Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1998
09/30/1998EP0867944A2 Compound semiconductor device and method for controlling characteristics of the same
09/30/1998EP0867942A2 Liquid crystal display apparatus
09/30/1998EP0867941A2 An interconnect structure for use in an intergrated circuit
09/30/1998EP0867940A2 An underlayer for an aluminum interconnect
09/30/1998EP0867939A2 Wiring substrate for semiconductor device with externally wired leads
09/30/1998EP0867938A2 Semiconductor device comprising electrode pads and leads
09/30/1998EP0867937A2 Sectional modular lamellar heat dissipator for electronic circuits
09/30/1998EP0867936A2 Semiconductor device having a barrier film for preventing penetration of moisture
09/30/1998EP0867935A2 Plastic package, semiconductor device, and method of manufacturing plastic package
09/30/1998EP0867931A1 Method of forming an oxide layer not wettable by solder
09/30/1998EP0867929A2 Electronic interconnect structure and method for manufacturing it
09/30/1998EP0867525A1 Titanium nitride films
09/30/1998EP0867475A2 Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device
09/30/1998EP0676082B1 Water-based polymer thick film conductive ink
09/30/1998EP0649565B1 Fitting unit for multilayer hybrid circuit with power components
09/30/1998EP0539481B1 Method of producing microchips
09/30/1998CN1194724A 散热器 Heat sink
09/30/1998CN1194693A Microelectronic spring contact element
09/30/1998CN1194468A Semiconductor device with damp-proof separator
09/30/1998CN1194464A Lead frame and method for producing semiconductor device using said lead frame
09/30/1998CN1194463A Semiconductor lead frame with multilayer plated layer and its producing method
09/30/1998CN1194462A Semiconductor device and its producing method
09/30/1998CN1194461A Electronic parts and its producing method
09/30/1998CN1194460A Packaging for stacked semiconductor chip and its producing method
09/30/1998CN1194459A Packaging body of semiconductor device
09/30/1998CN1194458A Spherical lattice semiconductor device shell and its producing technology
09/30/1998CN1194457A Process for producing electronic devices
09/30/1998CA2233603A1 Epoxy resin composition and resin-encapsulated semiconductor device
09/29/1998US5815374 Method and apparatus for redirecting certain input/output connections of integrated circuit chip configurations
09/29/1998US5815372 Electrical arrangement
09/29/1998US5815371 Multi-function heat dissipator
09/29/1998US5815031 High density dynamic bus routing scheme
09/29/1998US5815000 Method for testing semiconductor dice with conventionally sized temporary packages
09/29/1998US5814924 Field emission display device having TFT switched field emission devices
09/29/1998US5814894 Polyimides with ether, sulfone, siloxane copolymers
09/29/1998US5814893 Semiconductor device having a bond pad
09/29/1998US5814892 Semiconductor die with staggered bond pads
09/29/1998US5814891 Flip-chip connecting type semiconductor device
09/29/1998US5814890 Thin-type semiconductor package
09/29/1998US5814889 Intergrated circuit with coaxial isolation and method
09/29/1998US5814888 Semiconductor device having a multilayer wiring and the method for fabricating the device
09/29/1998US5814887 Semiconductor device and production method thereof
09/29/1998US5814886 Semiconductor device having local connections formed by conductive plugs and method of making the same
09/29/1998US5814885 Very dense integrated circuit package
09/29/1998US5814884 Commonly housed diverse semiconductor die
09/29/1998US5814883 Packaged semiconductor chip
09/29/1998US5814882 Seal structure for tape carrier package
09/29/1998US5814881 Stacked integrated chip package and method of making same
09/29/1998US5814880 Thick film copper metallization for microwave power transistor packages
09/29/1998US5814879 Tape carrier device having an adhesive resin overcoat and a polyimide resin-based overcoat
09/29/1998US5814878 Semiconductor device
09/29/1998US5814877 Single layer leadframe design with groundplane capability
09/29/1998US5814876 Semiconductor fuse devices
09/29/1998US5814870 Semiconductor component
09/29/1998US5814848 Oxide film on substrate and polysilicon wires
09/29/1998US5814847 General purpose assembly programmable multi-chip package substrate
09/29/1998US5814560 Forming metal interconnect structures which resists formation of pile-ups caused by electromigration
09/29/1998US5814558 Interconnect capacitance between metal leads
09/29/1998US5814557 Method of forming an interconnect structure
09/29/1998US5814555 Interlevel dielectric with air gaps to lessen capacitive coupling
09/29/1998US5814552 High step process for manufacturing alignment marks for twin-well integrated circuit devices
09/29/1998US5814536 Method of manufacturing powdered metal heat sinks having increased surface area
09/29/1998US5814535 Supporting member for cooling means, electronic package and method of making the same
09/29/1998US5814529 Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor
09/29/1998US5814408 Interwoven mats of fibers of aluminum and graphite
09/29/1998US5814366 Capacitor interposed between green insulator layers; lamination; firing; removing release green sheets
09/29/1998US5814248 Conductive paste composition and method for producing a ceramic substrate
09/29/1998US5814180 Bonding an electrically conductive pressure sensitive adhesive material to a substrate
09/29/1998US5814168 Process for producing high-strength, high-electroconductivity copper-base alloys
09/29/1998US5813881 Programmable cable and cable adapter using fuses and antifuses
09/29/1998US5813870 Selectively filled adhesives for semiconductor chip interconnection and encapsulation
09/29/1998US5813869 IC socket and guide member
09/29/1998US5813664 Back-end capacitor with high unit capacitance
09/29/1998CA2003062C Production and use of coolant in cryogenic devices
09/24/1998WO1998042169A2 Device for dissipating heat from a heat source located in a housing
09/24/1998WO1998042022A1 Semiconductor device and method of manufacturing same
09/24/1998WO1998042009A1 Process for producing semiconductor integrated circuit device
09/24/1998WO1998041802A1 Sorption refrigeration appliance
09/24/1998WO1998041801A1 Electromagnetic wave-activated sorption refrigeration system
09/24/1998WO1998041800A1 Coaxial waveguide applicator for an electromagnetic wave-activated sorption system
09/24/1998WO1998041799A1 Method and apparatus for cooling electrical components
09/24/1998WO1998041354A1 Method of solid-phase welding members
09/24/1998DE19811603A1 Cooler for several electric components on circuit board
09/24/1998DE19811078A1 Semiconductor device with fixed potential isolated island region
09/24/1998DE19754372A1 Chipanordnung und Verfahren zur Herstellung einer Chipanordnung Chip arrangement and method for producing a chip arrangement
09/24/1998DE19711965A1 Vorrichtung zur niederinduktiven Anbindung eines abschaltbaren Thyristors an seine Ansteuereinrichtung Device for connecting a turn-off thyristor low-inductance of his control device
09/24/1998DE19710716A1 Vorrichtung zum Kühlen von elektronischen Bauelementen Apparatus for cooling of electronic components
09/24/1998DE19710207A1 Housing for power electronic components
09/24/1998CA2284982A1 Sorption refrigeration appliance
09/24/1998CA2284908A1 Electromagnetic wave-activated sorption refrigeration system
09/24/1998CA2284907A1 Coaxial waveguide applicator for an electromagnetic wave-activated sorption system
09/24/1998CA2284905A1 Method and apparatus for cooling electrical components
09/23/1998EP0866649A1 Highly heat-conductive composite magnetic material
09/23/1998EP0866500A2 Cooling apparatus or heat sink for electrical devices or circuits and electrical circuit with such a heat sink
09/23/1998EP0866499A2 Silicon-doped titanium wetting layer for aluminum plug
09/23/1998EP0866498A2 Semiconductor device having aluminum contacts or vias and method of manufacture therefor
09/23/1998EP0866494A1 Method for processing semiconductor wafer, method for manufacturing ic card, and carrier
09/23/1998EP0865668A2 Flip-chip process for producing a multi-chip module
09/23/1998EP0728405B1 Device for removing heat dissipated by an electronic or electro-mechanical component
09/23/1998CN1194059A Deformable substrate assembly for adhesively bonded electric device
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