| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/28/1999 | WO1999004430A1 Semiconductor flip-chip package and method for the fabrication thereof |
| 01/28/1999 | WO1999004429A1 Shape memory alloy heat sink |
| 01/28/1999 | WO1999004428A1 Method for producing a matrix from thin film transistors with storage capacities |
| 01/28/1999 | WO1999004427A1 Electrical bonding of a semiconductor junction |
| 01/28/1999 | WO1999004424A1 Semiconductor device, mounting structure thereof and method of fabrication thereof |
| 01/28/1999 | WO1999004423A1 Method and device for producing a chip-substrate assembly |
| 01/28/1999 | WO1999004422A1 Fusion-bond electrical feed-through |
| 01/28/1999 | WO1999004419A1 Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and ic card |
| 01/28/1999 | WO1999004415A2 Integrated circuit package |
| 01/28/1999 | WO1999004414A2 Heat dissipation in lead frames |
| 01/28/1999 | WO1999004367A1 Ic module, ic card, sealing resin for ic module, and method for manufacturing ic module |
| 01/28/1999 | WO1999003632A1 A coating used for manufacturing and assembling electronic components |
| 01/28/1999 | WO1999003597A1 Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
| 01/28/1999 | WO1998049718A3 Method of manufacturing a semiconductor device with a multilayer wiring |
| 01/28/1999 | DE19832976A1 Reception substrate for HF semiconductor component |
| 01/28/1999 | DE19830475A1 Manufacturing semiconductor component with several chips |
| 01/28/1999 | DE19814703A1 Filling semiconductor device trench and-or via with copper |
| 01/28/1999 | DE19800474A1 Conductive frame for integrated circuit with improved heat convection |
| 01/28/1999 | DE19751086A1 Semiconductor component multi-level interconnection structure production |
| 01/28/1999 | CA2265845A1 Ic module, ic card, sealing resin for ic module, and method for manufacturing ic module |
| 01/27/1999 | EP0893828A2 Heat sink |
| 01/27/1999 | EP0893825A1 Planarization method with a multilayer for integrated semiconductor electronic devices |
| 01/27/1999 | EP0893823A1 Semiconductor bonding and sealing structure |
| 01/27/1999 | EP0893822A2 Method to encapsulate metallic conductors of microelectronic components in plastic |
| 01/27/1999 | EP0893705A2 Method and system for reading data signal emitted by an active pixel in a sensor |
| 01/27/1999 | EP0893514A2 Aqueous solution for forming metallic complex, tin-silver alloy plating solution, and method of plating with said plating solution |
| 01/27/1999 | EP0892988A1 Integrated circuit protection device and method |
| 01/27/1999 | EP0892987A1 Method for manufacturing multi-chip modules utilizing direct lead attach |
| 01/27/1999 | EP0892986A1 Curing liquid resin encapsulants of microelectronics components with microwave energy |
| 01/27/1999 | EP0818024B1 Card-like data substrate |
| 01/27/1999 | CN2305756Y Sealing excitation power cabinet with bridge arm component structure |
| 01/27/1999 | CN2305755Y Quick assembling/disassembling and adjustable type IC radiating fin |
| 01/27/1999 | CN2305754Y Adjustable IC radiating fin's spring sheet for fixation |
| 01/27/1999 | CN1206499A Circuit structure having a flip-mounted matrix of devices |
| 01/27/1999 | CN1206498A Semiconductor device, method for manufacturing the same, circuit board, and flexible substrate |
| 01/27/1999 | CN1206497A Film carrier tape, tape carrier semiconductor device assembly, semiconductor device, its manufacturing method, package substrate, and electronic appliance |
| 01/27/1999 | CN1206496A Semiconductor device, method of its manufacture, circuit substrate, and film carrier tape |
| 01/27/1999 | CN1206494A Film carrier tape and semiconductor device, method for manufacturing them, and circuit board |
| 01/27/1999 | CN1206227A Method and apparatus for stress relieved electronic module |
| 01/27/1999 | CN1206226A Spherical grid array plugin unit |
| 01/27/1999 | CN1206223A Hump jointing method and device |
| 01/27/1999 | CN1205927A Pb-In-Sn tall C-4 for fatigue enhancement |
| 01/27/1999 | CN1041873C Semiconductor device and method for forming the same |
| 01/26/1999 | US5864776 Apparatus and method for detecting an error in the placement of a lead frame on a surface of a die mold |
| 01/26/1999 | US5864470 Flexible circuit board for ball grid array semiconductor package |
| 01/26/1999 | US5864466 Natural convection heat transferring apparatus |
| 01/26/1999 | US5864465 Device for cooling central processing units |
| 01/26/1999 | US5864464 Heat sink for integrated circuit |
| 01/26/1999 | US5864245 Output circuit with overvoltage protection |
| 01/26/1999 | US5864182 Battery mounted integrated circuit device |
| 01/26/1999 | US5864181 Bi-level digit line architecture for high density DRAMs |
| 01/26/1999 | US5864179 Aluminum like metal wiring for semiconductor devices |
| 01/26/1999 | US5864178 Semiconductor device with improved encapsulating resin |
| 01/26/1999 | US5864177 Bypass capacitors for chip and wire circuit assembly |
| 01/26/1999 | US5864176 Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces |
| 01/26/1999 | US5864175 Wrap-resistant ultra-thin integrated circuit package fabrication method |
| 01/26/1999 | US5864174 Semiconductor device having a die pad structure for preventing cracks in a molding resin |
| 01/26/1999 | US5864173 Multi-layer lead frame |
| 01/26/1999 | US5864172 Low dielectric constant insulation layer for integrated circuit structure and method of making same |
| 01/26/1999 | US5864170 Semiconductor device having bonding pad and scribe line |
| 01/26/1999 | US5864169 Semiconductor device including plated heat sink and airbridge for heat dissipation |
| 01/26/1999 | US5864165 Triangular semiconductor NAND gate |
| 01/26/1999 | US5864155 Semiconductor array with self-adjusted contacts |
| 01/26/1999 | US5864092 Leadless ceramic chip carrier crosstalk suppression apparatus |
| 01/26/1999 | US5864088 Electronic device having the electromagnetic interference suppressing body |
| 01/26/1999 | US5863970 Epoxy resin composition with cycloaliphatic epoxy-functional siloxane |
| 01/26/1999 | US5863835 Filling contact hole with first electroconductive material, forming recess in surrounding dielectric to expose outer sidewall of first electroconductive material, filling recess with second electroconductive material |
| 01/26/1999 | US5863834 Semiconductor device and method of manufacturing the same |
| 01/26/1999 | US5863832 Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system |
| 01/26/1999 | US5863825 Alignment mark contrast enhancement |
| 01/26/1999 | US5863817 Semiconductor device |
| 01/26/1999 | US5863816 Fabrication method for chip size semiconductor package |
| 01/26/1999 | US5863815 Method of manufacturing semiconductor device |
| 01/26/1999 | US5863814 Electronic package with compressible heatsink structure |
| 01/26/1999 | US5863813 Method of processing semiconductive material wafers and method of forming flip chips and semiconductor chips |
| 01/26/1999 | US5863812 Simplified chip size packaging |
| 01/26/1999 | US5863810 Method for encapsulating an integrated circuit having a window |
| 01/26/1999 | US5863805 Method of packaging semiconductor chips based on lead-on-chip (LOC) architecture |
| 01/26/1999 | US5863595 Applying a ceramic coating on an electronic substrate using alcohol solution of silica with vinyl alcohol colloidal silica and partial condensate of rsi(oh).sub.3 where r is selected from the group consisting |
| 01/21/1999 | WO1999003318A1 Clamping device, tool and method of mounting tools |
| 01/21/1999 | WO1999003317A1 Transporter for lead frames and transport assembly |
| 01/21/1999 | WO1999003153A2 Housing for at least one semiconductor body |
| 01/21/1999 | WO1999003130A1 Heat-transfer enhancing features for semiconductor carriers and devices |
| 01/21/1999 | WO1998045867A3 Unit for switching electrical energy |
| 01/21/1999 | DE19730118A1 Verfahren und Vorrichtung zur Herstellung einer Chip-Substrat-Verbindung Method and apparatus for producing a chip-substrate connection |
| 01/20/1999 | EP0892438A2 Solid-state relay |
| 01/20/1999 | EP0892434A2 RF IC package |
| 01/20/1999 | EP0892433A1 Method of forming an alignment mark in a semiconductor structure |
| 01/20/1999 | EP0892432A2 Pin arrangement for an SMD mountable hybrid circuit |
| 01/20/1999 | EP0892431A2 Heat radiating plate |
| 01/20/1999 | EP0892430A1 Process for manufacturing an integrated circuit comprising an array of memory cells |
| 01/20/1999 | EP0892428A2 Method of producing low resistance contacts between integrated circuit metal levels and structure produced thereby. |
| 01/20/1999 | EP0892027A1 Drop-resistant conductive epoxy adhesive |
| 01/20/1999 | EP0891648A1 Gas-insulated high-voltage semiconductor valve means |
| 01/20/1999 | EP0891633A1 Pcmcia memory card |
| 01/20/1999 | EP0891632A1 Calibration standard for calibrating a defect inspection system and a method of forming same |
| 01/20/1999 | EP0749674B1 Apparatus having inner layers supporting surface-mount components |
| 01/20/1999 | EP0651912B1 Wiring board with miniature housing for electronic components |
| 01/20/1999 | CN1205810A Electronic component, esp. one operating with acoustic surface waves (OFW component) |
| 01/20/1999 | CN1205800A Process for producing contacts on electrical components suitable for flip-chip assembly |