Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1998
12/30/1998CN1203453A Structure of bonding inner lead to electrode in semiconductor device
12/30/1998CN1203452A Semiconductor device and method for manufacture thereof
12/30/1998CN1203450A Semiconductor device and method for manufacturing semiconductor device
12/30/1998CN1203446A Micromagnetic device for power processing applications and method of manufacture therefor
12/30/1998CN1203367A IC testing apparatus
12/30/1998CN1041479C Component module
12/30/1998CN1041470C Organic chip carriers for wire bond-type chips
12/29/1998US5854741 Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same
12/29/1998US5854739 Long fin omni-directional heat sink
12/29/1998US5854563 Process control monitoring system and method therefor
12/29/1998US5854534 For coupling an integrated circuit chip to a multichip module substrate
12/29/1998US5854515 Integrated circuit having conductors of enhanced cross-sectional area
12/29/1998US5854514 Lead-free interconnection for electronic devices
12/29/1998US5854513 Semiconductor device having a bump structure and test electrode
12/29/1998US5854512 For packaging an integrated circuit die
12/29/1998US5854511 Semiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leads
12/29/1998US5854510 Low power programmable fuse structures
12/29/1998US5854508 Semiconductor memory device having zigzag bonding pad arrangement
12/29/1998US5854503 Maximization of low dielectric constant material between interconnect traces of a semiconductor circuit
12/29/1998US5854361 Process for preparing phosphorus-modified epoxy resins
12/29/1998US5854316 Epoxy resin composition
12/29/1998US5854141 Inorganic seal for encapsulation of an organic layer and method for making the same
12/29/1998US5854140 Method of making an aluminum contact
12/29/1998US5854131 Integrated circuit having horizontally and vertically offset interconnect lines
12/29/1998US5854130 Method of forming multilevel interconnects in semiconductor devices
12/29/1998US5854126 Method for forming metallization in semiconductor devices with a self-planarizing material
12/29/1998US5854094 Process for manufacturing metal plane support for multi-layer lead frames
12/29/1998US5854093 Direct attachment of silicon chip to circuit carrier
12/29/1998US5854092 Method for spray-cooling a tunable semiconductor device
12/29/1998US5854085 Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
12/29/1998US5853888 Surface modification of synthetic diamond for producing adherent thick and thin film metallizations for electronic packaging
12/29/1998US5853840 Dummy wafer
12/29/1998US5853804 Gas control technique for limiting surging of gas into a CVD chamber
12/29/1998US5853622 Transient liquid phase sintering conductive adhesives
12/29/1998US5853602 Method of dry etching for patterning refractory metal layer improved in etching rate, anisotropy and selectivity to silicon oxide
12/29/1998US5853519 Process for applying masking tape and apparatus for carrying out the same process
12/29/1998US5852871 Method of making raised contacts on electronic components
12/29/1998US5852870 Method of making grid array assembly
12/29/1998CA2058143C Direct microcircuit decoupling
12/24/1998DE19825994A1 Thermoplastic material for encapsulating semiconductor element, allowing recycling
12/24/1998DE19727693A1 Verfahren und Vorrichtung zur Herstellung elektrisch leitfähiger Durchgänge in Halbleiter-Bauelementen Method and device for producing electrically conductive passages in semiconductor devices
12/23/1998WO1998058407A1 Component support for a multi-chip module
12/23/1998WO1998058396A1 Electric capacitor
12/23/1998WO1998057801A1 Heat sink packaging methods and devices for same
12/23/1998WO1998057755A1 Applicator head and method for using same
12/23/1998EP0886315A1 Electronic power module and electronic power device employing the same
12/23/1998EP0886314A1 Semiconductor circuit device capable of reducing influence of a parasitic capacitor
12/23/1998EP0886313A1 Semiconductor device sealed with resin, and its manufacture
12/23/1998EP0885858A2 Recrystallized silicon carbide sintered material and manufacturing method thereof
12/23/1998EP0885483A1 Push-pull power amplifier
12/23/1998EP0885468A1 Slotline-to-coplanar waveguide transition
12/23/1998EP0885459A1 Electronic power module, and electronic power system comprising a plurality of same
12/23/1998EP0885457A2 Method for making a circuit structure having a flip-mounted matrix of devices
12/23/1998EP0843621A4 Conductive via fill inks for ceramic multilayer circuit boards on support substrates
12/23/1998EP0826152A4 Method and apparatus for testing semiconductor dice
12/23/1998EP0779891B1 Novel acylphosphine oxides
12/23/1998EP0639293B1 Device for indexing magazine compartments and wafer-shaped objects in the compartments
12/23/1998EP0557079B1 Discretionary lithography for integrated circuits
12/23/1998CN2301792Y Power semi-conductor phase transition radiator
12/23/1998CN1202983A Semiconductor device, process for producing the same, and packaged substrate
12/23/1998CN1202794A Circuit board with primary and secondary through holes
12/23/1998CN1202734A Circuit for electrostatic discharge (ESD) protection
12/23/1998CN1202731A Resin package, semiconductor device and method for producing resin package
12/23/1998CN1202730A Chip scale carrier
12/23/1998CN1202728A Semiconductor device and method of manufacturing semiconductor device
12/23/1998CA2294977A1 Electric capacitor
12/22/1998US5852548 Enhanced heat transfer in printed circuit boards and electronic components thereof
12/22/1998US5852391 Microwave/millimeter-wave functional module package
12/22/1998US5852328 Semiconductor device and method of manufacturing the same
12/22/1998US5852327 Semiconductor device
12/22/1998US5852326 Face-up semiconductor chip assembly
12/22/1998US5852324 Plastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modes
12/22/1998US5852323 Electrically programmable antifuse using metal penetration of a P-N junction
12/22/1998US5852310 Multi-level transistor fabrication method with a patterned upper transistor substrate and interconnection thereto
12/22/1998US5851923 Integrated circuit and method for forming and integrated circuit
12/22/1998US5851922 Process for fabricating a device using nitrogen implantation into silicide layer
12/22/1998US5851920 Method of fabrication of metallization system
12/22/1998US5851919 Method for forming interconnections in an integrated circuit
12/22/1998US5851917 Method for manufacturing a multi-layer wiring structure of a semiconductor device
12/22/1998US5851915 Method of manufacturing a semiconductor device through a reduced number of simple processes at a relatively low cost
12/22/1998US5851914 Method of fabricating a metal contact structure
12/22/1998US5851911 Mask repattern process
12/22/1998US5851910 Method of fabricating a bonding pad window
12/22/1998US5851903 Method of forming closely pitched polysilicon fuses
12/22/1998US5851868 Methods of forming integrated decoupling capacitors
12/22/1998US5851856 Manufacture of application-specific IC
12/22/1998US5851855 Process for manufacturing a MOS-technology power device chip and package assembly
12/22/1998US5851853 Method of attaching a die onto a pad of a lead frame
12/22/1998US5851847 Photonic device and process for fabricating the same
12/22/1998US5851681 Wiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring board
12/22/1998US5851616 Adhesive tape for electronic parts and liquid adhesive
12/22/1998US5851603 Method for making a plasma-enhanced chemical vapor deposited SiO2 Si3 N4 multilayer passivation layer for semiconductor applications
12/22/1998US5851367 Differential copper deposition on integrated circuit surfaces and method for same
12/22/1998US5851364 Method for forming aluminum contacts
12/22/1998US5851337 Method of connecting TEHS on PBGA and modified connecting structure
12/22/1998US5850690 Method of manufacturing and assembling an integrated circuit card
12/17/1998WO1998057361A1 Substrate for device manufacturing, process for manufacturing the substrate, and method of exposure using the substrate
12/17/1998WO1998057111A1 Temperature control device comprising heat pipe
12/17/1998WO1998056526A1 Sheet metal member, method of manufacturing same, and heat radiation plate
12/17/1998DE19816404A1 Deformable blank fastener for integrated circuit
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