconductor device
10/09/2013CN203232866U 智能功率模块 Intelligent Power Module
10/09/2013CN203232865U 18 row lead wire framework
10/09/2013CN203232864U Chip-packaging structure of micro-projector
10/09/2013CN203232863U Large-chip small-packaging power device
10/09/2013CN103348499A Resin-attached lead frame, method for manufacturing same, and lead frame
10/09/2013CN103348469A Three-dimensional power supply module having reduced switch node ringing
10/09/2013CN103348468A Semiconductor module and semiconductor module manufacturing method
10/09/2013CN103348466A 冷却装置及功率转换装置 A cooling device and a power conversion device
10/09/2013CN103348465A Adhesive compound and method for encapsulating electronic assembly
10/09/2013CN103348461A Fabrication of through-silicon vias on silicon wafers
10/09/2013CN103348459A Adhesive compound and method for encapsulating an electronic arrangement
10/09/2013CN103348443A High density three-dimensional integrated capacitors
10/09/2013CN103348442A High density three-dimensional integrated capacitors
10/09/2013CN103347960A Methods of modifying metal-oxide nanoparticles
10/09/2013CN103346150A Eight-layer stackable chip encapsulation structure and manufacturing process thereof
10/09/2013CN103346149A Integrated circuit chip upper inductor with substrate shielding layer formed by PN junctions and metal strips
10/09/2013CN103346148A Vertical-type capacitor structure and manufacturing method thereof
10/09/2013CN103346147A Multi-channel electrostatic discharge protective device
10/09/2013CN103346146A Nanometer power source based on carbon nanomaterial friction effect, preparation method of nanometer power source and application of nanometer power source
10/09/2013CN103346145A Flexible substrate packaging structure
10/09/2013CN103346144A Artificial magnetic conductor shaped like Chinese character 'jing' and used for 60GHz on-chip antenna and implement method
10/09/2013CN103346143A Test structure for metal layer electromigration
10/09/2013CN103346142A Test key structure and method for monitoring etching capacity of contact holes in etching process
10/09/2013CN103346141A Semiconductor device integrated with capacitor
10/09/2013CN103346140A Package based on silvering technology adopted for frame and manufacturing process of package
10/09/2013CN103346139A Encapsulating IC structure and full color display module
10/09/2013CN103346138A 智能功率模块及其制造方法 Intelligent Power Module and its manufacturing method
10/09/2013CN103346137A Integrated circuit packaging part and technique thereof
10/09/2013CN103346136A 功率模块及其封装方法 Power Modules and packaging method
10/09/2013CN103346135A Package based on technology that frame is connected through bonding wires and manufacturing process of package
10/09/2013CN103346134A Coaxial through-chip connection
10/09/2013CN103346133A High-speed radiator
10/09/2013CN103346132A Production equipment for phase change thermal interface material
10/09/2013CN103346131A Fine-pitch POP type sealing structure and sealing method
10/09/2013CN103346130A GCT gate pole insulating base and gate pole component
10/09/2013CN103346129A Ceramic packaging housing and manufacturing method thereof, chip packaging method
10/09/2013CN103346120A Method for exposing TSV heads in chemical etching mode and corresponding device
10/09/2013CN103346097A Method and structure for three-dimensional packaging based on TSV
10/09/2013CN103344347A Power semiconductor module for measuring chip temperature conveniently
10/09/2013CN103342815A Bismaleimide-cyanate ester compound, package substrate material and preparation method of such bismaleimide-cyanate ester compound
10/09/2013CN102723287B Packaging-first and etching-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
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