| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/09/1999 | US5869874 Field effect transistor with barrier layer |
| 02/09/1999 | US5869870 Electrostatic discharge (ESD) protective device for integrated circuit packages with no-connect pins |
| 02/09/1999 | US5869869 Integrated circuit |
| 02/09/1999 | US5869867 FET semiconductor integrated circuit device having a planar element structure |
| 02/09/1999 | US5869856 Field effect transistor |
| 02/09/1999 | US5869787 Electrically conductive projections |
| 02/09/1999 | US5869778 Powder metal heat sink for integrated circuit devices |
| 02/09/1999 | US5869395 Simplified hole interconnect process |
| 02/09/1999 | US5869393 Method for fabricating multi-level interconnection |
| 02/09/1999 | US5869392 Method of fabricating a semiconductor device including a plurality of contact regions disposed at different depths |
| 02/09/1999 | US5869390 Photolithographically forming a mask pattern on diamond layer, surface treatment with a plasma consisting at least one gas selected from helium, neon, argon, krypton, xenon and nitrogen, sputtering a metal film |
| 02/09/1999 | US5869386 Method of fabricating a composite silicon-on-insulator substrate |
| 02/09/1999 | US5869383 High contrast, low noise alignment mark for laser trimming of redundant memory arrays |
| 02/09/1999 | US5869357 Metallization and wire bonding process for manufacturing power semiconductor devices |
| 02/09/1999 | US5869356 Method and structure for constraining the flow of incapsulant applied to an I/C chip on a substrate |
| 02/09/1999 | US5869355 Lead frame with increased strength and manufacture of semiconductor device |
| 02/09/1999 | US5869354 Forming a etch stop layer in the substrate parallel to the principal surface, forming semiconductor on the principal surface, depositing a low stress dielectric membranes over semiconductor, etching etch barrier and a substrate portion |
| 02/09/1999 | US5869219 Purging deposition chamber with inert gas during coating of wafer with polyimide to reduce moisture content |
| 02/09/1999 | US5869149 Method for preparing nitrogen surface treated fluorine doped silicon dioxide films |
| 02/09/1999 | US5868949 Metalization structure and manufacturing method thereof |
| 02/09/1999 | US5868887 Method for minimizing warp and die stress in the production of an electronic assembly |
| 02/09/1999 | US5868304 Socketable bump grid array shaped-solder on copper spheres |
| 02/09/1999 | US5867990 Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms |
| 02/08/1999 | CA2225664A1 Liquid cooled dissipator for electronic components equipped with selectively arranged dissipation fins |
| 02/04/1999 | WO1999005722A1 Double-side, thermally conductive adhesive tape for plastic-packaged electronic components |
| 02/04/1999 | WO1999005721A1 Semiconductor chip packaging and method for the production thereof |
| 02/04/1999 | WO1999005717A1 Method for making an anisotropic conductive coating with conductive inserts |
| 02/04/1999 | WO1999005196A1 Thermosetting resin compositions useful as underfill sealants |
| 02/04/1999 | WO1998050949A3 Pbga stiffener package and method of manufacturing |
| 02/04/1999 | DE19834160A1 Semiconducting component manufacturing method |
| 02/04/1999 | DE19833245A1 Solid state LED light bulb for indicator |
| 02/04/1999 | DE19824225A1 Method of manufacturing a printed circuit board |
| 02/04/1999 | DE19741713C1 Encapsulation of semiconductor chip to form microelectronic package |
| 02/04/1999 | DE19733596A1 Apparel button containing electronic chip for clothing identification |
| 02/04/1999 | DE19733455A1 Active heat exchanger for cooling electronic components |
| 02/04/1999 | CA2296333A1 Semiconductor chip packaging and method for the production thereof |
| 02/04/1999 | CA2266314A1 Thermosetting resin compositions useful as underfill sealants |
| 02/03/1999 | EP0895449A2 Electrically conductive gasket and method of manuacturing the same |
| 02/03/1999 | EP0895289A2 Digital circuit in MOS Technology |
| 02/03/1999 | EP0895288A2 Electrode line for semiconducor device and method of manufacturing it |
| 02/03/1999 | EP0895287A2 Semiconductor device and lead frame for the same |
| 02/03/1999 | EP0895286A2 Semiconductor power componant with pressure compensating contact plate |
| 02/03/1999 | EP0895285A2 Amorphous hydrogenated carbon hermetic structure and fabrication method |
| 02/03/1999 | EP0895284A1 Metal-ceramic composite circuit substrates |
| 02/03/1999 | EP0895282A2 Method of preparing a SOI substrate by using a bonding process, and SOI substrate produced by the same |
| 02/03/1999 | EP0895281A1 Two-step projecting bump for semiconductor chip and method for forming the same |
| 02/03/1999 | EP0895280A2 Method for forming different regions with high and low resistance values in a single polycrystalline silicon layer and structure produced by the same |
| 02/03/1999 | EP0895110A2 Air-tightly sealed container for photosemiconductors, and photosemiconductor module |
| 02/03/1999 | EP0894339A1 Silicon carbide cmos and method of fabrication |
| 02/03/1999 | EP0852774B1 Chip module |
| 02/03/1999 | EP0828582A4 Ribbon-like core interconnection elements |
| 02/03/1999 | EP0623957B1 Lead frame manufacturing method |
| 02/03/1999 | CN1207206A Wavelength conversion pouring material, its use and manufacturing method |
| 02/03/1999 | CN1207015A Heat sink for electronic device |
| 02/03/1999 | CN1206936A Semiconductor device and making method thereof |
| 02/03/1999 | CN1041980C Anisotropic conductive film, manufacturing method and connector using the same |
| 02/02/1999 | USRE36077 Method of manufacturing inversion type IC's and IC module using same |
| 02/02/1999 | US5867368 Mounting for a semiconductor integrated circuit device |
| 02/02/1999 | US5867367 Quad flat pack integrated circuit package |
| 02/02/1999 | US5867365 CPU heat sink assembly |
| 02/02/1999 | US5867074 Surface acoustic wave resonator, surface acoustic wave resonator unit, surface mounting type surface acoustic wave resonator unit |
| 02/02/1999 | US5866953 Packaged die on PCB with heat sink encapsulant |
| 02/02/1999 | US5866952 High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate |
| 02/02/1999 | US5866950 Semiconductor package and fabrication method |
| 02/02/1999 | US5866949 Chip scale ball grid array for integrated circuit packaging |
| 02/02/1999 | US5866948 Interposer for semiconductor device |
| 02/02/1999 | US5866947 Post tungsten etch bank anneal, to improve aluminum step coverage |
| 02/02/1999 | US5866946 Semiconductor device having a plug for diffusing hydrogen into a semiconductor substrate |
| 02/02/1999 | US5866944 Multichip press-contact type semiconductor device |
| 02/02/1999 | US5866943 System and method for forming a grid array device package employing electomagnetic shielding |
| 02/02/1999 | US5866942 Metal base package for a semiconductor device |
| 02/02/1999 | US5866941 Ultra thin, leadless and molded surface mount integrated circuit package |
| 02/02/1999 | US5866940 Semiconductor device |
| 02/02/1999 | US5866939 Lead end grid array semiconductor package |
| 02/02/1999 | US5866938 Semiconductor device equipped with antifuse elements and a method for manufacturing an FPGA |
| 02/02/1999 | US5866937 Double half via antifuse |
| 02/02/1999 | US5866933 Integrated circuit security system and method with implanted interconnections |
| 02/02/1999 | US5866927 Integrated circuit devices having contact pads which are separated by sidewall spacers |
| 02/02/1999 | US5866923 Semiconductor integrated circuit device having fundamental cells and method of manufacturing the semiconductor integrated circuit device using the fundamental cells |
| 02/02/1999 | US5866920 Semiconductor device and manufacturing method of the same |
| 02/02/1999 | US5866476 Methods for forming moisture blocking layers |
| 02/02/1999 | US5866470 Method of using an interface layer for stacked lamination sizing and sintering |
| 02/02/1999 | US5866465 Semiconductor processing method of forming a contact opening to a region adjacent a field isolation mass |
| 02/02/1999 | US5866444 Integrated circuit and method of fabricating the same |
| 02/02/1999 | US5866442 Method and apparatus for filling a gap between spaced layers of a semiconductor |
| 02/02/1999 | US5866441 Inverted chip bonded module with high packaging efficiency |
| 02/02/1999 | US5866250 Adhesive tape for electronic parts and liquid adhesive |
| 02/02/1999 | US5866240 Thick ceramic on metal multilayer circuit board |
| 02/02/1999 | US5866237 Organic electronic package and method of applying palladium-tin seed layer thereto |
| 02/02/1999 | US5866203 Bonding strength |
| 02/02/1999 | US5866044 Lead free conductive composites for electrical interconnections |
| 02/02/1999 | US5866020 Method of manufacturing TAB tapes and laminated body for producing the same |
| 02/02/1999 | US5865632 Semiconductor package socket |
| 02/02/1999 | US5865365 Method of fabricating an electronic circuit device |
| 02/02/1999 | US5865031 Heat exchange device having thermoelectric device |
| 02/02/1999 | US5864946 Method of making contact tip structures |
| 02/02/1999 | US5864943 IC mounting/demounting system and mounting/demounting head therefor |
| 01/28/1999 | WO1999004453A1 Contact and method for producing a contact |
| 01/28/1999 | WO1999004432A1 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame |
| 01/28/1999 | WO1999004431A1 Integrated circuit and method for the production thereof |