Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1999
03/16/1999US5883435 Personalization structure for semiconductor devices
03/16/1999US5883434 Semiconductor device having capped contact plug capable of suppressing increase of resistance
03/16/1999US5883433 Semiconductor device having a critical path wiring
03/16/1999US5883432 Connection structure between electrode pad on semiconductor device and printed pattern on printed circuit board
03/16/1999US5883431 Device with power semiconductor components
03/16/1999US5883430 Thermally enhanced flip chip package
03/16/1999US5883429 Chip cover
03/16/1999US5883428 Package for housing a semiconductor element
03/16/1999US5883427 Semiconductor device power supply wiring structure
03/16/1999US5883426 Stack module
03/16/1999US5883425 Circuit device
03/16/1999US5883424 Lead frame for hollow plastic package
03/16/1999US5883422 Reduced parasitic capacitance semiconductor devices
03/16/1999US5883418 Layer is formed on a gate electrode and source/drain regions, gate electrode layer is not damaged even if a contact hole is formed in a planarized insulating layer
03/16/1999US5883398 Device having a switch comprising a chromium layer and method for depositing chromium layers by sputtering
03/16/1999US5883386 Light-receiving apparatus having a position detectable portion on a sealing frame and its manufacturing method
03/16/1999US5883335 Electrical connection substrate having a through hole for connecting a chip to an opposite surface of the substrate
03/16/1999US5883219 Comprising substrate, metallic circuit lines positioned on substrate, and porous dielectric material positioned on the circuit lines; the dielectric material comprises the reaction product of an organic polysilica and polyamic ester
03/16/1999US5883008 Integrated circuit die suitable for wafer-level testing and method for forming the same
03/16/1999US5883007 Methods and apparatuses for improving photoresist selectivity and reducing etch rate loading
03/16/1999US5883003 Method for producing a semiconductor device comprising a refractory metal silicide layer
03/16/1999US5883001 Adapted for uv erase eproms.
03/16/1999US5883000 Circuit device interconnection by direct writing of patterns therein
03/16/1999US5882998 Low power programmable fuse structures and methods for making the same
03/16/1999US5882980 Process of forming bipolar alignment mark for semiconductor
03/16/1999US5882963 Method of manufacturing semiconductor components
03/16/1999US5882957 Without drilling through-holes and filling the holes with conductive paste.
03/16/1999US5882956 Process for producing semiconductor device
03/16/1999US5882955 Leadframe for integrated circuit package and method of manufacturing the same
03/16/1999US5882722 Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
03/16/1999US5882459 Method for aligning and laminating substrates to stiffeners in electrical circuits
03/16/1999US5882399 Method of forming a barrier layer which enables a consistently highly oriented crystalline structure in a metallic interconnect
03/16/1999US5881945 Multi-layer solder seal band for semiconductor substrates and process
03/16/1999US5881944 Multi-layer solder seal band for semiconductor substrates
03/16/1999US5881800 Heat sink fastener
03/11/1999WO1999012404A1 Flexible circuits and carriers and process for manufacture
03/11/1999WO1999012204A1 Device with security integrated circuit and method for making same
03/11/1999WO1999012203A1 Semiconductor device and method for manufacturing the same
03/11/1999WO1999012202A1 Spring clamp assembly for thermal stacked components
03/11/1999WO1999012201A1 Moisture proofing for borate glass semiconductor passivation layers
03/11/1999WO1999012200A1 Method for making a semiconductor chip or a wafer with protective layer
03/11/1999WO1999012199A1 Packaged integrated circuit
03/11/1999WO1999012197A1 Compression bonded semiconductor device and power converter using the same
03/11/1999WO1999012174A1 Electrical component with a jacket and a connection area located in said jacket
03/11/1999WO1999011455A1 A thermal storage and transfer device
03/11/1999WO1998054377A3 Stress tuned tantalum and tantalum nitride films
03/11/1999WO1998043296A3 Device for low-inductive coupling of a gate turn-off thyristor to its control device
03/11/1999DE19828489A1 Semiconductor component has a multilayer plastic substrate
03/11/1999DE19828486A1 Semiconductor component with ball grid substrate (BGA)
03/11/1999DE19828386A1 Semiconductor component with laminated ball grid array (BGA) substrate
03/11/1999DE19821917A1 Semiconductor device has a lead wiring
03/11/1999DE19821916A1 Packaged semiconductor device has a ball grid array substrate
03/11/1999DE19817129A1 Semiconductor device has flanged contact via
03/11/1999DE19815136A1 DRAM integrated semiconductor circuit manufacturing method
03/11/1999DE19809509A1 Semiconductor component with ball grid array (BGA)
03/11/1999DE19808168A1 Semiconductor manufacture process
03/11/1999DE19738990A1 Misuse protection device for chip card security system
03/11/1999DE19738588A1 Elektrisches Bauelement mit einer Umhüllung und mit einem in der Umhüllung angeordneten Anschlußbereich Electrical component with a casing and with, disposed in the sheath terminal region
03/11/1999DE19738548A1 ASIC-type chip-card integrated circuit design
03/11/1999CA2302357A1 Spring clamp assembly for thermal stacked components
03/11/1999CA2297212A1 Flexible circuits and carriers and process for manufacture
03/10/1999EP0901316A2 Multi-layer ceramic substrate and method of producing the multi-layer ceramic substrate
03/10/1999EP0901166A1 Power semiconductor device module with submodules having integrated coolers
03/10/1999EP0901165A1 Housing for integrated circuit and method for mounting integrated circuit
03/10/1999EP0901164A2 Integrated circuit packaging method, packaging apparatus, and package
03/10/1999EP0901154A2 Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card
03/10/1999EP0901010A2 Reference wafer
03/10/1999EP0900611A2 Ultrafine nickel powder
03/10/1999EP0900477A1 Electronic component, in particular a component using acoustical surface acoustic waves
03/10/1999EP0900132A1 Method employing uv laser pulses of varied energy density to form blind vias in multilayered targets
03/10/1999EP0812258A4 Electrical feedthroughs for ceramic circuit board support substrates
03/10/1999CN2310389Y Extendible type microprocessor heat-sink buckle
03/10/1999CN2310388Y 发光二极管 Led
03/10/1999CN1210623A Separable connecting bridge (fuse) and connectable line interuption (anti-fuse) and process for producing and activating fuse and anti-fuse
03/10/1999CN1210622A Semiconductor device, method for manufacturing thereof, circuit board, and electronic equipment
03/10/1999CN1210621A Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
03/10/1999CN1210480A Grafted thermoplastic elastomer barrier layer
03/10/1999CN1210369A Semiconductor device and method fo fabricating same
03/10/1999CN1210363A Method for automatically welding package of ball array integrated circuit by coil belt
03/10/1999CN1210361A Semiconductor device and method of manufacturing the same
03/10/1999CN1042473C Method for forming contact plug of semiconductor or device
03/09/1999US5881155 Security device for a semiconductor chip
03/09/1999US5880590 Apparatus and method for burn-in and testing of devices with solder bumps or preforms
03/09/1999US5880531 Lead on chip semiconductor memory device with multiple bit configuration
03/09/1999US5880529 Silicon metal-pillar conductors under stagger bond pads
03/09/1999US5880528 Energy absorbing structures to prevent damage to an integrated circuit
03/09/1999US5880527 Contact structure for semiconductor device
03/09/1999US5880526 Barrier metal layer
03/09/1999US5880524 Heat pipe lid for electronic packages
03/09/1999US5880523 Anti-tamper integrated circuit
03/09/1999US5880522 Stamped lead frame with adhesive layer for fixing to semiconductor device
03/09/1999US5880521 Super-conductive wiring and semiconductor device using the same
03/09/1999US5880520 Low mutual inductance lead frame device
03/09/1999US5880519 Moisture barrier gap fill structure and method for making the same
03/09/1999US5880518 Waterproof silicon oxide layer containing excess silicon disposed at an uppermost layer of the dielectric film
03/09/1999US5880512 Programmable interconnect structures and programmable integrated circuits
03/09/1999US5880505 Solid solution with high heat resistance and low sheet resistance
03/09/1999US5880406 Cover layer for electrical conductors or semiconductors
03/09/1999US5880403 Using combination of high z, low z materials
03/09/1999US5880030 Unlanded via structure and method for making same
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