Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1998
11/24/1998CA2089791C Electronic devices having metallurgies containing copper-semiconductor compounds
11/24/1998CA2064922C Tapering sidewalls of via holes
11/24/1998CA2064784C Capacitor laminate for printed circuit board
11/19/1998WO1998052397A1 A flat fan heat exchanger
11/19/1998WO1998052396A1 Heat exchanger for electronic components and electrotechnical installation
11/19/1998WO1998052226A1 Method and apparatus for identifying integrated circuits
11/19/1998WO1998052225A1 An electronic component package with posts on the active surface
11/19/1998WO1998052224A1 Lithographically defined microelectronic contact structures
11/19/1998WO1998052223A1 Method and apparatus for cooling a semiconductor die
11/19/1998WO1998052222A1 Integrated passive components and package with posts
11/19/1998WO1998052221A1 Power semiconductor module with ceramic substrate
11/19/1998WO1998052220A1 Process for manufacturing semiconductor package and circuit board assembly
11/19/1998WO1998052217A2 Method of forming a chip scale package, and a tool used in forming the chip scale package
11/19/1998WO1998052111A1 Voltage regulating circuit for eliminating 'latch-up
11/19/1998DE19750918A1 Semiconductor device especially DRAM cell
11/19/1998DE19747578A1 Semiconductor chip with carrier device and supply frame
11/19/1998DE19740946A1 Semiconductor chip and housing arrangement for memory device
11/19/1998DE19740004A1 Bond wire for semiconductor device contact terminal
11/19/1998DE19738922A1 Integrated circuit leadframe assembly device e.g. for chip mounting
11/19/1998DE19731090C1 Thin film transistor active matrix production
11/19/1998DE19719909A1 Dual damascene process for integrated circuits
11/19/1998CA2289935A1 Voltage regulating circuit for eliminating "latch-up"
11/18/1998EP0878987A1 Printed circuit board
11/18/1998EP0878846A2 Temperature protection element
11/18/1998EP0878845A2 Structure for absorption of hydrogen in a package
11/18/1998EP0878844A2 High frequency apparatus including a low loss substrate
11/18/1998EP0878839A1 Semiconductor unit package and semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
11/18/1998EP0878752A1 Voltage regulation circuit for suppressing the "latch-up" effect
11/18/1998EP0878025A1 Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
11/18/1998EP0878024A1 Adaptable mmic array
11/18/1998EP0878023A1 Contact bump structure and method for fabricating contact bumps
11/18/1998EP0877762A1 Dual-curing coating formulation and method
11/18/1998EP0811245A4 Microelectronic assemblies including z-axis conductive films
11/18/1998EP0800706B1 Forming polyimide and polyimidesiloxane coatings by screen printing
11/18/1998EP0780005B1 Ic support element
11/18/1998EP0697018B1 Process for the preparation of glycidyl esters for use in electronics adhesives
11/18/1998CN2297802Y Automobile transistorized regulator
11/18/1998CN1199506A Integrated circuit comprising substrate and wiring layer with buffer layer between substrate and wiring layer
11/18/1998CN1199505A Solderable transistor clip and heat sink
11/18/1998CN1199504A Glass/metal package and method for producing same
11/18/1998CN1199494A EMI preventive part and active device with same
11/18/1998CN1199241A Semiconductor integrated circuit
11/18/1998CN1199104A Method and apparatus for plating lead frame
11/17/1998US5838951 Wafer map conversion method
11/17/1998US5838551 Electronic package carrying an electronic component and assembly of mother board and electronic package
11/17/1998US5838546 Mounting structure for a semiconductor circuit
11/17/1998US5838545 High performance, low cost multi-chip modle package
11/17/1998US5838543 Radio frequency power amplification module
11/17/1998US5838542 Processor card assembly including a heat sink attachment plate and an EMI/ESD shielding cage
11/17/1998US5838434 For calibration of semiconductor package outlines
11/17/1998US5838361 Laser marking techniques
11/17/1998US5838072 Intrachip power distribution package and method for semiconductors having a supply node electrically interconnected with one or more intermediate nodes
11/17/1998US5838069 Ceramic substrate having pads to be attached to terminal members with Pb-Sn solder and method of producing the same
11/17/1998US5838068 Integrated circuitry with interconnection pillar
11/17/1998US5838067 Connecting device for connecting a semiconductor chip to a conductor
11/17/1998US5838066 Miniaturized cooling fan type heatsink for a semiconductior device
11/17/1998US5838065 Integrated thermal coupling for heat generating device
11/17/1998US5838064 For cooling an electronic device
11/17/1998US5838063 Method of increasing package reliability using package lids with plane CTE gradients
11/17/1998US5838062 For a semiconductor chip package
11/17/1998US5838061 Semiconductor package including a semiconductor chip adhesively bonded thereto
11/17/1998US5838060 Stacked assemblies of semiconductor packages containing programmable interconnect
11/17/1998US5838051 Silicide
11/17/1998US5838049 Tungsten
11/17/1998US5838036 Semiconductor memory device capable of realizing a minimum memory cell area approximate to a theoretical value
11/17/1998US5838023 Integrated circuit device
11/17/1998US5837935 Hermetic seal for an electronic component having a secondary chamber
11/17/1998US5837771 Epoxy resin with phosphonic acid anhydride in a di or tetracarbonic acid anhydride hardener
11/17/1998US5837618 Uniform nonconformal deposition for forming low dielectric constant insulation between certain conductive lines
11/17/1998US5837613 Spin-coating glass dielectric layer onto integrated circuit topography and curing, vapor depositiung a second dielectric prior to spin-coating and curing glass third dielectric layer
11/17/1998US5837611 Production method for an insulation layer functioning as an intermetal dielectric
11/17/1998US5837608 For improved step coverage
11/17/1998US5837607 Method of making a laser synthesized ceramic electronic devices and circuits
11/17/1998US5837606 Semiconductor device having internal wire and method of fabricating the same
11/17/1998US5837602 Method of manufacturing doped interconnect
11/17/1998US5837567 Lead frame and semiconductor device
11/17/1998US5837566 Vertical interconnect process for silicon segments
11/17/1998US5837562 Process for bonding a shell to a substrate for packaging a semiconductor
11/17/1998US5837561 Fabrication of transparent substrate vertical cavity surface emitting lasers by semiconductor wafer bonding
11/17/1998US5837388 Aluminum alloy solder material, its manufacturing method, brazing sheet using this material, and method of manufacturing aluminum alloy heat exchanger using this sheet
11/17/1998US5837368 Insulating film with improved punching characteristics and lead frame using the same
11/17/1998US5837356 Impact strength, semiconductor housing package
11/17/1998US5837154 Method of manufacturing double-sided circuit tape carrier
11/17/1998US5837081 Method for making a carbon-carbon composite
11/12/1998WO1998051137A1 Method for mounting a cooling element on an apparatus and such a cooling element
11/12/1998WO1998050956A1 Patterned ground shields for integrated circuit inductors
11/12/1998WO1998050954A1 Stacked semiconductor devices, particularly memory chips
11/12/1998WO1998050953A1 Electronic component having resilient contact elements at areas remote from corresponding terminals
11/12/1998WO1998050952A1 Ball grid array semiconductor package and method for making the same
11/12/1998WO1998050950A1 Semiconductor device and its manufacture
11/12/1998WO1998050949A2 Pbga stiffener package and method of manufacturing
11/12/1998WO1998032893A3 Wafer support system
11/12/1998DE19819217A1 Electronic component base plate
11/12/1998DE19819215A1 Resin-sealed flip-chip device
11/12/1998DE19818751A1 Multi-layer electric circuit board
11/12/1998DE19756529A1 Semiconductor module with substrate containing integrated circuit
11/12/1998DE19719703A1 Leistungshalbleitermodul mit Keramiksubstrat Power semiconductor module with a ceramic substrate
11/12/1998DE19718517A1 Microelectronic component with diamond layer
11/11/1998EP0877452A2 Laser sub-mount
11/11/1998EP0877424A2 Interconnect method and structure for semiconductor devices
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