Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1999
03/24/1999EP0757884A4 Method of forming a fluorinated silicon oxide layer using plasma chemical vapor deposition
03/24/1999CN1212045A Apparatus and method for spray-cooling electronic module
03/24/1999CN1211823A Semiconductor device with protection circuit
03/24/1999CN1211821A Semiconductor substrate and stackable semiconductor package and fabrication method thereof
03/24/1999CN1211817A Alignment marks of semiconductor substrate and manufacturing method thereof
03/24/1999CN1042680C Electronic units with semiconductor slugs
03/23/1999US5886917 Semiconductor integrated circuit device
03/23/1999US5886877 Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
03/23/1999US5886876 Surface-mounted semiconductor package and its manufacturing method
03/23/1999US5886873 Heat dissipating device for an electronic device package
03/23/1999US5886872 Pivotable support and heat sink apparatus removably connectable without tools to a computer processor
03/23/1999US5886870 Heat sink device
03/23/1999US5886862 Cross-referenced electrostatic discharge protection systems and methods for power supplies
03/23/1999US5886564 Temperature compensation circuit for IC chip
03/23/1999US5886457 Two different adhesives having different glass transition points
03/23/1999US5886415 Anisotropic conductive sheet and printed circuit board
03/23/1999US5886414 Removal of extended bond pads using intermetallics
03/23/1999US5886413 Reusable, selectively conductive, z-axis elastomeric composite substrate
03/23/1999US5886410 Low dielectric constant
03/23/1999US5886409 Electrode structure of wiring substrate of semiconductor device having expanded pitch
03/23/1999US5886408 Multi-chip semiconductor device
03/23/1999US5886407 Heat-dissipating package for microcircuit devices
03/23/1999US5886406 Power-ground plane for a C4 flip-chip substrate
03/23/1999US5886405 Semiconductor device package having inner leads with slots
03/23/1999US5886404 Bottom lead semiconductor package having folded leads
03/23/1999US5886403 Sealed rectifier
03/23/1999US5886400 Semiconductor device having an insulating layer and method for making
03/23/1999US5886399 Lead frame and integrated circuit package
03/23/1999US5886398 Molded laminate package with integral mold gate
03/23/1999US5886397 Crushable bead on lead finger side surface to improve moldability
03/23/1999US5886396 Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package
03/23/1999US5886393 Bonding wire inductor for use in an integrated circuit package and method
03/23/1999US5886371 Integrated circuit with gate-array interconnections routed over memory area
03/23/1999US5886363 Semiconductor device and pattern including varying transistor patterns for evaluating characteristics
03/23/1999US5886324 Electrode attachment for high power current limiting polymer devices
03/23/1999US5886320 Laser ablation with transmission matching for promoting energy coupling to a film stack
03/23/1999US5886269 Substrate and heat sink for a semiconductor and method of manufacturing the same
03/23/1999US5885892 Bumpless method of attaching inner leads to semiconductor integrated circuits
03/23/1999US5885891 Forming on semiconductor pad electrode high bonding strength first metal layer and second metal barrier layer, selectively etching second metal masked with photoresist and first metal masked with solder
03/23/1999US5885890 Method of forming contact openings and an electric component formed from the same and other methods
03/23/1999US5885857 Forming dummy via holes and/or dummy wiring pattern in interlayer dielectric layer to relieve thermal stress
03/23/1999US5885855 Method for distributing connection pads on a semiconductor die
03/23/1999US5885853 Hollow chip package and method of manufacture
03/23/1999US5885852 Packaged semiconductor device having a flange at its side surface and its manufacturing method
03/23/1999US5885850 Method for the 3D interconnection of packages of electronic components, and device obtained by this method
03/23/1999US5885849 Methods of making microelectronic assemblies
03/23/1999US5885848 Electrically connecting integrated circuit die to substrate, encapsulation with protective coating supplied through aperture of threaded lock ring positioned to encircle die and which receives threaded heat sink
03/23/1999US5885749 Method of customizing integrated circuits by selective secondary deposition of layer interconnect material
03/23/1999US5885101 IC carrier
03/23/1999US5884990 Integrated circuit inductor
03/23/1999US5884692 Cooling device for central processing unit module
03/23/1999US5884398 Mounting spring elements on semiconductor devices
03/23/1999US5884397 Method for fabricating chip carriers and printed circuit boards
03/23/1999US5884396 Forming single sided circuit, applying photoresist, electroplating with copper, etching
03/23/1999CA2127736C Packaging structure for microwave circuit
03/18/1999WO1999013571A1 Shielded surface acoustical wave package
03/18/1999WO1999013549A1 Circuit arrangement for protecting integrated circuits against electrostatic discharges
03/18/1999WO1999013516A1 Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
03/18/1999WO1999013515A1 Integrated circuit package employing a transparent encapsulant and a method of making the package
03/18/1999WO1999013509A1 Semiconductor device
03/18/1999WO1999013508A1 Housing for receiving a planar power transistor
03/18/1999WO1999013501A1 Borderless vias with cvd barrier layer
03/18/1999WO1999013275A1 Multiple electrostatic gas phase heat pump and method
03/18/1999WO1998059098A3 Method and device for producing electrically conductive continuity in semiconductor components
03/18/1999WO1998048449A3 Flip chip and chip scale package
03/18/1999DE19739683A1 Schaltungsanordnung zum Schutz integrierter Schaltungen vor elektrostatischen Entladungen Circuitry to protect integrated circuits against static discharge
03/18/1999DE19739083A1 Gehäuse zur Aufnahme eines planaren Leistungstransistors Housing for holding a planar power transistor
03/18/1999DE19736113A1 Verfahren und Vorrichtung zur Ermittlung einer Kenngröße für ein Metallisierungsbad Method and apparatus for determining a characteristic quantity for a metallizing
03/18/1999CA2301615A1 Integrated circuit package employing a transparent encapsulant and a method of making the package
03/18/1999CA2301613A1 Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
03/17/1999EP0902610A1 Arrangement of an ordered array of balls of solder alloy on respective pads of a baseplate of a BGA device
03/17/1999EP0902475A2 A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor
03/17/1999EP0902474A2 Improved laser fuse links and methods therefor
03/17/1999EP0902473A2 Improvements in or relating to leadframes
03/17/1999EP0902472A2 Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
03/17/1999EP0902471A2 Semiconductor integrated circuit device and package structure for the same
03/17/1999EP0902470A2 Heat dissipator including coolant passage and method of fabricating the same
03/17/1999EP0902469A2 Cooling device for electrical or electronic devices
03/17/1999EP0902468A1 Resin-sealed semiconductor device and method of manufacturing the device
03/17/1999EP0901695A1 Connectors for microelectronic elements
03/17/1999EP0901688A1 Integrated circuit comprising connection pads emerging on one surface
03/17/1999EP0875075A4 Shaftless roller for lead forming apparatus
03/17/1999EP0857357A4 A silicide agglomeration fuse device
03/17/1999EP0729645B1 A high density integrated circuit assembly combining leadframe leads with conductive traces
03/17/1999EP0680685B1 Mounting assembly for power semiconductors
03/17/1999CN1211160A Wiring board and its producing method
03/17/1999CN1211083A Application of protective ceramic material
03/17/1999CN1211074A Resin-sealed semiconductor device and method of manufacturing the device
03/17/1999CN1211073A Semiconductor device
03/17/1999CN1211072A Semiconductor device with high radiation character and method of manufacturing the same
03/17/1999CN1211071A Semiconductor device and method of manufacturing the same
03/17/1999CA2245530A1 Solventless laminating adhesive with barrier properties
03/16/1999US5883788 Backing plate for LGA mounting of integrated circuits facilitates probing of the IC's pins
03/16/1999US5883783 GT clip design for an electronic packaging assembly
03/16/1999US5883782 Apparatus for attaching a heat sink to a PCB mounted semiconductor package
03/16/1999US5883540 Electrostatic protection circuit of an input/output circuit of a semiconductor device
03/16/1999US5883440 Outline forming method for semiconductor device and semiconductor manufacturing device used in this method
03/16/1999US5883439 Semiconductor device molded in plastic package free from crack by virtue of organic stress relaxation layer
03/16/1999US5883438 Interconnection structure for attaching a semiconductor to substrate
03/16/1999US5883436 Contact and via fabrication technologies
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