| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/12/1999 | US5857258 Electrical test structure and method for measuring the relative locations of conductive features on an insulating substrate |
| 01/11/1999 | CA2240751A1 Electrical circuit configuration arranged in a casing |
| 01/07/1999 | WO1999000844A2 Sockets for semiconductor devices with spring contact elements |
| 01/07/1999 | WO1999000843A1 Post mounted heat sink method and apparatus |
| 01/07/1999 | WO1999000842A1 Substrate for mounting semiconductor chips |
| 01/07/1999 | WO1999000834A2 Method and apparatus for injection molded flip chip encapsulation |
| 01/07/1999 | WO1999000826A2 Resin molded type semiconductor device and a method of manufacturing the same |
| 01/07/1999 | WO1999000695A1 Wire electrode structure and liquid crystal display employing the structure |
| 01/07/1999 | WO1999000524A1 Minimal thermal expansion, high thermal conductivity metal-ceramic matrix composite |
| 01/07/1999 | EP0889585A2 Electric component having an electronic component device located on a face of a package member with a space therebetween |
| 01/07/1999 | EP0889533A2 Optical semiconductor module and method for manufacturing same |
| 01/07/1999 | EP0889527A2 Semiconductor device with reduced number of trough holes and method of manufacturing the same |
| 01/07/1999 | EP0889525A2 Heat sink device for power components |
| 01/07/1999 | EP0889524A2 Scalable and modular heat sink-heat pipe cooling system |
| 01/07/1999 | EP0889523A2 Hermetic thin pack semiconductor device |
| 01/07/1999 | EP0889522A2 Ceramic housing and method of manufacturing it |
| 01/07/1999 | EP0889516A2 Formation of sublithographic features |
| 01/07/1999 | EP0889513A2 Integrated circuit contact |
| 01/07/1999 | EP0889512A2 Method for controlling solder bump shape and stand-off height |
| 01/07/1999 | EP0888708A1 Fan attachment clip for heat sink |
| 01/07/1999 | EP0888642A1 Semiconductor device |
| 01/07/1999 | EP0888640A2 Method of manufacturing a glass-covered semiconductor device and a glass-covered semiconductor device |
| 01/07/1999 | EP0888637A1 Semiconductor integrated circuit with inductor |
| 01/07/1999 | EP0888636A1 Semiconductor device shielded by an array of electrically conducting pins and a method to manufacture such a device |
| 01/07/1999 | EP0815591A4 Microcircuit via interconnect |
| 01/07/1999 | EP0749675A4 Low profile fan body with heat transfer characteristics |
| 01/07/1999 | EP0746968A4 Detachable apparatus for cooling integrated circuits |
| 01/07/1999 | EP0682223B1 Heat sink with a heat plate |
| 01/07/1999 | DE19828391A1 LCD with counter-electrode on substrate extending in given direction |
| 01/07/1999 | DE19735171A1 Semiconductor module useful for chip card |
| 01/07/1999 | DE19728953A1 System for manufacturing multichip module |
| 01/07/1999 | DE19728692A1 IC-Baustein IC module |
| 01/07/1999 | DE19727628A1 Package or casing for electronic power component |
| 01/07/1999 | DE19726881A1 Halbleiterschaltungsvorrichtung und Verfahren zur Herstellung A semiconductor circuit apparatus and methods for making |
| 01/06/1999 | CN1204154A Semiconductor device having multilayer interconnection structure |
| 01/06/1999 | CN1204153A 半导体集成电路器件 The semiconductor integrated circuit device |
| 01/06/1999 | CN1204152A 半导体器件 Semiconductor devices |
| 01/06/1999 | CN1204151A Formation of sub-groundrule features |
| 01/06/1999 | CN1204149A Method for manufacturing semiconductor device |
| 01/06/1999 | CN1204144A Method for making resin packaging semiconductor device |
| 01/06/1999 | CN1204143A Semiconductor device and manufacturing method thereof |
| 01/06/1999 | CN1204142A Method of manufacturing semiconductor device having multilayer wiring |
| 01/06/1999 | CN1041579C Method and apparatus for stress relieved electronic module |
| 01/06/1999 | CN1041578C Epoxy molding composition for surface mount application |
| 01/06/1999 | CN1041526C Naphthalene-ring resin and its use for preparing epoxy resin composition |
| 01/05/1999 | US5856913 Multilayer semiconductor device having high packing density |
| 01/05/1999 | US5856911 Attachment assembly for integrated circuits |
| 01/05/1999 | US5856846 Charge-coupled imaging device having electrical connections on the readout register side |
| 01/05/1999 | US5856775 Programmable thin film filament resistor and method of constructing same |
| 01/05/1999 | US5856707 Vias and contact plugs with an aspect ratio lower than the aspect ratio of the structure in which they are formed |
| 01/05/1999 | US5856706 Static random access memory device and manufacturing method therefor |
| 01/05/1999 | US5856705 Sealed semiconductor chip and process for fabricating sealed semiconductor chip |
| 01/05/1999 | US5856703 Integrated circuitry having a pair of adjacent conductive lines |
| 01/05/1999 | US5856687 Semiconductor device with connected source electrode pads at diagonal corners |
| 01/05/1999 | US5856238 Method for fabricating metal wire of semiconductor device |
| 01/05/1999 | US5856235 Heat resistance |
| 01/05/1999 | US5856234 Semiconductors |
| 01/05/1999 | US5856233 Method of forming a field programmable device |
| 01/05/1999 | US5856229 Process for production of semiconductor substrate |
| 01/05/1999 | US5856219 Method of fabricating a high-density dynamic random-access memory |
| 01/05/1999 | US5856213 Method of fabricating a programmable function system block using two masks and a sacrificial oxide layer between the bottom metal and an amorphous silicon antifuse structure |
| 01/05/1999 | US5856212 Method of producing semiconductor package having solder balls |
| 01/05/1999 | US5856028 Magnesium-aluminum-silicate glass |
| 01/05/1999 | US5856026 Metalization for interconnecting wiring of devices |
| 01/05/1999 | US5855995 Ceramic substrate for implantable medical devices |
| 01/05/1999 | US5855993 Electronic devices having metallurgies containing copper-semiconductor compounds |
| 01/05/1999 | US5855954 Composite structure for manufacturing a microelectronic component and a process for manufacturing the composite structure |
| 01/05/1999 | US5855711 Method of producing a ceramic circuit substrate |
| 01/05/1999 | US5855489 For an electronic package |
| 01/05/1999 | US5855121 Absorbent pair refrigeration system |
| 01/05/1999 | US5855119 Method and apparatus for cooling electrical components |
| 12/30/1998 | WO1998059370A1 Semiconductor circuit device and method for the production thereof |
| 12/30/1998 | WO1998059369A1 Semiconductor package and method for manufacturing the same |
| 12/30/1998 | WO1998059368A1 Sequentially built integrated circuit package |
| 12/30/1998 | WO1998059202A1 Water vaporization type cooler for heat-generating element |
| 12/30/1998 | WO1998059098A2 Method and device for producing electrically conductive continuity in semiconductor components |
| 12/30/1998 | WO1998059004A1 Electronic component-protecting material |
| 12/30/1998 | EP0888040A2 Structure for shielding an electronic circuit from radio waves |
| 12/30/1998 | EP0888039A2 Heat sink attachment |
| 12/30/1998 | EP0887864A1 Semiconductor device with capacitor and method for fabricating the same |
| 12/30/1998 | EP0887861A1 Semiconductor device having separated exchange means |
| 12/30/1998 | EP0887860A1 Formation of alignment mark and structure covering the same |
| 12/30/1998 | EP0887859A2 Integrated circuits with metallic fuses and method |
| 12/30/1998 | EP0887858A2 Protection layer for laser blown fuses in semiconductor devices |
| 12/30/1998 | EP0887856A1 Method of manufacturing electronic components |
| 12/30/1998 | EP0887854A1 Microelectronic structure of a semiconductor material that is difficult to etch and metallized holes |
| 12/30/1998 | EP0887852A2 Improved silica stain test structures and methods therefor |
| 12/30/1998 | EP0887851A2 Method of forming interconnections on electronic modules |
| 12/30/1998 | EP0887850A2 Lead-frame forming for improved thermal performance |
| 12/30/1998 | EP0887847A1 Process of final passivation of integrated circuit devices |
| 12/30/1998 | EP0886894A2 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 12/30/1998 | EP0799496A4 Function-differentiated temperature compensated crystal oscillator and method of producing the same |
| 12/30/1998 | EP0780351B1 Aluminum nitride sintered body and method for manufacturing the same |
| 12/30/1998 | CN1203732A Surface mount socket for electronic package and contact for use therewith |
| 12/30/1998 | CN1203699A Shaftless roller for lead forming apparatus |
| 12/30/1998 | CN1203698A Method and device for chip assembly |
| 12/30/1998 | CN1203696A Method for processing semiconductor wafer, method for manufacturing IC card and carrier |
| 12/30/1998 | CN1203545A Process for manufacturing resin-encapsulated electronic product |
| 12/30/1998 | CN1203455A 半导体装置 Semiconductor device |
| 12/30/1998 | CN1203454A 多芯片模块 A multi-chip module |