| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/17/1999 | CN1208501A Electronic power module, and electronic power system comprising a plurality of same |
| 02/17/1999 | CN1208368A Fabricating interconnects and tips using sacrificial substrates |
| 02/17/1999 | CN1208253A Integrated circuit package and semi-conductor component |
| 02/17/1999 | CN1208252A Semiconductor device and its manufacturing method |
| 02/17/1999 | CN1042181C Inverter apparatus |
| 02/16/1999 | USRE36097 Semiconductor package for a semiconductor chip having centrally located bottom bond pads |
| 02/16/1999 | US5872952 Integrated circuit power net analysis through simulation |
| 02/16/1999 | US5872803 Laser diode pumped solid-state laser apparatus |
| 02/16/1999 | US5872700 Multi-chip module package with insulating tape having electrical leads and solder bumps |
| 02/16/1999 | US5872697 Integrated circuit having integral decoupling capacitor |
| 02/16/1999 | US5872695 Integrated electronic components having conductive filled through holes |
| 02/16/1999 | US5872449 Circuit die for use in an environmental test chamber and with a tester |
| 02/16/1999 | US5872405 Laser wire bonding for wire embedded dielectrics to integrated circuits |
| 02/16/1999 | US5872404 Interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating |
| 02/16/1999 | US5872403 Package for a power semiconductor die and power supply employing the same |
| 02/16/1999 | US5872402 Interlayer insulating film for semiconductor device |
| 02/16/1999 | US5872401 Deposition of an inter layer dielectric formed on semiconductor wafer by sub atmospheric CVD |
| 02/16/1999 | US5872400 High melting point solder ball coated with a low melting point solder |
| 02/16/1999 | US5872399 Solder ball land metal structure of ball grid semiconductor package |
| 02/16/1999 | US5872398 Reduced stress LOC assembly including cantilevered leads |
| 02/16/1999 | US5872397 Semiconductor device package including a thick integrated circuit chip stack |
| 02/16/1999 | US5872396 Semiconductor device with plated heat sink |
| 02/16/1999 | US5872395 Bent tip method for preventing vertical motion of heat spreaders during injection molding of IC packages |
| 02/16/1999 | US5872394 Lead frame |
| 02/16/1999 | US5872393 Flip-chip mounting, radio frequency, polybenzocyclobutene dielectric film |
| 02/16/1999 | US5872390 For a semiconductor device |
| 02/16/1999 | US5872389 Semiconductor device having a fuse layer |
| 02/16/1999 | US5872385 Conductive interconnect structure and method of formation |
| 02/16/1999 | US5872380 Hexagonal sense cell architecture |
| 02/16/1999 | US5872338 For supporting one or more electronic components |
| 02/16/1999 | US5872337 Chip carrier and cable assembly reinforced at edges |
| 02/16/1999 | US5872194 Electronic parts with cured coatings in liquid form |
| 02/16/1999 | US5872065 Method for depositing low K SI-O-F films using SIF4 /oxygen chemistry |
| 02/16/1999 | US5872064 Plasma enhanced chemical vapor deposition |
| 02/16/1999 | US5872053 Forming electrical connections between levels of a semiconductor device. |
| 02/16/1999 | US5872051 Process for transferring material to semiconductor chip conductive pads using a transfer substrate |
| 02/16/1999 | US5872050 Semiconductor device and method of manufacturing thereof |
| 02/16/1999 | US5872042 Method for alignment mark regeneration |
| 02/16/1999 | US5872026 Process of fabricating an integrated circuit die package having a plurality of pins |
| 02/16/1999 | US5872018 Testchip design for process analysis in sub-micron DRAM fabrication |
| 02/16/1999 | US5871842 For preventing contaminants from permeating through the substrate silicon rubber keypad |
| 02/16/1999 | US5871819 Two step coating; partially curing thermosetting resin/solvent mixture; filling, covering, curing again; printed circuits |
| 02/16/1999 | US5871151 Radiant hydronic bed warmer |
| 02/16/1999 | US5871043 Cooling apparatus using boiling and condensing refrigerant |
| 02/16/1999 | US5871042 To provide thermal transfer with a structure in an ambient fluid environment |
| 02/16/1999 | US5870823 Method of forming a multilayer electronic packaging substrate with integral cooling channels |
| 02/16/1999 | US5870822 Flip chip attachment |
| 02/16/1999 | US5870820 IC mounting/demounting system and mounting/demounting head therefor |
| 02/16/1999 | CA2116766C Solder bump fabrication method and solder bumps formed thereby |
| 02/11/1999 | WO1999007197A1 Heat spreader for electronic ballast |
| 02/11/1999 | WO1999007196A2 Heat sink |
| 02/11/1999 | WO1999007016A1 Wafer marking |
| 02/11/1999 | WO1999007014A1 Interposer/adhesive composite |
| 02/11/1999 | WO1999006947A1 Method for producing a chip module |
| 02/11/1999 | WO1999006782A1 Apparatus and method for cooling an electronic component using a porous material |
| 02/11/1999 | DE19834640A1 Multilayer conducting track substrate for integrated hybrid circuit |
| 02/11/1999 | DE19752196C1 Semiconductor component, especially smart switch in car and industrial electronics |
| 02/10/1999 | EP0896501A2 Mounting structure for one or more semiconductor devices |
| 02/10/1999 | EP0896368A1 Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment |
| 02/10/1999 | EP0896367A2 Packaging power semiconductors |
| 02/10/1999 | EP0896365A1 Method of manufactruing MOSFETs with self-aligned silicide contacts |
| 02/10/1999 | EP0895486A1 Grafted thermoplastic elastomer barrier layer |
| 02/10/1999 | CN2307369Y Three phase controllable commutating bridge clamping device |
| 02/10/1999 | CN2307368Y Integrated circuit radiation fastener |
| 02/10/1999 | CN1207586A Protection layer for laser blown fuses |
| 02/10/1999 | CN1207585A Semiconductor device and its lead frame |
| 02/10/1999 | CN1207584A Power semiconductor device with pressure compensation contact plate |
| 02/10/1999 | CN1207583A Semiconductor device and wiring tape for semiconductor device |
| 02/10/1999 | CN1207580A Semiconductor device and method of forming semiconductor device |
| 02/09/1999 | USRE36087 Method and system for decoupling inoperative passive elements on a semiconductor chip |
| 02/09/1999 | US5870574 System and method for fetching multiple groups of instructions from an instruction cache in a RISC processor system for execution during separate cycles |
| 02/09/1999 | US5870352 DC monitor for active device speed |
| 02/09/1999 | US5870310 Method and apparatus for designing re-usable core interface shells |
| 02/09/1999 | US5870289 Chip connection structure having diret through-hole connections through adhesive film and wiring substrate |
| 02/09/1999 | US5870287 Spring clip for mounting a heat sink to an electronic component |
| 02/09/1999 | US5870286 Heat sink assembly for cooling electronic modules |
| 02/09/1999 | US5870285 Assembly mounting techniques for heat sinks in electronic packaging |
| 02/09/1999 | US5869906 Registration accuracy measurement mark for semiconductor devices |
| 02/09/1999 | US5869905 Molded packaging for semiconductor device and method of manufacturing the same |
| 02/09/1999 | US5869904 Semiconductor device having a projecting electrode |
| 02/09/1999 | US5869903 Sealed semiconductor device including opposed substrates and metal wall |
| 02/09/1999 | US5869902 Semiconductor device and manufacturing method thereof |
| 02/09/1999 | US5869901 Semiconductor device having aluminum interconnection and method of manufacturing the same |
| 02/09/1999 | US5869898 Lead-frame having interdigitated signal and ground leads with high frequency leads positioned adjacent a corner and shielded by ground leads on either side thereof |
| 02/09/1999 | US5869897 Mounting arrangement for securing an intergrated circuit package to heat sink |
| 02/09/1999 | US5869896 Packaged electronic module and integral sensor array |
| 02/09/1999 | US5869895 Embedded memory assembly |
| 02/09/1999 | US5869894 RF IC package |
| 02/09/1999 | US5869893 Semiconductor device having a trapezoidal joint chip |
| 02/09/1999 | US5869891 Powdered metal heat sink with increased surface area |
| 02/09/1999 | US5869890 Ceramic core plate having improved flexural strength containing alumina as main component with zirconia and atleast one additive selected from yttria, calcia, magnesia and ceria; improved toughness against deflection |
| 02/09/1999 | US5869889 Thin power tape ball grid array package |
| 02/09/1999 | US5869888 Semiconductor device with lead structure on principal surface of chip |
| 02/09/1999 | US5869887 Semiconductor package fabricated by using automated bonding tape |
| 02/09/1999 | US5869886 Flip chip semiconductor mounting structure with electrically conductive resin |
| 02/09/1999 | US5869884 Semiconductor device having lead terminal on only one side of a package |
| 02/09/1999 | US5869883 Packaging of semiconductor circuit in pre-molded plastic package |
| 02/09/1999 | US5869880 For use in integrated circuit chips |
| 02/09/1999 | US5869878 Semiconductor device with temperature detecting diode, method of forming the device and temperature detecting method using the device |
| 02/09/1999 | US5869877 Methods and apparatus for detecting pattern dependent charging on a workpiece in a plasma processing system |