Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1999
03/09/1999US5880026 Method for air gap formation by plasma treatment of aluminum interconnects
03/09/1999US5880024 Semiconductor device having wiring self-aligned with shield structure and process of fabrication thereof
03/09/1999US5880023 Process for formation of wiring layer in semiconductor device
03/09/1999US5880021 Method of making multilevel interconnections of electronic parts
03/09/1999US5880020 Forming a contact hole which will connect to a transistor and a contact hole for local connection which will connect locations simultaneously when filled with conductive plugs, insulating, exposing surface of plug; simplification
03/09/1999US5880018 Method for manufacturing a low dielectric constant inter-level integrated circuit structure
03/09/1999US5880017 Method of bumping substrates by contained paste deposition
03/09/1999US5880016 Method for adjusting the circuit characteristic of a circuit body by cutting wires external to the circuit body
03/09/1999US5880011 Method and apparatus for manufacturing pre-terminated chips
03/09/1999US5880010 Ultrathin electronics
03/09/1999US5880007 Planarization of a non-conformal device layer in semiconductor fabrication
03/09/1999US5879981 Method of fabricating a semiconductor memory device
03/09/1999US5879979 Method of manufacturing a semiconductor device containing CMOS elements
03/09/1999US5879966 Method of making an integrated circuit having an opening for a fuse
03/09/1999US5879965 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
03/09/1999US5879964 Several wafer strips of pretested chips are bonded to a thermoplastic adhesive-coated polymer film so that the upper surface of each chip is attached to the polymer film, which acts as an insulator; reliability, simple, inexpensive
03/09/1999US5879838 Preventing lifting of photoresist film
03/09/1999US5879808 Parylene polymer layers
03/09/1999US5879788 Silver-palladium conductor, lead borosilicate glass, gold conductor
03/09/1999US5879787 Method and apparatus for improving wireability in chip modules
03/09/1999US5879786 Constraining ring for use in electronic packaging
03/09/1999US5879761 Method for forming electrically conductive polymer interconnects on electrical substrates
03/09/1999US5879530 Annealing a multilayer film comprising metal and polymer layers
03/09/1999US5878486 Method of burning-in semiconductor devices
03/09/1999US5878485 Method for fabricating a carrier for testing unpackaged semiconductor dice
03/04/1999WO1999011107A1 Assembly consisting of a substrate for power components and a cooling element and method for the production thereof
03/04/1999WO1999011106A1 A chip supporting element and use thereof
03/04/1999WO1999010929A2 A method of providing a vertical interconnect between thin film microelectronic devices
03/04/1999WO1999010928A1 Semiconductor device and method of fabricating the same
03/04/1999WO1999010926A1 Method for producing electrically conductive cross connections between two layers of wiring on a substrate
03/04/1999WO1999010925A1 Vertical interconnect process for silicon segments with thermally conductive epoxy preform
03/04/1999WO1999010921A1 Method of forming a barrier layer in a contact structure
03/04/1999WO1999010916A2 Copper electroless deposition on a titanium-containing surface
03/04/1999WO1999010734A1 Method and device for determining a parameter for a metallization bath
03/04/1999WO1998055669A3 Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same
03/04/1999DE19837336A1 Encapsulating integrated circuits assembled on a substrate
03/04/1999DE19817128A1 Conductive base plate for semiconductor component lead frame
03/04/1999DE19736962A1 Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben Arrangement comprising a carrier substrate for power components and a heat sink and method for manufacturing the same
03/04/1999DE19736197C1 IC has supply voltage smoothing capacitors
03/04/1999DE19736186A1 Fuse production on a semiconductor body e.g. a memory circuit
03/04/1999DE19736184A1 Fuse production on a semiconductor body e.g. a memory circuit
03/04/1999DE19736090A1 Bauelement mit Schutzschicht und Verfahren zur Herstellung des Bauelements Component with a protective layer, and method for manufacturing the component
03/03/1999EP0899992A2 Embedded thin film passive components
03/03/1999EP0899789A1 Overvoltage protection element
03/03/1999EP0899788A2 Semiconductor device and method with improved flat surface
03/03/1999EP0899787A2 Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structurs formed thereby
03/03/1999EP0899786A2 Silicon semiconductor device with an electrode structure and circuit board having the device mounted thereon
03/03/1999EP0898857A2 Method for connecting area grid arrays to printed wire board
03/03/1999EP0898786A1 Method and apparatus for programming anti-fuses using internally generated programming voltage
03/03/1999EP0898712A2 Wafer-level burn-in and test
03/03/1999EP0698290B1 Power semiconductor device with stress buffer layer
03/03/1999CN1209943A Cooling plate having uniform pressure drop and uniform flow rate
03/03/1999CN1209657A Semiconductor device and mfg. method therefor
03/03/1999CN1209655A Lead frame for multiple chips packing and mfg. method therefor
03/03/1999CN1209654A Semiconductor device having alternative long soldering plate and short soldering plate
03/03/1999CN1209650A Semiconductor device and mfg. method therefor
03/03/1999CN1209649A Winding automatic-welding spherical-array type integrated circuit packing method
03/03/1999CN1209643A Alignment method
03/03/1999CN1042376C Device and method for fitting semiconductor device on to radiator
03/02/1999US5878322 Heat-dissipating substrate for micro-electronic devices and fabrication method
03/02/1999US5877941 IC card and method of fabricating the same
03/02/1999US5877937 Encapsulated semiconductor device and electronic circuit board mounting same
03/02/1999US5877929 Break display apparatus for semiconductor switching element incorporating overcurrent/overheating protection function
03/02/1999US5877833 Interconnection structure with raised perimeter portions
03/02/1999US5877562 Photo alignment structure
03/02/1999US5877561 Plate and column type semiconductor package having heat sink
03/02/1999US5877560 Flip chip microwave module and fabrication method
03/02/1999US5877559 Film carrier for fine-pitched and high density mounting and semiconductor device using same
03/02/1999US5877557 Low temperature aluminum nitride
03/02/1999US5877556 Structure for composite bumps
03/02/1999US5877555 Direct contact die attach
03/02/1999US5877554 Converter socket terminal
03/02/1999US5877553 Metallic electronic component packaging arrangement
03/02/1999US5877552 Semiconductor package for improving the capability of spreading heat and electrical function
03/02/1999US5877551 Semiconductor package having a ground or power ring and a metal substrate
03/02/1999US5877550 Hybrid module and method of manufacturing the same
03/02/1999US5877549 UFBGA package equipped with interface assembly including a photosoluble layer
03/02/1999US5877548 Terminal configuration in semiconductor IC device
03/02/1999US5877547 Active security device including an electronic memory
03/02/1999US5877544 Electronic micropackage for an electronic memory card
03/02/1999US5877543 Device assembly structure with reinforced outer leads
03/02/1999US5877542 Plastic molded type semiconductor device
03/02/1999US5877541 Contact structure for improving photoresist adhesion on a dielectric layer
03/02/1999US5877516 Bonding of silicon carbide directly to a semiconductor substrate by using silicon to silicon bonding
03/02/1999US5877507 Optical detection device and lighting method with varied irradiation angle in optical detection process
03/02/1999US5877478 Semiconductor device and method of manufacturing the same
03/02/1999US5877095 Method of fabricating a semiconductor device having a silicon nitride film made of silane, ammonia and nitrogen
03/02/1999US5877093 Process for coating an integrated circuit device with a molten spray
03/02/1999US5877086 Metal planarization using a CVD wetting film
03/02/1999US5877085 Method of manufacturing semiconductor device
03/02/1999US5877084 Germanium, aluminum, alloying
03/02/1999US5877083 Method of manufacturing a semiconductor device
03/02/1999US5877082 Method of manufacturing semiconductor device without plasma damage
03/02/1999US5877081 Method of manufacturing semiconductor device
03/02/1999US5877080 Method of manufacturing semiconductor device
03/02/1999US5877078 Method of manufacturing a semiconductor device
03/02/1999US5877064 Method for marking a wafer
03/02/1999US5877043 Electronic package with strain relief means and method of making
03/02/1999US5877042 Glass/Metal package and method for producing the same
03/02/1999US5877037 Process for reducing bond resistance in semiconductor devices and circuits
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