Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/17/2013DE102012206289A1 Halbleiterbauelement-Verbundstruktur mit Wärmeableitstruktur und dazugehöriges Herstellungsverfahren Semiconductor component composite structure with heat dissipating structure and associated manufacturing processes
10/17/2013DE102012206271A1 Flüssigkeitsgekühlte Anordnung mit anreihbaren Leistungshalbleitermodulen und mindestens einer Kondensatoreinrichtung und Leistungshalbleitermodul hierzu Liquid-cooled arrangement with attachable power semiconductor modules and at least one capacitor device and power semiconductor module for this purpose
10/17/2013DE102012206264A1 Anreihbares flüssigkeitsgekühltes Leistungshalbleitermodul und Anordnung hiermit Alignable liquid-cooled power semiconductor module and assembly hereby
10/17/2013DE102012110982A1 Integrierte thermische Lösungen zur Verpackung integrierter Schaltkreise Integrated thermal solutions for packaging integrated circuits
10/17/2013DE102012109922A1 Method for formation of semiconductor package of semiconductor device, involves bonding metal ball to contact pad to form first bonding structure, and bonding die package to surface of substrate through connectors
10/17/2013DE102008004615B4 Herstellungsverfahren für ein Kühlrohr und Kühlrohr Manufacturing method for a cooling pipe and cooling pipe
10/17/2013DE102007029873B4 Verdrahtungssubstrat Wiring substrate
10/16/2013EP2651032A2 Tunable capacitor
10/16/2013EP2650960A2 Cooling element having improved assembly productivity and battery modules including same
10/16/2013EP2650919A2 Tunable capacitor
10/16/2013EP2650916A2 Substrate device
10/16/2013EP2650915A1 Conducting path, semiconductor device using conducting path, and method for producing conducting path and semiconductor device
10/16/2013EP2650914A2 Heat dissipation module with multiple porosities
10/16/2013EP2650907A2 Methods and devices for fabricating and assembling printable semiconductor elements
10/16/2013EP2650906A2 Methods and devices for fabricating and assembling printable semiconductor elements
10/16/2013EP2650905A2 Methods and devices for fabricating and assembling printable semiconductor elements
10/16/2013EP2650880A1 Data Storage and Stackable Configurations
10/16/2013EP2650074A1 Bonded body, power semiconductor device and method for manufacturing bonded body and power semiconductor device
10/16/2013EP2649730A1 Liquid cooling system and method for cooling at least one radio unit
10/16/2013EP2649645A1 Power distribution network
10/16/2013EP2649644A1 Interconnect structure
10/16/2013EP2649643A2 Compliant interconnects in wafers
10/16/2013EP2649642A1 Adhesive compound and method for encapsulating an electronic arrangement
10/16/2013EP2649640A1 High density three-dimensional integrated capacitors
10/16/2013EP2649639A1 High density three-dimensional integrated capacitors
10/16/2013EP2649461A1 Electronic device with shunt for current measurement
10/16/2013EP2649135A1 Methods of modifying metal-oxide nanoparticles
10/16/2013EP2649131A1 Siloxane compositions including titanium dioxide nanoparticles suitable for forming encapsulants
10/16/2013EP2649114A1 Siloxane compositions suitable for forming encapsulants
10/16/2013EP2649113A1 Siloxane compositions including metal-oxide nanoparticles suitable for forming encapsulants
10/16/2013CN203243660U Large-small head heat pipe radiator and display card heat radiating module with large-small head heat pipe radiator
10/16/2013CN203243035U MOS with surge peak absorption
10/16/2013CN203242620U Multipath electro-static discharge protective device
10/16/2013CN203242619U Multi-path ESD (Electro-Static discharge) protective device
10/16/2013CN203242618U Heavy-current lead structure of solid-state relay control circuit
10/16/2013CN203242617U A packaging structure of a Schottky diode
10/16/2013CN203242616U No-lead leadframe bar for semiconductor packaging
10/16/2013CN203242615U Welding substrate for electronic products
10/16/2013CN203242614U Microfluidic-channel heat dissipation device used for an electronic component and electronic device
10/16/2013CN203242613U Improved rectifier bridge packaging shell
10/16/2013CN203242612U Chip radiator
10/16/2013CN203242611U Fixed assembly for transistors
10/16/2013CN203242610U A power electronic module containing an anti-stress structure
10/16/2013CN203242609U ESD protection device
10/16/2013CN203242246U Flat display panel allowing alignment correction
10/16/2013CN203241671U Fan-out line structure of array substrate and display panel
10/16/2013CN103354951A Interconnect structure
10/16/2013CN103354950A Cover material for airtight sealing, package for housing electronic components, and method for manufacturing cover material for airtight sealing
10/16/2013CN103354949A Pin attachment
10/16/2013CN103354948A Method for producing silicon dioxide film
10/16/2013CN103354235A Thyristor converter valve assembly
10/16/2013CN103354234A Thyristor converter valve assembly
10/16/2013CN103354233A Thyristor valve section and pressing device thereof
10/16/2013CN103354232A Parallel sub-module for VSC-HVDC (voltage source converter high voltage direct current)
10/16/2013CN103354231A IGBT power unit and sub-module for VSC-HVDC (voltage source converter high voltage direct current)
10/16/2013CN103354230A Electrostatic discharge protection TVS device of high maintenance voltage
10/16/2013CN103354229A Breaking-through transient voltage inhibitor
10/16/2013CN103354228A Semiconductor packaging part and manufacturing method thereof
10/16/2013CN103354227A Stack packaging device
10/16/2013CN103354226A Stack packaging device
10/16/2013CN103354225A Stack packaging device
10/16/2013CN103354224A Semiconductor device fan-out flip-chip packaging structure
10/16/2013CN103354223A Interconnects and heat dissipators based on nanostructures
10/16/2013CN103354222A A multilayered composite ceramic layer patterned structure substrate for optical and electronic devices
10/16/2013CN103354221A A multi-ceramic-layer patterned structure substrate for optical and electronic devices
10/16/2013CN103354220A A patterned structure substrate for optical and electronic devices
10/16/2013CN103354219A A patterned functional structure substrate for optical and electronic devices
10/16/2013CN103354210A Bonding method and bonding structure formed by adopting the same
10/16/2013CN103354209A Display panel and packaging method
10/16/2013CN103354206A Through-hole manufacturing method, display-panel manufacturing method and display panel
10/16/2013CN103353585A Switch locked type Hall hybrid integrated circuit
10/16/2013CN103353098A High-power LED lamp cooling device and manufacturing method thereof
10/16/2013CN103351838A Adhesive composition, connection structure, method for producing connection structure, and use of adhesive composition
10/16/2013CN102324360B Vacuum gap tube
10/16/2013CN102306640B Radiating fin provided with auxiliary fixed parts
10/16/2013CN102281710B Bonding pad structure
10/16/2013CN102265395B Physical structure for use in physical unclonable function
10/16/2013CN102222891B Power clamping ESD (electro-static discharge) protection circuit utilizing current mirror
10/16/2013CN102199276B Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof
10/16/2013CN102197480B Method for verifying an identification circuit
10/16/2013CN102176427B Method for manufacturing semiconductor device
10/16/2013CN102169876B Resin-sealed electronic control device and method of fabricating the same
10/16/2013CN102130157B Semiconductor device with metal carrier and manufacturing method
10/16/2013CN102124383B Energy dissipating packages for high power operation of optical fiber components
10/16/2013CN102082129B Semiconductor device and manufacturing method thereof
10/16/2013CN102074515B Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same
10/16/2013CN102047418B Die stacking with an annular via having a recessed socket
10/16/2013CN102035194B Electrostatic discharge protection system
10/16/2013CN102034771B Heat sink systems and devices
10/16/2013CN102015531B Amorphous siliceous powder, process for production of the same, and use thereof
10/16/2013CN102005434B Printed wiring board and method for manufacturing the same
10/16/2013CN102005419B Power semiconductor device and manufacturing method for the same
10/16/2013CN101893799B Liquid crystal display panel and manufacturing method thereof
10/16/2013CN101826473B Forming method of penetrating electrode and semiconductor substrate
10/16/2013CN101499446B Wire frame tablet, packaging structure and LED packaging structure
10/16/2013CN101425508B 芯片堆叠封装 Chip Stacking
10/16/2013CN101355059B 半导体器件 Semiconductor devices
10/15/2013US8559474 Silicon carrier optoelectronic packaging
10/15/2013US8559185 Integrated circuit package system with stackable devices and a method of manufacture thereof
10/15/2013US8559184 Electronic component built-in substrate and method of manufacturing the same
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