Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1998
12/17/1998DE19750896A1 Semiconductor module with first conductive layer
12/17/1998DE19741436A1 Semiconductor device suitable for wire bond and flip-chip mounting
12/17/1998DE19741214C1 Semiconductor switch with temperature protection e.g. for excess temperature in semiconductor body
12/17/1998DE19725445A1 Bauteilträger für Multi-Chip-Module Component carrier for multi-chip modules
12/17/1998DE19724909A1 Semiconductor device with mount for its securing to PCB
12/17/1998DE19724595A1 Structured metal layer production especially on MOS structure
12/16/1998EP0884799A2 Semiconductor module having antenna element therein
12/16/1998EP0884783A2 A micromagnetic device for power processing applications and method of manufacture therefor
12/16/1998EP0884780A2 Semiconductor device with an improved lead-chip adhesion structure and lead frame to be used therefor
12/16/1998EP0884779A2 Structure of bonding an inner lead to an electrode in a semiconductor device
12/16/1998EP0852897A4 Method for surface mounting a heatsink to a printed circuit board
12/16/1998EP0583407B1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards
12/16/1998CN2300986Y Radiator for thermopile
12/16/1998CN1202277A Silicide agglomeration fuse device
12/16/1998CN1202276A Circuit board for mounting electronic parts
12/16/1998CN1202273A Improved interface between titanium and aluminum-alloy in metal stack for integrated circuit
12/16/1998CN1202009A Semiconductor device having lead terminals bent in J-shape
12/16/1998CN1202008A Lead frame and method for manufacturing the same
12/16/1998CN1202007A Film carrier type, integrated circuit device and method of making same and electronic device
12/16/1998CN1201986A Electronic component material containing insect repellent, electronic mail using the material and manufacture thereof
12/16/1998CN1041254C Three dimension semiconductor device
12/15/1998US5850450 Method and apparatus for encryption key creation
12/15/1998US5850105 Substantially planar semiconductor topography using dielectrics and chemical mechanical polish
12/15/1998US5850104 Power semiconductor device package
12/15/1998US5850102 Semiconductor device having a second insulating layer which includes carbon or fluorine at a density lower than a first insulating layer
12/15/1998US5850099 Thermally uniform transistor
12/15/1998US5850088 Teg for carrier lifetime evaluation
12/15/1998US5849861 Polyquinazolines and methods for their preparation
12/15/1998US5849634 Method of forming silicide film on silicon with oxygen concentration below 1018 /cm3
12/15/1998US5849633 Electrically conductive projections and semiconductor processing method of forming same
12/15/1998US5849632 Method of passivating semiconductor wafers
12/15/1998US5849631 Method of manufacturing semiconductor device
12/15/1998US5849623 Method of forming thin film resistors on organic surfaces
12/15/1998US5849609 Semiconductor package and a method of manufacturing thereof
12/15/1998US5849608 Semiconductor chip package
12/15/1998US5849606 Semiconductor device and manufacturing of the same
12/15/1998US5849396 Multilayer electronic structure and its preparation
12/15/1998US5849230 Method of manufacturing a card with a built-in electronic part, formed of a plurality of resin layers
12/15/1998US5849132 Ball contact for flip-chip devices
12/15/1998US5849130 Method of making and using thermally conductive joining film
12/15/1998US5848685 Photolithographically patterned spring contact
12/15/1998US5848467 Methods of making semiconductor chip assemblies
12/15/1998US5848466 Method for forming a microelectronic assembly
12/15/1998CA2134257C Ball grid array plastic package
12/10/1998WO1998056041A1 Semiconductor device and method for manufacturing the same
12/10/1998WO1998056038A1 Method of manufacturing a semiconductor device, method of cleaning such a device, and cleaning agent for this purpose
12/10/1998WO1998055669A2 Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same
12/10/1998WO1998055523A1 Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
12/10/1998WO1998041076A3 Device for cooling electronic components
12/10/1998WO1998039803A3 Circuit configuration comprising semi-conductor components which has devices for monitoring junction temperature
12/10/1998DE19738549C1 Packaged integrated circuit for protecting from mechanical, chemical and ambient conditioning damage
12/10/1998DE19736208C1 Electromagnetic sealing device for screen housing and circuit board e.g. for communications apparatus
12/10/1998DE19735071A1 Power module
12/10/1998DE19734434C1 Semiconductor body with reverse-side metallisation e.g. for power semiconductor
12/10/1998DE19732915C1 Manufacturing method for chip-module e.g. for credit card
12/10/1998DE19723734A1 Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial, insbesondere feine Leiterbahnstrukturen, und Verfahren zu ihrer Herstellung Conductor track structures on a non-conductive carrier material, in particular fine conductor track structures, and processes for their preparation
12/10/1998DE19721935C1 Chip carrier arrangement
12/09/1998EP0883330A1 Circuit board with primary and secondary through holes
12/09/1998EP0883328A1 Circuit board comprising a high frequency transmission line
12/09/1998EP0883192A2 Grooved semiconductor die for flip-chip sink attachment
12/09/1998EP0883182A2 Lattice arrangement of electrodes on a multi-layer circuit board
12/09/1998EP0883181A1 Semiconductor device and process for connecting internal ground wires with such a device
12/09/1998EP0883180A2 Semiconductor device and wiring tape for semiconductor device
12/09/1998EP0883179A2 Spiral pin-fin heatsink for electronic packages
12/09/1998EP0883178A2 Cryogenic electronic assembly
12/09/1998EP0883177A1 Semiconductor device with heat sink
12/09/1998EP0883176A2 Cooling fin with clip for power semiconductor
12/09/1998EP0883175A2 High performance heat spreader for flip chip packages
12/09/1998EP0883174A2 Semiconductor device and semiconductor device module
12/09/1998EP0883173A1 Circuit board for mounting electronic parts
12/09/1998EP0883171A1 Semiconductor package manufacturing method having an integrated circuit
12/09/1998EP0883170A1 Semiconductor device and method for manufacturing the same
12/09/1998EP0883003A2 Optical semiconductor device and lead frame used in it
12/09/1998EP0882689A2 Aluminum nitride based composite body, electronic functional material, electrostatic chuck and method of producing aluminum nitride based composition body
12/09/1998EP0882385A1 Heat conductive device
12/09/1998EP0882384A1 Metal ball grid electronic package
12/09/1998EP0882308A2 Optimizing the power connection between chip and circuit board for a power switch
12/09/1998EP0882207A1 Active heat sink structure with flow augmenting rings and method for removing heat
12/09/1998EP0606355B1 Method and compositions for diffusion patterning
12/09/1998CN1201543A Chip module
12/09/1998CN1201264A Semiconductor device and mfg. method therefor
12/09/1998CN1201260A Grid unit of turn-off SCR for hard exciting grating
12/09/1998CN1201259A 半导体器件 Semiconductor devices
12/09/1998CN1201258A Semiconductor device without leakage current in relative state and mfg. method therefor
12/09/1998CN1201257A Semiconductor package body and semiconductor module using same
12/09/1998CN1201256A Composite material for semiconductor radiator and producing method therefor
12/09/1998CN1201255A Electronic-element assembly having package material and formation method therefor
12/09/1998CN1201254A Packaged integrated circuit device
12/09/1998CN1201253A Semiconductor integrated-circuit device
12/09/1998CN1201053A Flame-retardant resin composition and semiconductive sealing material made of same
12/09/1998CN1041151C Composite material for lead wire frame
12/09/1998CN1041150C Large ceramic article and method of mfg. Same
12/09/1998CN1041149C Known good die array and mfg. method thereof
12/08/1998US5848282 Computer system with a control funtion of rotation speed of a cooling fan for a microprocessor chip therein and a method of controlling the cooling fan
12/08/1998US5847935 Electronic circuit chip package
12/08/1998US5847929 Attaching heat sinks directly to flip chips and ceramic chip carriers
12/08/1998US5847928 Electronic assembly
12/08/1998US5847927 Electronic assembly with porous heat exchanger and orifice plate
12/08/1998US5847926 Lightweight packaging
12/08/1998US5847914 For use with a semiconductor chip package
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