Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1998
10/28/1998CN1197290A 半导体器件 Semiconductor devices
10/28/1998CN1197287A Circuit board for screening detection and mfg. method of known qualified tube core
10/28/1998CN1197286A Dual modes microwave/mm wave integrated circuit sealing pack
10/28/1998CN1196984A Intermediate material for producing dual gauge strip and method for producing the same and method for producing dual gauge strip
10/27/1998US5828564 Rectifier heat dissipation
10/27/1998US5828553 CPU heat sink fastener
10/27/1998US5828551 Heat sink apparatus for an electronic component
10/27/1998US5828550 Heat dissipating fan/integrated circuit assemblies
10/27/1998US5828549 Computer
10/27/1998US5828308 Current sensing circuit formed in narrow area and having sensing electrode on major surface of semiconductor substrate
10/27/1998US5828134 Metallization to improve electromigration resistance
10/27/1998US5828132 Semiconductor device having perfluorinated and non-fluorinated parylene intermetal dielectric
10/27/1998US5828130 Selectively deposited tungsten/doped polysilicon composite landing pad overlaying and electrically connecting active region; good etch stop; barrier to aluminum/silicon interdiffusion
10/27/1998US5828128 Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device
10/27/1998US5828127 Semiconductor substate with improved thermal conductivity
10/27/1998US5828126 Package for containing an integrated circuit die within a central cavity
10/27/1998US5828125 Ultra-high density warp-resistant memory module
10/27/1998US5828122 Semiconductor body with a substrate glued to a support body
10/27/1998US5828121 Multi-level conduction structure for VLSI circuits
10/27/1998US5828102 Multiple finger polysilicon gate structure and method of making
10/27/1998US5828097 Semiconductor memory device with a stacked capacitance structure
10/27/1998US5828096 Semiconductor device having a contact hole
10/27/1998US5828093 Ceramic capacitor and semiconductor device in which the ceramic capacitor is mounted
10/27/1998US5828081 Integrated semiconductor device
10/27/1998US5828078 Electrostatic discharge protection using high temperature superconductors
10/27/1998US5828010 Connection of electrically conducting layers with ceramic prominences
10/27/1998US5828000 Semiconductor device with heat radiating plate and positioning dummy lead and lead frame therefor
10/27/1998US5827999 Thermoplastic liquid crystal polymer and polyphenylene sulfide circuit substrate, moisture proof casing
10/27/1998US5827780 Additive metalization using photosensitive polymer as RIE mask and part of composite insulator
10/27/1998US5827778 Method of manufacturing a semiconductor device using a silicon fluoride oxide film
10/27/1998US5827777 Method of making a barrier metal technology for tungsten plug interconnection
10/27/1998US5827776 Method of making an integrated circuit which uses an etch stop for producing staggered interconnect lines
10/27/1998US5827770 Method of making a semiconductor device having improved contacts to a thin conductive layer
10/27/1998US5827759 Depositing dielectric layer between integrated circuits, etching layer to form spacers, depositing electroconductive material in between spacers, etching central portion of material forming u-shape
10/27/1998US5826645 Apparatus for removing heat from an integrated circuit
10/27/1998US5826643 In an electronic assembly
10/27/1998US5826328 Method of making a thin radio frequency transponder
10/27/1998CA2081222C Method for production of microcapsule type conductive filler
10/27/1998CA2004137C Antistatic sheet material, package and method of making
10/24/1998CA2235909A1 Coated endovascular stent
10/22/1998WO1998047331A1 Wiring board, wiring board fabrication method, and semiconductor package
10/22/1998WO1998047326A1 Wiring board having vias
10/22/1998WO1998047179A1 Printed wiring board and method for manufacturing the same
10/22/1998WO1998047177A1 Nanoporous dielectric films with graded density and process for making such films
10/22/1998WO1998047174A1 Mold, device, and method for molding laminated element
10/22/1998WO1998046686A1 Coatings based on hyaluronic acid and the derivatives thereof for the protection of electronic parts from external agents
10/22/1998WO1998046457A1 Storage system and corresponding operating method, robot and control unit
10/22/1998WO1998020531A3 Method for forming a through-via in a laminated substrate
10/22/1998DE19817558A1 Base layer structure for covering hole in semiconductor insulation layer
10/22/1998DE19816489A1 Testing the filter efficiency of fabrics used in Clean Rooms
10/22/1998DE19752663A1 Wafer identification device
10/22/1998DE19745387A1 Semiconductor acceleration detector
10/22/1998DE19744818A1 Signal testing apparatus for large circuits - has cell chain operating in normal mode to supply analog- digital signal to digital circuit and digital-analog signal to analog circuit and in test mode analog circuit is decoupled from digital circuit
10/22/1998DE19716343A1 Elektrische Spannungsquelle für Halbleiterbauelemente Electrical voltage source for semiconductor devices
10/22/1998DE19716102A1 Integrierte Schaltungsanordnung mit mehreren Bauelementen und Verfahren zu deren Herstellung Integrated circuit arrangement with several devices and methods for their preparation
10/22/1998DE19716012A1 Surface-mounted electronic component
10/22/1998DE19715739A1 Semiconductor component using lead-on-chip technique
10/22/1998DE19715592A1 Kühlvorrichtung für einen Elektronikbaustein Cooling device for an electronic component
10/22/1998DE19649458A1 Solder precise positioning method for semiconductor chip fixing to circuit board
10/21/1998EP0872890A1 High frequency module
10/21/1998EP0872889A2 Housing for electronic components
10/21/1998EP0872888A2 Ball grid array module
10/21/1998EP0872887A2 Multilevel interconnection structure having an air gap between interconnects
10/21/1998EP0872886A2 Plastic-encapsulated semiconductor device and fabrication method thereof
10/21/1998EP0872882A2 Method of fabricating a curved metal-ceramic-substrate
10/21/1998EP0872879A1 Process of final passivation of an integrated circuit device
10/21/1998EP0872532A1 Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronics parts
10/21/1998EP0872531A1 Method for producing heat-conductive and pressure-sensitive adhesive sheets
10/21/1998CN1196869A Microelectronic lead structures with dielectric layers
10/21/1998CN1196788A Absorbent pair refrigeration system
10/21/1998CN1196576A Plastic-encapsulated semiconductor device and fabrication method thereof
10/21/1998CN1196484A Method and apparatus for testing filtration efficiency of cloth material intended for use in clean room environment
10/21/1998CN1040385C Mass simultaneous sealing and electrical connection of electronic devices
10/20/1998US5825632 Oxides of silicon, boron and alkali metal
10/20/1998US5825629 Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment
10/20/1998US5825628 Electronic package with enhanced pad design
10/20/1998US5825625 Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
10/20/1998US5825624 Electronic device
10/20/1998US5825623 Packaging assemblies for encapsulated integrated circuit devices
10/20/1998US5825622 For removing heat from an electronic device package
10/20/1998US5825450 Liquid crystal display device
10/20/1998US5825437 Controlling the number of hillock defects
10/20/1998US5825268 Device with a nonradiative dielectric waveguide
10/20/1998US5825120 Electronic component
10/20/1998US5825092 Integrated circuit with an air bridge having a lid
10/20/1998US5825091 Sensor assembly mounted to a leadframe with adhesive deposits at separate locations
10/20/1998US5825090 High power semiconductor device and method of making same
10/20/1998US5825089 Low thermal resistance spring biased RF semiconductor package mounting structure
10/20/1998US5825088 Low thermal resistance semiconductor package and mounting structure
10/20/1998US5825087 Integral mesh flat plate cooling module
10/20/1998US5825086 Hermetic heat sealing
10/20/1998US5825085 Power semiconductor device, armoring case thereof and method for manufacturing the same
10/20/1998US5825084 Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices
10/20/1998US5825083 Semiconductor device
10/20/1998US5825082 Semiconductor device in which a first resin-encapsulated package is mounted on a second resin-encapsulated package
10/20/1998US5825081 Tape carrier and assembly structure thereof
10/20/1998US5825080 Semiconductor device provided with surface grounding conductor for covering surfaces of electrically insulating films
10/20/1998US5825078 Hermetic protection for integrated circuits
10/20/1998US5825077 Interconnect decoupling scheme
10/20/1998US5825072 Circuits for ESD Protection of metal to-metal antifuses during processing
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