Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/15/2013US8558946 PCB and camera module having the same
10/15/2013US8558400 Semiconductor packages and methods of fabricating the same
10/15/2013US8558399 Dual molded multi-chip package system
10/15/2013US8558398 Bond wire arrangement for minimizing crosstalk
10/15/2013US8558397 Dicing tape-integrated wafer back surface protective film
10/15/2013US8558396 Bond pad configurations for semiconductor dies
10/15/2013US8558395 Organic interface substrate having interposer with through-semiconductor vias
10/15/2013US8558394 Chip stack structure and manufacturing method thereof
10/15/2013US8558392 Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant
10/15/2013US8558391 Semiconductor device and a method of manufacturing the same
10/15/2013US8558390 Semiconductor device
10/15/2013US8558389 Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer
10/15/2013US8558388 Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package
10/15/2013US8558387 Semiconductor device including bottom surface wiring and manfacturing method of the semiconductor device
10/15/2013US8558386 Methods of making compliant semiconductor chip packages
10/15/2013US8558385 Interconnection architecture for semiconductor device
10/15/2013US8558384 Interconnect structure containing various capping materials for electrical fuse and other related applications
10/15/2013US8558383 Post passivation structure for a semiconductor device and packaging process for same
10/15/2013US8558382 Interconnection structure and display device including interconnection structure
10/15/2013US8558381 Semiconductor device
10/15/2013US8558380 Stack package and method for manufacturing the same
10/15/2013US8558379 Flip chip interconnection with double post
10/15/2013US8558378 Bump-on-lead flip chip interconnection
10/15/2013US8558377 Semiconductor package module
10/15/2013US8558375 Semiconductor package cooled by grounded cooler
10/15/2013US8558374 Electronic package with thermal interposer and method of making same
10/15/2013US8558373 Heatsink, heatsink assembly, semiconductor module, and semiconductor device with cooling device
10/15/2013US8558372 Semiconductor device
10/15/2013US8558371 Method for wafer level package and semiconductor device fabricated using the same
10/15/2013US8558370 Semiconductor device with antenna
10/15/2013US8558368 Bi-directional, reverse blocking battery switch
10/15/2013US8558367 Semiconductor module
10/15/2013US8558366 Integrated circuit packaging system with interposer interconnections and method of manufacture thereof
10/15/2013US8558365 Package in package device for RF transceiver module
10/15/2013US8558364 Inductive getter activation for high vacuum packaging
10/15/2013US8558363 Lead frame substrate and method of manufacturing the same, and semiconductor device
10/15/2013US8558362 Semiconductor device and manufacturing method of the same
10/15/2013US8558361 Power semiconductor module
10/15/2013US8558359 Semiconductor package having lead frames
10/15/2013US8558358 Lead frame
10/15/2013US8558357 Ultra thin image sensor package structure and method for fabrication
10/15/2013US8558356 Electrical Component
10/15/2013US8558355 Shielding structure for transmission lines
10/15/2013US8558352 Semiconductor integrated circuit device and process for manufacturing the same
10/15/2013US8558351 Alignment for backside illumination sensor
10/15/2013US8558345 Integrated decoupling capacitor employing conductive through-substrate vias
10/15/2013US8558343 Semiconductor device having a fuse element
10/15/2013US8558334 Semiconductor device and method of manufacturing the semiconductor device
10/15/2013US8558314 Semiconductor device
10/15/2013US8558290 Semiconductor device with dual metal silicide regions and methods of making same
10/15/2013US8558283 Semiconductor device including dummy
10/15/2013US8558248 A1 alloy film, electronic device, and active matrix substrate for use in electrooptic display device
10/15/2013US8558243 Micro device array for transfer to a receiving substrate
10/15/2013US8558229 Passivation layer for packaged chip
10/15/2013US8558228 Four-terminal metal-over-metal capacitor design kit
10/15/2013US8558124 Housing component for door latch assembly and method of making
10/15/2013US8557719 Method for fabricating semiconductor device
10/15/2013US8557701 Method for fabricating a semiconductor device with formation of conductive lines
10/15/2013US8557654 Punch-through diode
10/15/2013US8557639 Apparatus for thermally enhanced semiconductor package
10/15/2013US8557629 Semiconductor device having overlapped via apertures
10/10/2013WO2013151606A1 Semiconductor cooling apparatus
10/10/2013WO2013151605A1 Semiconductor cooling apparatus
10/10/2013WO2013150981A1 Semiconductor device and method for manufacturing same
10/10/2013WO2013150940A1 Glass substrate with through electrode and method for producing glass substrate with through electrode
10/10/2013WO2013150927A1 Insulating film, method for manufacturing semiconductor device, and semiconductor device
10/10/2013WO2013150900A1 Curable epoxy resin composition
10/10/2013WO2013150890A1 Semiconductor device
10/10/2013WO2013150867A1 Semiconductor device
10/10/2013WO2013150772A1 Power converter
10/10/2013WO2013150707A1 Semiconductor device and method for manufacturing same
10/10/2013WO2013150616A1 Semiconductor package
10/10/2013WO2013150071A2 Cooling device
10/10/2013WO2013149451A1 Quad flat no-lead package component and manufacturing method therefor
10/10/2013WO2013149446A1 Heat-dissipater coated with graphene thin film on surface
10/10/2013WO2013149420A1 Highly heat-conductive adhesive tape of metal foil
10/10/2013WO2013112803A3 Multiple energization elements in stacked integrated component devices
10/10/2013WO2013059307A3 Temperature system having an impurity filter
10/10/2013US20130267066 Semiconductor Packages and Methods of Fabricating the Same
10/10/2013US20130267064 Method for manufacturing a semiconductor device
10/10/2013US20130266035 Housing and Method for Producing a Housing
10/10/2013US20130265535 Liquid crystal display panel and pixel electrode structure thereof
10/10/2013US20130264723 Metal base substrate and manufacturing method thereof
10/10/2013US20130264721 Electronic Module
10/10/2013US20130264720 Semiconductor Chips Having Through Silicon Vias and Related Fabrication Methods and Semiconductor Packages
10/10/2013US20130264719 Semiconductor structure and method for manufacturing the same
10/10/2013US20130264718 Layout of memory strap cell
10/10/2013US20130264717 Multi-level stack having multi-level contact and method
10/10/2013US20130264716 System-In-Package Having Integrated Passive Devices and Method Therefor
10/10/2013US20130264715 Semiconductor device and manufacturing method thereof
10/10/2013US20130264714 Semiconductor device and method of assembling same
10/10/2013US20130264712 Wirebonded semiconductor package
10/10/2013US20130264711 Nanotube electronics templated self-assembly
10/10/2013US20130264709 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
10/10/2013US20130264708 Substrate device
10/10/2013US20130264707 Method for handling very thin device wafers
10/10/2013US20130264706 Semiconductor Package and Method of Manufacturing the Same
10/10/2013US20130264705 Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process
10/10/2013US20130264704 Semiconductor Device and Method of Confining Conductive Bump Material During Reflow with Solder Mask Patch
10/10/2013US20130264703 Semiconductor packages and methods for manufacturing the same
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