| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/02/1999 | US5877031 Method for forming a metallic barrier layer in semiconductor device |
| 03/02/1999 | US5876859 Direct metal bonding |
| 03/02/1999 | US5876842 Modular circuit package having vertically aligned power and signal cores |
| 03/02/1999 | US5876841 Conductive paste and conductor and ceramic substrate comprising the same |
| 03/02/1999 | US5876819 Crystal orientation detectable semiconductor substrate, and methods of manufacturing and using the same |
| 03/02/1999 | US5876795 Method for producing a low-stress electrolessly deposited nickel layer |
| 03/02/1999 | US5876536 Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate |
| 03/02/1999 | US5875545 Method of mounting a connection component on a semiconductor chip with adhesives |
| 03/02/1999 | CA2139266C Semiconductor package |
| 02/25/1999 | WO1999009599A2 Vertical interconnect process for silicon segments with dielectric isolation |
| 02/25/1999 | WO1999009595A1 Multichip module structure and method for manufacturing the same |
| 02/25/1999 | WO1999009594A1 Sintered heat sink |
| 02/25/1999 | WO1999009593A1 Dual damascene metallization |
| 02/25/1999 | WO1999009592A1 Flip-chip semiconductor package and method for manufacturing the same |
| 02/25/1999 | WO1999009591A1 Component with protective layer and method for producing a protective layer for a component |
| 02/25/1999 | WO1999009590A1 Method for forming bump electrode and method for manufacturing semiconductor device |
| 02/25/1999 | WO1999009366A1 Heat sink including pedestal |
| 02/25/1999 | WO1999008821A1 Method for producing a cooling element, and a cooling element |
| 02/25/1999 | WO1998053447A3 Method of manufacturing a body having a structure of layers |
| 02/25/1999 | WO1998042169A3 Device for dissipating heat from a heat source located in a housing |
| 02/25/1999 | DE19831876A1 Producing contact between flexible conductor and substrate |
| 02/25/1999 | DE19803670A1 Semiconductor component for single-chip microcomputer |
| 02/25/1999 | DE19741921A1 Carrier element for semiconductor chip card data type carrier |
| 02/25/1999 | DE19733731A1 Integrierte elektrische Schaltung mit Passivierungsschicht Integrated electrical circuit with passivation |
| 02/24/1999 | EP0898311A2 Surface mounting type semiconductor package mounted on a multilayer mounting substrate |
| 02/24/1999 | EP0898310A2 Heat sink for semiconductors and manufacturing process thereof |
| 02/24/1999 | EP0898309A2 An integrated circuit anti-bridging leads design |
| 02/24/1999 | EP0897595A1 Electric component in integrated circuit form for hot insertion in a substrate and methods for manufacturing same |
| 02/24/1999 | EP0705484B1 Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element |
| 02/24/1999 | EP0667036B1 Chip interconnection having a breathable etch stop layer |
| 02/24/1999 | CN1209217A Secure semiconductor device |
| 02/24/1999 | CN1208993A Electric component apparatus having electronic component device located on face surface of package member with space therebetween |
| 02/24/1999 | CN1208962A 半导体存储器 Semiconductor memory |
| 02/24/1999 | CN1208961A Surface mounting type semiconductor package mounted on multiplayer mounting substrate |
| 02/24/1999 | CN1208960A Power semiconductor modular for cooling means having inlegration with sub-modular mode |
| 02/24/1999 | CN1208959A High-frequency integrated circuit device and mfr. method thereof |
| 02/24/1999 | CN1208956A Integrated circuits and mfg. methods |
| 02/24/1999 | CN1208955A IC-mounted structre, liquid crystal device and electronic device |
| 02/24/1999 | CN1208952A Method of reducing loading variation during etch processing |
| 02/24/1999 | CN1208857A Semiconductor device |
| 02/23/1999 | US5875102 Eclipse via in pad structure |
| 02/23/1999 | US5875100 High-density mounting method and structure for electronic circuit board |
| 02/23/1999 | US5875097 Heat sink for auxiliary circuit board |
| 02/23/1999 | US5875096 Apparatus for heating and cooling an electronic device |
| 02/23/1999 | US5875095 Computer having a heat sink structure incorporated therein |
| 02/23/1999 | US5874883 Planar-type inductor and fabrication method thereof |
| 02/23/1999 | US5874784 Semiconductor device having external connection terminals provided on an interconnection plate and fabrication process therefor |
| 02/23/1999 | US5874783 Semiconductor device having the inner end of connector leads displaced onto the surface of semiconductor chip |
| 02/23/1999 | US5874782 Wafer with elevated contact structures |
| 02/23/1999 | US5874780 Method of mounting a semiconductor device to a substrate and a mounted structure |
| 02/23/1999 | US5874779 Semiconductor device with improved adhesion between titanium-based metal wiring layer and insulation film |
| 02/23/1999 | US5874778 Embedded power and ground plane structure |
| 02/23/1999 | US5874777 Semiconductor device with enhanced thermal conductivity |
| 02/23/1999 | US5874776 Chip carrier |
| 02/23/1999 | US5874775 Diamond heat sink including microchannel therein and methods for manufacturing diamond heat sinks |
| 02/23/1999 | US5874774 Flat package semiconductor device |
| 02/23/1999 | US5874773 Semiconductor device |
| 02/23/1999 | US5874771 Punch-through resistor |
| 02/23/1999 | US5874770 Flexible interconnect film including resistor and capacitor layers |
| 02/23/1999 | US5874750 Pressure-contact type semiconductor device |
| 02/23/1999 | US5874516 Nonfunctionalized poly(arylene ethers) |
| 02/23/1999 | US5874378 Low temperature fired crystal structure having rare earth-aluminum garnet crystalline phase precipitated on grain boundaries; alkali resistance, thermoconductivity |
| 02/23/1999 | US5874370 Substrate comprising sheet of cloth coated with partly cured first thermosettting resin having better adhesion to cloth, b-stage cured second resin having better adhesion to metal, laminated between two sheets of metal and fully cured |
| 02/23/1999 | US5874359 Photolithography; non-short circuiting |
| 02/23/1999 | US5874358 Undercut etching into composite electroconductive layer beneath dielectric layer and filling aperture with conductor material to form interlocking connection |
| 02/23/1999 | US5874357 Method of forming wiring structure of semiconductor device |
| 02/23/1999 | US5874356 Method for forming zig-zag bordered openings in semiconductor structures |
| 02/23/1999 | US5874323 Method of providing electrical contact to component leads |
| 02/23/1999 | US5874322 Method and apparatus for applying atomized adhesive to a leadframe for chip bonding |
| 02/23/1999 | US5874321 Package integrated circuit having thermal enhancement and reduced footprint size |
| 02/23/1999 | US5874318 Dishing and erosion monitor structure for damascene metal processing |
| 02/23/1999 | US5874201 Dual damascene process having tapered vias |
| 02/23/1999 | US5873741 Socket for connecting an integrated circuit to a printed wiring board |
| 02/23/1999 | US5873406 Heat dissipation device |
| 02/23/1999 | US5873258 Sorption refrigeration appliance |
| 02/23/1999 | US5873162 Technique for attaching a stiffener to a flexible substrate |
| 02/23/1999 | US5873161 Method of making a Z axis interconnect circuit |
| 02/23/1999 | CA2074648C Polyimide multilayer wiring substrate and method for manufacturing the same |
| 02/23/1999 | CA2044497C Surface treating agent for aluminum line pattern substrate |
| 02/18/1999 | WO1999008495A2 Method of manufacturing surface-mountable sil hybrid circuit |
| 02/18/1999 | WO1999008326A1 Power transistor cell |
| 02/18/1999 | WO1999008325A2 Electrode means, with or without functional elements and an electrode device formed of said means |
| 02/18/1999 | WO1999008323A1 Rf power device having voltage controlled linearity |
| 02/18/1999 | WO1999008322A1 Semiconductor with metal coating on its rear surface |
| 02/18/1999 | WO1999008321A1 Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same |
| 02/18/1999 | WO1999008320A1 Resin-sealed surface mounting type electronic parts |
| 02/18/1999 | WO1999008318A1 Method for producing an interconnection path through a semiconductor material |
| 02/18/1999 | WO1999008317A1 Integrated electric circuit with a passivation layer |
| 02/18/1999 | WO1999008307A1 Method for monitoring the performance of an ion implanter using reusable wafers |
| 02/18/1999 | WO1998032159A3 Mounting structure and mounting process from semiconductor devices |
| 02/18/1999 | DE19739231A1 Aluminium@-germanium@-copper@ alloy sputter deposition |
| 02/18/1999 | DE19734509A1 Leistungstransistorzelle Power transistor cell |
| 02/18/1999 | DE19733412A1 Semiconductor wafer identification marking device |
| 02/18/1999 | DE19733411A1 Semiconductor wafer identification method |
| 02/18/1999 | DE19733410A1 Wafermarkierung Wafer marking |
| 02/18/1999 | DE19732439A1 Power semiconductor element e.g. MOSFET mounted on heat sink operated in pulse mode |
| 02/18/1999 | DE19730865A1 Heat sink for an electronic component especially a ceramic circuit board |
| 02/17/1999 | EP0897256A1 Semiconductor device |
| 02/17/1999 | EP0897193A2 Process of making a multilevel metallization scheme with high planarization degree |
| 02/17/1999 | CN1208502A High-power microwave-frequency hybrid integrated circuit |