Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1998
11/04/1998EP0875929A2 Planarisation of an interconnect structure
11/04/1998EP0875928A2 Metallization in semiconductor devices
11/04/1998EP0875923A2 Multilayer metallization structure comprising a group IVA metal
11/04/1998EP0875905A1 Low dielectric constant composite film for integrated circuits of an inorganic aerogel and an organic filler grafted to the inorganic material and method of fabrication
11/04/1998EP0875331A2 Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate
11/04/1998EP0875075A1 Shaftless roller for lead forming apparatus
11/04/1998CN2296579Y 芯片连接器 Chip connector
11/04/1998CN2296578Y 芯片连接器 Chip connector
11/04/1998CN1198252A Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions
11/04/1998CN1198243A Conductor paste and multi-layer ceramic part using the same
11/04/1998CN1198229A 芯片模块 Chip Module
11/04/1998CN1198028A 半导体装置 Semiconductor device
11/04/1998CN1198016A Circuit and method for providing interconnections among individual integrated circuit chips in multi-chip module
11/04/1998CN1198015A Multilevel interconnecting structure in semiconductor device and method of forming the same
11/04/1998CN1198014A Semiconductor device and fabrication process thereof
11/04/1998CN1198013A Semiconductor device and method of fabricating the same
11/04/1998CN1198012A Bonding structure to semiconductor chip and semiconductor device having the same
11/04/1998CN1198011A Semiconductor device free from short-circuit between bump electrodes and separation from circuit board and process of fabrication thereof
11/04/1998CN1198010A Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device
11/04/1998CN1198009A Semiconductor device package having end-fach halved through-holes and inside-area through-holes
11/04/1998CN1198006A Check pattern for via-hole opening examination
11/04/1998CN1198005A Semiconductor package and method of manufacturing the same
11/04/1998CN1198004A Bead array type IC package method without base and tin bead
11/04/1998CN1198002A Semiconductor device capable of having amorphous carbon flooride film of low dielectric constant as interlayer insulation material and method of manufacturing the same
11/04/1998CN1198000A Method of manufacturing semiconductor device
11/04/1998CN1197996A Solder alloy and their use
11/04/1998CN1197968A Anti-tamper integrated circuit
11/03/1998US5832207 Secure module with microprocessor and co-processor
11/03/1998US5831836 Power plane for semiconductor device
11/03/1998US5831833 Bear chip mounting printed circuit board and a method of manufacturing thereof by photoetching
11/03/1998US5831832 Molded plastic ball grid array package
11/03/1998US5831829 Heat dissipating device for central processing units
11/03/1998US5831828 Flexible circuit board and common heat spreader assembly
11/03/1998US5831827 Token shaped module for housing an electronic circuit
11/03/1998US5831825 Integrated circuit IC package and a process for cooling an integrated circuit mounted in an IC package
11/03/1998US5831810 Electronic component package with decoupling capacitors completely within die receiving cavity of substrate
11/03/1998US5831446 Process monitor test chip and methodology
11/03/1998US5831337 Vertical-type transistor device, having a bump electrode that has a shape with no interior angle exceeding 270°
11/03/1998US5831335 Semiconductor device contains refractory metal or metal silicide with less than 1% weight of halogen atom
11/03/1998US5831333 Method of controlling the junction temperature of a semiconductor chip
11/03/1998US5831332 Semiconductor package for surface mounting
11/03/1998US5831331 Self-shielding inductor for multi-layer semiconductor integrated circuits
11/03/1998US5831330 Die seal structure for a semiconductor integrated circuit
11/03/1998US5831325 In an integrated circuit
11/03/1998US5831324 Electromagnetic wave suppression method in a semiconductor manufacturing process
11/03/1998US5831312 Electrostic discharge protection device comprising a plurality of trenches
11/03/1998US5831300 Semiconductor integrated circuit device including a memory device having memory cells with increased information storage capacitance and method of manufacturing same
11/03/1998US5831295 Current confinement via defect generator and hetero-interface interaction
11/03/1998US5831291 Semiconductor device
11/03/1998US5831281 Thin film transistor
11/03/1998US5831247 Apparatus and method for producing an electronic component provided with bumps
11/03/1998US5831219 Joint structure for multilayer interconnections
11/03/1998US5830803 Method for filling contact holes using a doctor blade
11/03/1998US5830800 Packaging method for a ball grid array integrated circuit without utilizing a base plate
11/03/1998US5830799 Method for forming embedded diffusion layers using an alignment mark
11/03/1998US5830782 Microelectronic element bonding with deformation of leads in rows
11/03/1998US5830771 Manufacturing method for semiconductor device
11/03/1998US5830570 Aluminum nitride substrate and process for preparation thereof
11/03/1998US5830565 High planarity and low thermal coefficient of expansion base for semi-conductor reliability screening
11/03/1998US5830389 Electrically conductive compositions and methods for the preparation and use thereof
11/03/1998US5830376 Topographical selective patterns
11/03/1998US5829516 Liquid cooled heat sink for cooling electronic components
11/03/1998US5829514 Bonded cast, pin-finned heat sink and method of manufacture
11/03/1998US5829512 Heatsink and method of forming a heatsink
11/03/1998US5829128 Method of mounting resilient contact structures to semiconductor devices
11/03/1998US5829125 Wireless bonding method
11/03/1998CA2135508C Method for forming solder balls on a semiconductor substrate
10/1998
10/29/1998WO1998048602A1 Ball grid array package assembly including stand-offs
10/29/1998WO1998048463A1 Electric supply source for semiconductor components
10/29/1998WO1998048461A1 Integrated circuit package
10/29/1998WO1998048459A1 Integrated circuit with several components and method for the production thereof
10/29/1998WO1998048458A1 Ball grid array package employing solid core solder balls
10/29/1998WO1998048449A2 Flip chip and chip scale package
10/29/1998WO1998047968A1 Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device
10/29/1998WO1998047944A1 Organohydridosiloxane resins with high organic content
10/29/1998WO1998047941A1 Synthesis of siloxane resins
10/29/1998DE19818452A1 Resin coated substrate socket
10/29/1998DE19818276A1 Semiconductor photocoupler with integrated phototransmitter and photodetector
10/29/1998DE19817484A1 Iron-nickel alloy sheet with excellent surface properties and etchability
10/29/1998DE19811042A1 Semiconductor component with via structure
10/29/1998DE19743271C1 Metallic fuse segment linear arranging method, e.g. for integrated circuit and memory
10/29/1998DE19728281C1 Two-chip power integrated circuit with improved short circuit characteristics
10/29/1998DE19727912C1 Cooling body for cooling power components
10/29/1998DE19725843C1 Aluminium-electrolyte capacitor for AC operation
10/29/1998DE19717550A1 Flat bus=bar packet for transistorised rectifier apparatus
10/29/1998DE19716946A1 Heat-producing component to circuit board contacting method
10/28/1998EP0874539A2 Pivotable support and heat sink apparatus removably connectable without tools to a computer processor
10/28/1998EP0874415A2 High-frequency package
10/28/1998EP0874401A2 Semiconductor device having a protective wiring layer
10/28/1998EP0874400A1 Semiconductor device
10/28/1998EP0874399A1 Silicon nitride circuit board and semiconductor module
10/28/1998EP0874398A2 Semiconductor integrated circuit
10/28/1998EP0874395A2 Methods and apparatus for detecting pattern dependent charging on a workpiece in a plasma processing system
10/28/1998EP0874369A2 Semiconductor device comprising a UV-light shielding layer
10/28/1998EP0645816B1 Semiconductor device comprising a plurality of semiconductor elements
10/28/1998CN1197546A Resin-encapsulated semiconductor device and method of mfg. the same
10/28/1998CN1197514A Microelectronic contact structure and method of making same
10/28/1998CN1197293A Semiconductor device
10/28/1998CN1197292A Semiconductor device, lead frame, and lead bonding
10/28/1998CN1197291A Semiconductor device having metal alloy for electrodes
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