| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/11/2015 | CN104347551A 布线基板及其制造方法 Wiring board and manufacturing method thereof |
| 02/11/2015 | CN104347550A 一种无基板器件及其制造方法 A non-substrate device and a manufacturing method |
| 02/11/2015 | CN104347549A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/11/2015 | CN104347548A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof |
| 02/11/2015 | CN104347547A 半导体封装件及其的制造方法 Method of manufacturing a semiconductor package and the |
| 02/11/2015 | CN104347546A 一种多效芯片液体冷却装置 A pleiotropic chip liquid cooling device |
| 02/11/2015 | CN104347545A 具有大功率半导体模块和冷却装置的结构、冷却系统以及制造该结构的方法 Structure having the power semiconductor module and the cooling device, the cooling system and a method of manufacturing the structure |
| 02/11/2015 | CN104347544A 在堆叠管芯的侧壁上具有热介面材料的封装件 Package having a thermal interface material on the sidewalls of the stacked die |
| 02/11/2015 | CN104347543A 电子元件和电子装置 Electronic components and devices |
| 02/11/2015 | CN104347542A 五面包封的csp结构及制造工艺 Five csp bread seal structure and manufacturing process |
| 02/11/2015 | CN104347541A 电路模块以及电路模块的制造方法 The method of manufacturing a circuit module and circuit module |
| 02/11/2015 | CN104347540A 电路模块以及电路模块的制造方法 The method of manufacturing a circuit module and circuit module |
| 02/11/2015 | CN104347539A 芯片封装 Chip package |
| 02/11/2015 | CN104347538A 晶片堆叠封装体及其制造方法 Wafer stack package and its manufacturing method |
| 02/11/2015 | CN104347537A 晶片封装体及其制造方法 Chip package and manufacturing method thereof |
| 02/11/2015 | CN104347536A 晶片封装体及其制造方法 Chip package and manufacturing method thereof |
| 02/11/2015 | CN104347535A 电子封装模块及其制造方法 Electronic package module and a manufacturing method |
| 02/11/2015 | CN104347534A 倒装芯片的封装方法和封装基板 Flip chip packaging method and package substrate |
| 02/11/2015 | CN104347533A 半导体封装件及其制造方法 Semiconductor package and its manufacturing method |
| 02/11/2015 | CN104347532A 半导体封装件及其制造方法 Semiconductor package and its manufacturing method |
| 02/11/2015 | CN104347531A 塑封式智能功率模块及其散热器结构 Plastic smart power module and heat sink structure |
| 02/11/2015 | CN104347530A 带半导体密封用基体材料的密封材料、半导体装置及半导体装置的制造方法 The method of manufacturing a semiconductor sealing material for sealing with the base material, a semiconductor device and a semiconductor device |
| 02/11/2015 | CN104347529A 半导体装置及其制造方法、以及半导体装置的安装方法 Semiconductor device and manufacturing method, and a method of mounting a semiconductor device |
| 02/11/2015 | CN104347528A 半导体封装件及其制法 Semiconductor package Jiqizhifa |
| 02/11/2015 | CN104347527A 光学指纹传感器芯片封装玻璃光栅及其制作方法 Optical fingerprint sensor chip package and method of making glass grating |
| 02/11/2015 | CN104347526A 双工器封装结构及制造方法 Duplexer package structure and method of manufacture |
| 02/11/2015 | CN104347525A 电子装置 Electronic devices |
| 02/11/2015 | CN104347524A 半导体器件、半导体晶片结构和形成半导体晶片结构的方法 The method of the semiconductor device, a semiconductor wafer structure formed of a semiconductor wafer structure |
| 02/11/2015 | CN104347493A 半导体及其制造方法 The semiconductor manufacturing method thereof |
| 02/11/2015 | CN104347492A 具有高深宽比的通孔结构及多晶片互联的制造方法 The method of manufacturing a via structure having a high aspect ratio multi-chip interconnection and |
| 02/11/2015 | CN104347484A 一种半导体器件以及制作半导体器件的方法 A semiconductor device and a method of fabricating a semiconductor device |
| 02/11/2015 | CN104347483A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof |
| 02/11/2015 | CN104347482A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof |
| 02/11/2015 | CN104347476A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof |
| 02/11/2015 | CN104347438A 玻璃基板与金属基板的结合方法 Combined with a glass substrate and the metal substrate |
| 02/11/2015 | CN104347434A 用于制造芯片布置的方法和芯片布置 The method for manufacturing the chip layout and chip layout |
| 02/11/2015 | CN104347433A 基板封装件及其制造方法 Package and method of manufacturing the substrate |
| 02/11/2015 | CN104347431A 一种暴露器件顶面和底面的封装结构及其制作方法 A device the top and bottom of the package structure and production methods exposed |
| 02/11/2015 | CN104347350A 半导体自对准图案化的方法 Semiconductor self-aligned patterning method |
| 02/11/2015 | CN104345555A 焊料凸点形成用树脂组合物、焊料凸点形成方法和具备焊料凸点的构件 Solder bump forming member includes a solder bump forming method and the resin composition, the solder bump |
| 02/11/2015 | CN104341774A 用于半导体封装的模塑组合物和使用该模塑组合物的半导体封装 Molding compositions and the use of semiconductor package molding composition for semiconductor package |
| 02/11/2015 | CN104339751A 铜条、带镀敷的铜条以及引线框 Copper, plated with copper and lead frame strip |
| 02/11/2015 | CN103155310B 半导体激光装置 The semiconductor laser device |
| 02/11/2015 | CN102856314B 6500v二极管高压模块 6500v high voltage diode module |
| 02/11/2015 | CN102856290B 单芯片倒装先蚀刻后封装基岛埋入封装结构及其制造方法 After the first single flip-chip package substrate etching island buried package structure and manufacturing method |
| 02/11/2015 | CN102856288B 多芯片正装先蚀刻后封装基岛埋入封装结构及其制造方法 After etching the first multi-chip package being installed base island buried package structure and its manufacturing method |
| 02/11/2015 | CN102856212B 双面三维线路芯片倒装先封后蚀制造方法及其封装结构 Three-sided flip chip line first to win the title eclipse manufacturing method and package structure |
| 02/11/2015 | CN102760724B 一种联合封装的功率半导体器件 A federated packaged power semiconductor device |
| 02/11/2015 | CN102646639B 具有嵌埋的低介电系数金属化的半导体器件 Embedded with a low dielectric constant of the metal semiconductor devices |
| 02/11/2015 | CN102577654B 用于电子装置的热量输送结构 Heat transfer structure for electronic devices |
| 02/11/2015 | CN101794810B 有机发光显示设备 Organic light emitting display device |
| 02/10/2015 | US8953404 Semiconductor device having an electrical fuse element |
| 02/10/2015 | US8953355 Memory dies, stacked memories, memory devices and methods |
| 02/10/2015 | US8953353 Power converter |
| 02/10/2015 | US8953335 Semiconductor control device |
| 02/10/2015 | US8953320 Coolant drip facilitating partial immersion-cooling of electronic components |
| 02/10/2015 | US8953319 Heat-dissipating module |
| 02/10/2015 | US8953317 Wicking vapor-condenser facilitating immersion-cooling of electronic component(s) |
| 02/10/2015 | US8953290 Device for protecting an integrated circuit against overvoltages |
| 02/10/2015 | US8953178 Camera system with color display and processor for reed-solomon decoding |
| 02/10/2015 | US8953061 Image capture device with linked multi-core processor and orientation sensor |
| 02/10/2015 | US8953060 Hand held image capture device with multi-core processor and wireless interface to input device |
| 02/10/2015 | US8952846 Electronic apparatus, method of making the same, and transceiving device |
| 02/10/2015 | US8952750 Semiconductor power modules and devices |
| 02/10/2015 | US8952724 Semiconductor device capable of switching operation modes and operation mode setting method therefor |
| 02/10/2015 | US8952712 Tagging of functional blocks of a semiconductor component on a wafer |
| 02/10/2015 | US8952555 Semiconductor device and a method of manufacturing the same |
| 02/10/2015 | US8952553 Semiconductor device with stress relaxation during wire-bonding |
| 02/10/2015 | US8952552 Semiconductor package assembly systems and methods using DAM and trench structures |
| 02/10/2015 | US8952551 Semiconductor package and method for fabricating the same |
| 02/10/2015 | US8952550 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same |
| 02/10/2015 | US8952549 Semiconductor packages and methods of manufacturing the same |
| 02/10/2015 | US8952548 Apparatus and method for increasing bandwidths of stacked dies |
| 02/10/2015 | US8952547 Semiconductor device with contact structure with first/second contacts formed in first/second dielectric layers and method of forming same |
| 02/10/2015 | US8952545 Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof |
| 02/10/2015 | US8952544 Semiconductor device and manufacturing method thereof |
| 02/10/2015 | US8952543 Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices |
| 02/10/2015 | US8952542 Method for dicing a semiconductor wafer having through silicon vias and resultant structures |
| 02/10/2015 | US8952541 Method of fabricating metal-insulator-semiconductor tunneling contacts using conformal deposition and thermal growth processes |
| 02/10/2015 | US8952540 In situ-built pin-grid arrays for coreless substrates, and methods of making same |
| 02/10/2015 | US8952539 Methods for fabrication of an air gap-containing interconnect structure |
| 02/10/2015 | US8952538 Semiconductor device and method for manufacturing the same |
| 02/10/2015 | US8952537 Conductive bump structure with a plurality of metal layers |
| 02/10/2015 | US8952536 Semiconductor device and method of fabrication |
| 02/10/2015 | US8952534 Semiconductor device and semiconductor assembly with lead-free solder |
| 02/10/2015 | US8952533 Devices and methods for 2.5D interposers |
| 02/10/2015 | US8952532 Integrated circuit package with spatially varied solder resist opening dimension |
| 02/10/2015 | US8952531 Packaging method using solder coating ball and package having solder pattern including metal pattern |
| 02/10/2015 | US8952530 Post passivation interconnect structures and methods for forming the same |
| 02/10/2015 | US8952529 Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids |
| 02/10/2015 | US8952528 Semiconductor package and fabrication method thereof |
| 02/10/2015 | US8952527 Semiconductor device and manufacturing method thereof |
| 02/10/2015 | US8952526 Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry |
| 02/10/2015 | US8952525 Semiconductor module and method for manufacturing semiconductor module |
| 02/10/2015 | US8952524 Re-workable heat sink attachment assembly |
| 02/10/2015 | US8952523 Integrated circuit package lid configured for package coplanarity |
| 02/10/2015 | US8952522 Wafer level package and fabrication method |
| 02/10/2015 | US8952521 Semiconductor packages with integrated antenna and method of forming thereof |
| 02/10/2015 | US8952520 Power semiconductor device |
| 02/10/2015 | US8952519 Chip package and fabrication method thereof |