Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1998
12/08/1998US5847572 Partly replaceable device for testing a multi-contact integrated circuit chip package
12/08/1998US5847489 Piezoelectric device and a package
12/08/1998US5847468 Alignment mark for use in making semiconductor devices
12/08/1998US5847467 Device packaging using heat spreaders and assisted deposition of wire bonds
12/08/1998US5847466 Semiconductor device and manufacturing method for the same
12/08/1998US5847465 Contacts for semiconductor devices
12/08/1998US5847464 Method for forming controlled voids in interlevel dielectric
12/08/1998US5847463 Local interconnect comprising titanium nitride barrier layer
12/08/1998US5847462 Integrated circuit having conductors of enhanced cross-sectional area with etch stop barrier layer
12/08/1998US5847461 Integrated circuit structure having contact openings and vias filled by self-extrusion of overlying metal layer
12/08/1998US5847460 Submicron contacts and vias in an integrated circuit
12/08/1998US5847459 Multi-level wiring using refractory metal
12/08/1998US5847458 Semiconductor package and device having heads coupled with insulating material
12/08/1998US5847457 Structure and method of forming vias
12/08/1998US5847455 Molded leadframe ball grid array
12/08/1998US5847453 Microwave circuit package
12/08/1998US5847452 Post mounted heat sink method and apparatus
12/08/1998US5847451 Multi-layered printed circuit board, and grid array package adopting the same
12/08/1998US5847449 Semiconductor device
12/08/1998US5847446 Semiconductor chip package having chip attach pad with perimeter slots
12/08/1998US5847445 Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same
12/08/1998US5847444 Semiconductor device with reduced aspect ratio contact hole
12/08/1998US5847443 Porous dielectric material with improved pore surface properties for electronics applications
12/08/1998US5847439 Integrated circuit having a void between adjacent conductive lines
12/08/1998US5847420 Semiconductor integrated circuit having three wiring layers
12/08/1998US5847366 For cooling the surface of a heat generating device
12/08/1998US5847327 Dimensionally stable core for use in high density chip packages
12/08/1998US5847326 Low-temperature fired ceramic circuit substrate with improved Ag-Au connection reliability
12/08/1998US5846879 Contact structure for vertical chip connections
12/08/1998US5846877 Method for fabricating an Al-Ge alloy wiring of semiconductor device
12/08/1998US5846876 Integrated circuit which uses a damascene process for producing staggered interconnect lines
12/08/1998US5846874 Method and apparatus for preventing cracks in semiconductor die
12/08/1998US5846852 Process for mounting an electronic component to a substrate and process for spray-cooling the electronic component mounted to a substrate
12/08/1998US5846851 Method of applying adhesive to lead of lead frame and method of making semiconductor device using the same
12/08/1998US5846848 Polysilicon electromigration sensor which can detect and monitor electromigration in composite metal lines on integrated circuit structures with improved sensitivity
12/08/1998CA2147752C Low profile fan body with heat transfer characteristics
12/03/1998WO1998054941A1 Apparatus for cooling an electronic component
12/03/1998WO1998054765A1 Low-profile axial-flow single-blade piezoelectric fan
12/03/1998WO1998054761A1 Copper circuit junction substrate and method of producing the same
12/03/1998WO1998054760A1 Method for manufacturing electric modules, and the electric module
12/03/1998WO1998054528A1 Torsion bar clamp apparatus and method for improving thermal and mechanical contact between stacked electronic components
12/03/1998WO1998054377A2 Stress tuned tantalum and tantalum nitride films
12/03/1998WO1998054267A1 Heat-resistant adhesives and semiconductor devices produced therewith
12/03/1998DE19824193A1 Flame resistant resin composition useful for encapsulation of semiconductor devices
12/03/1998DE19808350A1 Method for semiconductor wafer evaluation
12/03/1998DE19801493A1 Semiconductor component housing with numerous electrodes
12/03/1998DE19752413A1 Electrode production on semiconductor substrate
12/03/1998DE19722355A1 Verfahren zur Herstellung elektrischer Baugruppen und elektrische Baugruppe Method for manufacturing electrical components and electrical assembly
12/03/1998DE19722022A1 Semiconductor component production process
12/03/1998CA2239388A1 Cooling plate connecting clip for power semiconductors
12/02/1998EP0881870A1 Thermal protection device
12/02/1998EP0881868A2 Socket for mounting package and mount structure of package using the same
12/02/1998EP0881866A1 Control device
12/02/1998EP0881690A1 Stabilized bipolar transistor with electric insulating elements
12/02/1998EP0881680A2 Semiconductor device
12/02/1998EP0881679A2 Semiconductor module including a plurality of semiconductor devices detachably
12/02/1998EP0881678A2 Improvements in or relating to porous dielectric structures
12/02/1998EP0881677A1 Semiconductor device and multilayered lead frame used for the same
12/02/1998EP0881676A2 Flip chip packaging of memory chips
12/02/1998EP0881675A2 Semiconductor package lid with internal heat pipe
12/02/1998EP0881674A2 High power semiconductor module device
12/02/1998EP0881673A2 Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity
12/02/1998EP0881668A2 Deposition of an electrically insulating thin film with a low dielectric constant
12/02/1998EP0775368B1 Plastic substrate for electronic circuits with bondable contact pins
12/02/1998CN2299396Y Heat pipe radiator for four inches thyristor
12/02/1998CN1200867A Highly heat-conductive composite magnetic material
12/02/1998CN1200579A Electronic component involving 3-terminal tape piezo-electric device
12/02/1998CN1200578A Electronic component involving two-terminal type piezo-electric device
12/02/1998CN1200570A Anti-tamper bond wire shield for integrated circuit
12/02/1998CN1200569A Method of mfg. semiconductor device with pair of radiating terminals and plurality of lead terminals formed from single lead frame
12/02/1998CN1200568A Conducting wire frame and method for producing same
12/02/1998CN1200567A Semiconductor device
12/02/1998CN1200565A Method of mfg. semiconductor device
12/02/1998CN1200564A Mfg. method of semiconductor device
12/02/1998CN1200559A Semiconductor substrate and mfg. method thereof
12/02/1998CN1041035C Multi-chip module
12/02/1998CN1041034C Semi-conductor assembly mfg. method
12/02/1998CN1041019C High-effect space light modulator with light blocking layer
12/01/1998US5845031 Optical module having an improved heat dissipation and reduced mechanical distortion
12/01/1998US5844810 Scaled adaptive lithography
12/01/1998US5844782 Printed wiring board and electronic device using same
12/01/1998US5844779 Semiconductor package, and semiconductor device using the same
12/01/1998US5844755 Giant magnetoresistive information recording medium, and associated recording and reproducing method and apparatus
12/01/1998US5844418 Carrier having interchangeable substrate used for testing of semiconductor dies
12/01/1998US5844321 Semiconductor device comprising a chip which is provided with a via opening and is soldered on a support, and method of realizing this device
12/01/1998US5844318 Aluminum film for semiconductive devices
12/01/1998US5844317 Consolidated chip design for wire bond and flip-chip package technologies
12/01/1998US5844316 Fixture for handling and attaching conductive spheres to a substrate
12/01/1998US5844315 Low-profile microelectronic package
12/01/1998US5844314 Liquid crystal display
12/01/1998US5844313 Heat sink
12/01/1998US5844312 Solderable transistor clip and heat sink
12/01/1998US5844311 Multichip module with heat sink and attachment means
12/01/1998US5844310 Heat spreader semiconductor device with heat spreader and method for producing same
12/01/1998US5844309 Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition
12/01/1998US5844308 Electronic package
12/01/1998US5844307 Semiconductor package
12/01/1998US5844306 Semiconductor device
12/01/1998US5844305 Lead frame for semiconductor devices
12/01/1998US5844304 Process for manufacturing semiconductor device and semiconductor wafer
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