Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1998
12/01/1998US5844301 Balanced integrated semiconductor device operating with a parallel resonator circuit
12/01/1998US5844297 Antifuse device for use on a field programmable interconnect chip
12/01/1998US5844296 Space saving laser programmable fuse layout
12/01/1998US5844295 Semiconductor device having a fuse and an improved moisture resistance
12/01/1998US5844208 Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature
12/01/1998US5844168 Multi-layer interconnect sutructure for ball grid arrays
12/01/1998US5843845 Method for forming sloped contact hole for semiconductor device
12/01/1998US5843843 Method for forming a wiring layer a semiconductor device
12/01/1998US5843842 Method for manufacturing a semiconductor device having a wiring layer without producing silicon precipitates
12/01/1998US5843840 Semiconductor device having a wiring layer and method for manufacturing same
12/01/1998US5843839 Formation of a metal via using a raised metal plug structure
12/01/1998US5843836 Tunneling technology for reducing intra-conductive layer capacitance
12/01/1998US5843831 Process independent alignment system
12/01/1998US5843810 Film circuit and method of manufacturing the same
12/01/1998US5843809 Lead frames for trench drams
12/01/1998US5843808 Structure and method for automated assembly of a tab grid array package
12/01/1998US5843807 Method of manufacturing an ultra-high density warp-resistant memory module
12/01/1998US5843806 Methods for packaging tab-BGA integrated circuits
12/01/1998US5843798 Method for manufacturing semiconductor device having step of forming electrode pins on semiconductor chip using electrode-pin forming mask, and method for testing semiconductor chip using electrode-pin forming mask
12/01/1998US5843591 Polymeric metal oxide materials and their formation and use
12/01/1998US5843550 Adhesive tape for tape automated bonding
12/01/1998US5843290 Electrolytic polishing apparatus
12/01/1998US5843251 Process for connecting circuits and adhesive film used therefor
12/01/1998US5842514 Electronic unit
12/01/1998US5842512 Spring loaded latching device for holding a heat receiving base member
12/01/1998US5842356 Electromagnetic wave-activated sorption refrigeration system
12/01/1998US5842257 Apparatus for and method of fabricating semiconductor devices
11/1998
11/26/1998WO1998053651A1 A system and method for packaging integrated circuits
11/26/1998WO1998053499A1 Substrate for electronic packaging, pin jig fixture
11/26/1998WO1998053498A1 Improved solder ball joint
11/26/1998WO1998053493A1 A system and method for packaging integrated circuits
11/26/1998WO1998053447A2 Method of manufacturing a body having a structure of layers
11/26/1998WO1998052575A1 Use of metalloproteinase inhibitors in the treatment and prevention of pulmonary emphysema
11/26/1998DE19745648A1 Carrier element for contactless semiconductor chip-card
11/26/1998CA2295541A1 A system and method for packaging integrated circuits
11/26/1998CA2290819A1 Substrate for electronic packaging, pin jig fixture
11/26/1998CA2290396A1 A system and method for packaging integrated circuits
11/26/1998CA2289079A1 Improved solder ball joint
11/25/1998EP0880179A2 Venting hole designs for multilayer conductor-dielectric structures
11/25/1998EP0880178A2 Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from single lead frame
11/25/1998EP0880177A2 Semiconductor device having lead terminals bent in J-shape
11/25/1998EP0880176A2 Semiconductor device having pellet mounted on radiating plate thereof
11/25/1998EP0880175A2 Thin power tape ball grid array package
11/25/1998EP0880173A2 Improved integrated multi-layer test pads and methods therefor
11/25/1998EP0880171A2 Integrated circuit chip structure for improved packaging
11/25/1998EP0879479A2 Separable connecting bridge (fuse) and connectable line interruption (anti-fuse) and process for producing and activating a fuse and an anti-fuse
11/25/1998EP0879478A1 Electrically erasable and programmable read only memory (eeprom) having multiple overlapping metallization layers
11/25/1998EP0879470A1 Over-voltage protection device and method for making same
11/25/1998EP0780004B1 Circuit with a chip card module and a coil connected therewith
11/25/1998CN1199929A Semiconductor device having contact hole and method of manufacturing the same
11/25/1998CN1199927A Encapsulated integrated circuit component and its producing method
11/25/1998CN1199925A Improved integrated multi-layer test pads and methods therefor
11/25/1998CN1199924A Producing method for chip type semi-conductor device
11/25/1998CN1199921A Semiconductor apparatus and method for fabricating the same
11/25/1998CN1040937C Superconducting circuit board
11/24/1998US5841640 IC socket
11/24/1998US5841619 Interface circuit for use in a semiconductor integrated circuit
11/24/1998US5841584 Dielectric multilayered reflector
11/24/1998US5841206 Methods for wiring electrical systems and electrical systems wired to reduce noise
11/24/1998US5841198 Ball grid array package employing solid core solder balls
11/24/1998US5841196 Fluted via formation for superior metal step coverage
11/24/1998US5841195 In an integrated circuit
11/24/1998US5841194 Chip carrier with peripheral stiffener and semiconductor device using the same
11/24/1998US5841193 Single chip modules, repairable multichip modules, and methods of fabrication thereof
11/24/1998US5841192 Injection molded ball grid array casing
11/24/1998US5841191 Integrated circuit package
11/24/1998US5841190 High density multi-layered printed wiring board, multi-chip carrier and semiconductor package
11/24/1998US5841188 Tape carrier structure for a tape carrier package
11/24/1998US5841187 Molded electronic component
11/24/1998US5841184 Integrated emitter drain bypass capacitor for microwave/RF power device applications
11/24/1998US5841183 Chip resistor having insulating body with a continuous resistance layer and semiconductor device
11/24/1998US5841167 MOS-technology power device integrated structure
11/24/1998US5841164 Test structure for dielectric film evaluation
11/24/1998US5841160 Semiconductor device having a capacitor electrode made of iridium
11/24/1998US5841111 Low resistance electrical interface for current limiting polymers by plasma processing
11/24/1998US5841102 Multiple pulse space processing to enhance via entrance formation at 355 nm
11/24/1998US5841099 Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
11/24/1998US5841075 Method for reducing via inductance in an electronic assembly and article
11/24/1998US5841074 For distributing power from a power source
11/24/1998US5840821 Coating solution and method for preparing the coating solution, method for forming insulating films for semiconductor devices, and method for evaluating the coating solution
11/24/1998US5840631 Forming wiring layer on substrate, adding catalyst gas, adding organosilicon compound as source gas for silicon oxide insulating film, forming wiring layer
11/24/1998US5840627 Method of customizing integrated circuits using standard masks and targeting energy beams for single resist development
11/24/1998US5840625 Method of fabricating integrated circuit interconnection employing tungsten/aluminum layers
11/24/1998US5840624 Using thin silicon nitride layer as etch stop to prevent attack of underlying interlevel dielectric layer
11/24/1998US5840621 Forming a silicon nitride layer between first and second conductive layers because silicon nitride layer does not react with conductive layer
11/24/1998US5840619 Method of making a semiconductor device having a planarized surface
11/24/1998US5840618 Method of manufacturing semiconductor device using an amorphous material
11/24/1998US5840599 Process of packaging an integrated circuit with a conductive material between a lead frame and the face of the circuit
11/24/1998US5840598 Applying nonconductive polymer adhesive to active surface of semiconductor, attaching lead fingers of lead frame
11/24/1998US5840593 Membrane dielectric isolation IC fabrication
11/24/1998US5840446 Semiconductors
11/24/1998US5840432 Composite metal powder comprising particles of non-noble metal having flat shape covered with noble metal and having layer of mixture of the two between
11/24/1998US5840427 A diamond-like carbon inorganic coatings over a silicon film; protective coatings, stress resistance
11/24/1998US5840417 A multiplicity of electrically conductive adhesive members, each being separated from each other by means of a non-electrically conductive adhesive; useful in the assembly of multi-chip modules and multilayer electronic devices
11/24/1998US5840382 Ceramic substrate, glass adhesive layer; nonwarping, noncracking; capacitors, resistors
11/24/1998US5840369 Screen printing polyimide precursor ink on substrate, removing solvent, thermally curing ink to form polyimide relief pattern film
11/24/1998US5840218 Resistance material composition
11/24/1998US5839918 IC carrier
11/24/1998US5839191 Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package
11/24/1998US5839184 Method for creating on-package inductors for use with integrated circuits
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