Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1998
10/13/1998CA2117271C Heat sink
10/12/1998WO1998056217A1 Soldering member for printed wiring boards
10/08/1998WO1998044564A1 Chip with internal signal routing in external element
10/08/1998WO1998044561A1 A thermal conducting trench in a semiconductor structure and method for forming the same
10/08/1998WO1998044557A1 High-voltage, high-current multilayer circuit board, method for the production thereof
10/08/1998WO1998044556A1 A low-stress and low-resistivity metal film
10/08/1998WO1998044555A1 Lead frame and semiconductor device made by using it
10/08/1998WO1998044554A1 Folded fin heat sink and fan attachment
10/08/1998WO1998044550A1 Laser-induced cutting of metal interconnect
10/08/1998WO1998044548A1 Method of forming a contact opening adjacent to an isolation trench in a semiconductor substrate
10/08/1998WO1998044547A1 Method for manufacturing semiconductor device
10/08/1998WO1998044546A1 Method to improve adhesion of a thin submicron fluoropolymer film on an electronic device
10/08/1998WO1998044545A1 Method to improve adhesion of a thin submicron fluoropolymer film on an electronic device
10/08/1998WO1998044544A1 Low dielectric constant material with improved dielectric strength
10/08/1998WO1998044451A1 Electronic module for chip card
10/08/1998WO1998044319A1 Circuit board and detector, and method for manufacturing the same
10/08/1998WO1998044307A1 Apparatus and method for cooling an electronic heat source
10/08/1998WO1998021755A3 Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
10/08/1998DE19813767A1 Microwave transceiver module
10/08/1998DE19713984A1 Component for electronic switch
10/08/1998CA2283692A1 Electronic module for chip card
10/07/1998EP0869555A2 Self-aligned contacts for semiconductor integrated circuits and method for producing the same
10/07/1998EP0869553A2 Conductive feedthrough for a ceramic body and method of fabricating same
10/07/1998EP0869548A1 Resin-sealed wireless bonded semiconductor device
10/07/1998EP0869547A2 Semiconductor device and manufacture method thereof
10/07/1998EP0869544A2 Method for depositing a diffusion barrier
10/07/1998EP0869515A1 Composition and process for forming electrically insulating thin films
10/07/1998EP0869140A2 Epoxy resin composition and resin-encapsulated semiconductor device
10/07/1998EP0868778A1 Electronic component, especially one operating with acoustic surface waves (sw component)
10/07/1998EP0868776A1 Electrical component, especially one operating with acoustic surface waves (sw component) and process for its production
10/07/1998EP0868748A1 Electrostatic discharge protection device
10/07/1998EP0868747A1 Electrostatic discharge protection device
10/07/1998EP0868746A1 Reduced pitch laser redundancy fuse bank structure
10/07/1998EP0868744A1 Process for producing contacts on electrical components suitable for a flip-chip assembly
10/07/1998EP0812477A4 An improved laser ablateable material
10/07/1998EP0754350A4 Cavity filled metal electronic package
10/07/1998EP0729644A4 Multi-chip electronic package module utilizing an adhesive sheet
10/07/1998CN2293899Y Radiator for electrical semi-conductor device
10/07/1998CN1195423A Electronic component structure
10/07/1998CN1195422A Method for mounting semiconductor chip
10/07/1998CN1195263A Flexible thin film ball grid array containing solder mask
10/07/1998CN1195262A Process to create metallic stand-offs on electronic circuit
10/07/1998CN1195195A Semiconductor device comprising high density integrated circuit having large number of insulated gate field effect transistors
10/07/1998CN1195194A Metallization in semiconductor devices
10/07/1998CN1195193A Semiconductor device and method of manufacturing same
10/07/1998CN1195192A Semiconductor device and method of fabricating same
10/07/1998CN1195191A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/07/1998CN1195188A Method for depositing diffusion barrier
10/06/1998US5818700 Microelectronic assemblies including Z-axis conductive films
10/06/1998US5818699 Multi-chip module and production method thereof
10/06/1998US5818698 Method and apparatus for a chip-on-board semiconductor module
10/06/1998US5818697 Flexible thin film ball grid array containing solder mask
10/06/1998US5818695 Heat sink and spring clip assembly
10/06/1998US5818694 Cooling apparatus for electronic devices
10/06/1998US5818692 Apparatus and method for cooling an electrical component
10/06/1998US5818114 Radially staggered bond pad arrangements for integrated circuit pad circuitry
10/06/1998US5818113 Semiconductor device
10/06/1998US5818112 Arrangement for capacitive signal transmission between the chip layers of a vertically integrated circuit
10/06/1998US5818111 Low capacitance interconnect structures in integrated circuits using a stack of low dielectric materials
10/06/1998US5818110 Metallization interconnect system
10/06/1998US5818109 Semiconductor integrated circuit device having wiring structure effective against migration and mask mis-alignment and process of fabrication thereof
10/06/1998US5818108 High-density, highly reliable integrated circuit assembly
10/06/1998US5818107 Chip stacking by edge metallization
10/06/1998US5818106 Package
10/06/1998US5818105 Semiconductor device with plastic material covering a semiconductor chip mounted on a substrate of the device
10/06/1998US5818103 Semiconductor device mounted on a grooved head frame
10/06/1998US5818102 System having integrated circuit package with lead frame having internal power and ground busses
10/06/1998US5818095 High-yield spatial light modulator with light blocking layer
10/06/1998US5818094 Package for housing a semiconductor element
10/06/1998US5818087 Electrostatic-discharge protecting circuit and method
10/06/1998US5818071 Silicon carbide metal diffusion barrier layer
10/06/1998US5817987 Circuit board housing with molded in heat tab
10/06/1998US5817582 Process for making a semiconductor device having a TEOS based spin-on-glass
10/06/1998US5817574 Method of forming a high surface area interconnection structure
10/06/1998US5817572 Method for forming multileves interconnections for semiconductor fabrication
10/06/1998US5817555 Method for fabricating capacitor of semiconductor device using hemispherical grain (HSG) polysilicon
10/06/1998US5817544 Enhanced wire-bondable leadframe
10/06/1998US5817543 Method of constructing an integrated circuit memory
10/06/1998US5817541 Methods of fabricating an HDMI decal chip scale package
10/06/1998US5817540 Method of fabricating flip-chip on leads devices and resulting assemblies
10/06/1998US5817535 LOC SIMM and method of fabrication
10/06/1998US5817446 Method of forming airbridged metallization for integrated circuit fabrication
10/06/1998US5817404 Thermoconductivity
10/06/1998US5816473 Method of fabricating electronic circuit device and apparatus for performing the same method
10/06/1998US5816319 Cooling radiator
10/06/1998US5815921 Electronic package cooling system and heat sink with heat transfer assembly
10/01/1998WO1998043297A1 Substrate for semiconductor device, lead frame, semiconductor device and method for manufacturing the same, circuit board, and electronic equipment
10/01/1998WO1998043296A2 Device for low-inductive coupling of a gate turn-off thyristor to its control device
10/01/1998WO1998043295A1 Circuit board and production method thereof
10/01/1998WO1998043290A1 Method for manufacturing semiconductor apparatus, and film carrier tape
10/01/1998WO1998043289A1 Semiconductor device, film carrier tape, and method for manufacturing them
10/01/1998WO1998043288A1 Semiconductor device and method for manufacturing the same
10/01/1998WO1998043286A1 Tunable dielectric constant oxide and method of manufacture
10/01/1998WO1998043205A1 Method for making a contactless card with antenna connected with soldered wires
10/01/1998WO1998030913A3 A fiducial for aligning an integrated circuit die
10/01/1998WO1998029899A3 Improved leadframe structure with locked inner leads and process for manufacturing same
10/01/1998DE19750919A1 Semiconductor device e.g. DRAM
10/01/1998DE19742360A1 Stackable side-insulated semiconductor chip
10/01/1998DE19712723A1 Electronic component cooler
10/01/1998CA2283689A1 Method for making a contactless card with antenna connected with soldered wires
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