Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1998
10/20/1998US5825068 Integrated circuits that include a barrier layer reducing hydrogen diffusion into a polysilicon resistor
10/20/1998US5825054 Plastic-molded apparatus of a semiconductor laser
10/20/1998US5825042 Radiation shielding of plastic integrated circuits
10/20/1998US5824964 Circuit board for a semiconductor device and method of making the same
10/20/1998US5824951 Electronic part comprising a casing with a narrow groove formed in the casing
10/20/1998US5824950 To be secured to a printed circuit board
10/20/1998US5824598 Correcting defects
10/20/1998US5824597 Method of forming contact hole plug
10/20/1998US5824571 Multi-layered contacting for securing integrated circuits
10/20/1998US5824569 Semiconductor device having ball-bonded pads
10/20/1998US5824568 Process of making an integrated circuit chip composite
10/20/1998US5824186 Method and apparatus for fabricating self-assembling microstructures
10/20/1998US5824182 Adhesive tapes
10/20/1998US5823794 IC pressing rotating lever mechanism IC socket
10/20/1998US5823249 Manifold for controlling interdigitated counterstreaming fluid flows
10/20/1998US5823248 Cooling apparatus using boiling and condensing refrigerant
10/20/1998US5823005 Focused air cooling employing a dedicated chiller
10/20/1998US5822851 Method of producing a ceramic package main body
10/20/1998US5822848 Lead frame having a detachable and interchangeable die-attach paddle
10/20/1998US5822847 IC mounting/demounting system and a mounting/demounting head therefor
10/15/1998WO1998046059A1 Temperature control system for an electronic device
10/15/1998WO1998045921A1 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
10/15/1998WO1998045881A1 Substrate with conductor formed of low-resistance aluminum alloy
10/15/1998WO1998045880A1 Low dielectric constant material for use as an insulation element in an electronic device
10/15/1998WO1998045878A1 Method and covering element for encapsulating electronic components
10/15/1998WO1998045867A2 Unit for switching electrical energy
10/15/1998WO1998045861A1 Subassembly for switching electric energy
10/15/1998WO1998028954A3 Semiconductor packages interconnectably mounted on underlying substrates and methods of producing same
10/15/1998DE19714659A1 Opto-electronic component insensitive to local temperature variations
10/15/1998CA2256378A1 Substrate with conductor formed of low-resistance aluminum alloy
10/14/1998EP0871352A1 Integrated circuit device cooling structure
10/14/1998EP0871222A2 Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module
10/14/1998EP0871221A1 Filter capacitor for power bus
10/14/1998EP0871220A2 Pin usage of a semiconductor package
10/14/1998EP0871219A2 Metal-based semiconductor circuit substrates
10/14/1998EP0870851A2 Methods and apparatus for minimizing excess aluminum accumulation in CVD chambers
10/14/1998EP0870805A2 Epoxy composition for printed circuit boards
10/14/1998EP0870627A1 Semiconductor device
10/14/1998EP0870328A1 Rectifier diode
10/14/1998EP0870325A1 Microelectronic mounting with multiple lead deformation
10/14/1998EP0870324A1 Semiconductor structure using modulation doped silicate glasses
10/14/1998EP0870181A1 Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays
10/14/1998EP0776343B1 Use of polyurethanes with improved resistance to tear propagation as sealants
10/14/1998EP0734586A4 Method for fabricating self-assembling microstructures
10/14/1998EP0712534B1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits
10/14/1998CN1195963A Apparatus for heat removal using flexible backplane
10/14/1998CN1195889A Method for making self-aligning silicide
10/14/1998CN1195888A Semiconductor device and manufacture method thereof
10/14/1998CN1195887A Flexible tape substrate for semiconductor chip package and method of manufacturing such package
10/13/1998US5822214 CAD for hexagonal architecture
10/13/1998US5822191 Integrated circuit mounting tape
10/13/1998US5822190 Card type memory device and a method for manufacturing the same
10/13/1998US5821797 Protection circuit for semiconductor devices
10/13/1998US5821765 Apparatus for detecting defect sizes in polysilicon and source-drain semiconductor devices and method for making the same
10/13/1998US5821763 For probing an electronic device
10/13/1998US5821762 Semiconductor device, production method therefor, method for testing semiconductor elements, test substrate for the method and method for producing the test substrate
10/13/1998US5821628 Semiconductor device and two-layer lead frame for it
10/13/1998US5821626 Film carrier, semiconductor device using same and method for mounting semiconductor element
10/13/1998US5821625 Structure of chip on chip mounting preventing from crosstalk noise
10/13/1998US5821621 Low capacitance interconnect structure for integrated circuits
10/13/1998US5821620 Semiconductor interconnectors comprising a stable diffusion barrier titanium tungsten nitride layer; high temperature, high current, adhesion, corrosion resistance
10/13/1998US5821619 Replaceable power module
10/13/1998US5821618 Semiconductor component with insulating housing
10/13/1998US5821617 For use with large area silicon semiconductor device; ceramic frame, solid metal pads which closely match the coefficient of silicon; low cost, simplification, reliability
10/13/1998US5821616 Power MOS device chip and package assembly
10/13/1998US5821615 Semiconductor chip package having clip-type outlead and fabrication method of same
10/13/1998US5821614 Card type semiconductor device
10/13/1998US5821613 Chips having the bottom leaned of organic contaminants with ultraviolet radiation to improve adhesion to resin mold; less likely to crack under heat stress
10/13/1998US5821612 Electronic device protected by ceramic plate for radiating heat generated by the device, the ceramic partially coated with resin to resist breakage
10/13/1998US5821611 Semiconductor device and process and leadframe for making the same
10/13/1998US5821610 Leadframe allowing easy removal of tie bars in a resin-sealed semiconductor device
10/13/1998US5821609 Semiconductor connection component with frangible lead sections
10/13/1998US5821608 Laterally situated stress/strain relieving lead for a semiconductor chip package
10/13/1998US5821606 Semiconductor device
10/13/1998US5821605 LOC semiconductor package
10/13/1998US5821604 Integrated circuit device having shield structure against electromagnetic wave
10/13/1998US5821590 Prevents increase of contact resistance
10/13/1998US5821587 Semiconductor device
10/13/1998US5821582 Structures for preventing reverse engineering of integrated circuits
10/13/1998US5821505 Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink
10/13/1998US5821457 Semiconductor die carrier having a dielectric epoxy between adjacent leads
10/13/1998US5821455 Lid with variable solder layer for sealing semiconductor package, package having the lid and method for producing the lid
10/13/1998US5821181 Having low dielectric constant, small electrical loss, adjustable coefficient of resonance frequency
10/13/1998US5821174 Forming a chromium oxide layer on silicon nitride by physical vapor deposition to releive the compression stress of silicon nitride and prevent cracks from occurring
10/13/1998US5821169 Hard mask method for transferring a multi-level photoresist pattern
10/13/1998US5821162 Method of forming multi-layer wiring utilizing SOG
10/13/1998US5821161 For sealing semiconductor substrates to caps
10/13/1998US5821159 Thin film transistor substrate having low resistive and chemical resistant electrode interconnections and method of forming the same
10/13/1998US5821154 Plated heat sink structure; gold layer, gallium arsenide substrate, tungsten layer
10/13/1998US5821140 Method of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cells
10/13/1998US5820972 Resistance against electrical discharge; insulating layer with flaky inorganic filler in organic insulating material
10/13/1998US5820965 Computer disk substrate, the process for making same, and the material made thereof
10/13/1998US5820923 For use with temperature sensitive substrates such as dielectrics and electronics; lowered temperature processing
10/13/1998US5820721 Manufacturing particles and articles having engineered properties
10/13/1998US5819858 Circuit board having a metal matrix composite inlay
10/13/1998US5819407 Method of joining together a pair of members each having a high thermal conductivity
10/13/1998US5819403 Method of manufacturing a semiconductor chip carrier
10/13/1998US5819402 Method for cooling of chips using blind holes with customized depth
10/13/1998US5819398 Method of manufacturing a ball grid array package
10/13/1998CA2126291C Cooling apparatus for integrated circuit chips
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