Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1998
11/11/1998EP0877423A2 Integrated circuit package
11/11/1998EP0877422A1 Dual-level metalization method for integrated circuit ferroelectric devices
11/11/1998EP0877421A2 Sputter deposition and annealing of copper alloy metallization M
11/11/1998EP0877419A2 Methods of electroplating solder bumps of uniform height on integrated circuit substrates
11/11/1998EP0859686A4 Fabricating interconnects and tips using sacrificial substrates
11/11/1998EP0809779A4 Heat sink assemblies
11/11/1998CN1198840A Method for transferring conductor pattern to film carrier, mask used for the method and film carrier
11/11/1998CN1198839A Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
11/11/1998CN1198594A 多芯片模块 A multi-chip module
11/11/1998CN1198593A 多芯片模块 A multi-chip module
11/11/1998CN1198592A Semiconductor device
11/11/1998CN1198587A Improved substrate structure for covering holes in semiconductor device and forming method thereof
11/10/1998US5835988 Packed semiconductor device with wrap around external leads
11/10/1998US5835987 Semiconductor substrate
11/10/1998US5835553 Semiconductor integrated circuit having a digital temperature sensor circuit
11/10/1998US5835395 Eprom pinout option
11/10/1998US5835355 Electronic package
11/10/1998US5835352 Power amplifying module
11/10/1998US5835348 Heat sink for a portable information processing apparatus
11/10/1998US5835347 CPU heat dissipating device
11/10/1998US5835337 Stacked capacitor having a corrugated electrode
11/10/1998US5834850 Encapsulated semiconductor device having metal foil covering, and metal foil
11/10/1998US5834849 High density integrated circuit pad structures
11/10/1998US5834848 Electronic device and semiconductor package
11/10/1998US5834847 Completely buried contact holes
11/10/1998US5834846 Semiconductor device with contact structure and method of manufacturing the same
11/10/1998US5834845 For connecting conductive regions to conductive regions
11/10/1998US5834844 Semiconductor device having an element with circuit pattern thereon
11/10/1998US5834843 Multi-chip semiconductor chip module
11/10/1998US5834842 Semiconductor device, semiconductor module, and radiating fin
11/10/1998US5834841 Semiconductor device enabling temperature control in the chip thereof
11/10/1998US5834840 Net-shape ceramic processing for electronic devices and packages
11/10/1998US5834839 Preserving clearance between encapsulant and PCB for cavity-down single-tier package assembly
11/10/1998US5834837 Semiconductor package having leads with step-shaped dimples
11/10/1998US5834836 Multi-layer bottom lead package
11/10/1998US5834835 Semiconductor device having an improved structure for storing a semiconductor chip
11/10/1998US5834833 Electrical component having a selective cut-off conductor
11/10/1998US5834832 Packing structure of semiconductor packages
11/10/1998US5834831 Semiconductor device with improved heat dissipation efficiency
11/10/1998US5834830 LOC (lead on chip) package and fabricating method thereof
11/10/1998US5834829 Energy relieving crack stop
11/10/1998US5834825 Semiconductor device having spiral wiring directly covered with an insulating layer containing ferromagnetic particles
11/10/1998US5834824 Use of conductive particles in a nonconductive body as an integrated circuit antifuse
11/10/1998US5834822 Image sensor
11/10/1998US5834821 Triangular semiconductor "AND" gate device
11/10/1998US5834809 MIS transistor semiconductor device
11/10/1998US5834802 Metal semiconductor field effect transistors having improved intermodulation distortion using different pinch-off voltages
11/10/1998US5834795 Test pattern for measuring line width of electrode and method for measuring the same
11/10/1998US5834691 Lead frame, its use in the fabrication of resin-encapsulated semiconductor device
11/10/1998US5834689 Improved heat transfer and wear resistance, used for packaging for housing electronic device
11/10/1998US5834405 Superconducting multilayer ceramic substrate
11/10/1998US5834374 Method for controlling tensile and compressive stresses and mechanical problems in thin films on substrates
11/10/1998US5834370 Manufacture of semiconductor device containing polycide electrode
11/10/1998US5834369 Marginless patterning process for forming metal interconnect layer
11/10/1998US5834367 Simplified process; time required for burying the contact holes is greatly reduced without remarkably increasing the contact resistance between the barrier metal layer and the lower wiring layer and the buried conductive substances
11/10/1998US5834366 Method for fabricating microbump interconnect for bare semiconductor dice
11/10/1998US5834365 Method of forming a bonding pad
11/10/1998US5834364 Method of implementing of a reference sample for use in a device for characterizing implanted doses
11/10/1998US5834340 Plastic molded semiconductor package and method of manufacturing the same
11/10/1998US5834339 Electrically connecting contact pads on semiconductor chip to bond pads on printed circuit, forming gap, sealing gap with fluid curable encapsulant, applying uniform pressure to cause encapsulant to flow into gap, curing
11/10/1998US5834338 Chip carrier semiconductor device assembly and a method for forming the same
11/10/1998US5834337 Integrated circuit heat transfer element and method
11/10/1998US5834336 Backside encapsulation of tape automated bonding device
11/10/1998US5834335 Non-metallurgical connection between an integrated circuit and a circuit board or another integrated circuit
11/10/1998US5834334 Method of forming a multi-chip module from a membrane circuit
11/10/1998US5834323 Method of modification and testing flip-chips
11/10/1998US5834320 Method of assembling a semiconductor device using a magnet
11/10/1998US5834162 Process for 3D chip stacking
11/10/1998US5834115 Metal and carbonaceous materials composites
11/10/1998US5834106 Ceramic substrate and producing process thereof, and a suction carrier for wafers using a ceramic wafer-chucking substrate
11/10/1998US5834101 Heat resistance, resistance against electrical discharge
11/10/1998US5833783 Lead frame taping apparatus and taping method
11/10/1998US5833759 Method for preparing vias for subsequent metallization
11/10/1998US5833746 Used in resin compositions for encapsulating semiconductors, high loading and high flowability without lowering strength of encapsulating compound
11/10/1998US5833128 Flux-free contacting of components
11/10/1998US5832989 Cooling apparatus using boiling and condensing refrigerant
11/10/1998US5832986 Heat exchanger
11/10/1998US5832963 Shaftless roller for lead forming apparatus
11/10/1998US5832601 Method of making temporary connections between electronic components
11/10/1998US5832600 Method of mounting electronic parts
11/10/1998US5832598 Method of making microwave circuit package
11/10/1998US5832596 Method of making multiple-bond shelf plastic package
11/10/1998US5832595 Method of modifying conductive lines of an electronic circuit board and its apparatus
11/07/1998CA2236693A1 Laser sub-mount
11/05/1998WO1998049727A1 Radio frequency electronic device for regulating an amount of power
11/05/1998WO1998049726A1 Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device
11/05/1998WO1998049724A1 Process for manufacturing semiconductor device
11/05/1998WO1998049722A1 Capacitors in integrated circuits
11/05/1998WO1998049718A2 Method of manufacturing a semiconductor device with a multilayer wiring
11/05/1998WO1998031202A3 Integral lid/clamp for high power transistor
11/05/1998DE19818286A1 Intermediate, semi-finished material for double standard strip
11/05/1998DE19717791A1 MOSFET for testing voltage strength of wafer containing transistors
11/05/1998DE19717152A1 Production of sharp-edged polyimide patterns on silicon chips
11/05/1998DE19710659A1 Securing position of electrically coupled materials
11/05/1998CA2287983A1 Capacitors in integrated circuits
11/04/1998EP0875936A2 Wiring substrate having vias
11/04/1998EP0875935A2 Semiconductor device having a projecting electrode
11/04/1998EP0875934A2 System and method for reinforcing a bond pad
11/04/1998EP0875933A2 Thermal interface pad assembly
11/04/1998EP0875932A2 Semi-conductor substrates and methods
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