Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1999
03/31/1999EP0905766A1 Structure and method to repair integrated circuits
03/31/1999EP0905765A2 Endpoint detection method and apparatus
03/31/1999EP0905763A2 Multilayer wiring substrate and method for producing the same
03/31/1999EP0905756A2 Planarization of a non-conformal device layer in semiconductor fabrication
03/31/1999EP0905521A2 Burn-in testing device
03/31/1999EP0904887A1 Gold plated solder material and method of fluxless soldering using said solder
03/31/1999EP0904602A1 Carrier element for semiconductor chips
03/31/1999EP0428681B1 Improved electrical connectors and ic chip tester embodying same
03/31/1999CN1212601A Multilayer wiring substrate and method for producing the same
03/31/1999CN1212471A Miniaturization of semiconductor chip
03/31/1999CN1212470A Digital switch circuit in MOS technology
03/31/1999CN1212467A Semiconductor integrated circuit device including memory device
03/31/1999CN1212461A 球栅阵列半导体封装 A ball grid array semiconductor package
03/31/1999CN1212460A Semiconductor device having function blocks with obliquely arranged signal terminals connected through two-dimensionally extensible signal lines
03/31/1999CN1212459A Semiconductor device which improves heat reliability
03/31/1999CN1212457A Improved techniques for forming electrically blowable fuses on integrated circuit
03/31/1999CN1212389A Electronic device with improved heat dissipation
03/31/1999CN1212185A Cutting apparatus for cutting metallic plate and cutting method of cutting metallic plate using the same cutting apparatus
03/31/1999CN1042777C Production method for semiconductor units
03/30/1999US5889655 Integrated circuit package substrate with stepped solder mask openings
03/30/1999US5889654 Advanced chip packaging structure for memory card applications
03/30/1999US5889653 Strap spring for heat sink clip assembly
03/30/1999US5889652 C4-GT stand off rigid flex interposer
03/30/1999US5889651 Circuit board cooling apparatus
03/30/1999US5889410 Floating gate interlevel defect monitor and method
03/30/1999US5889335 Semiconductor device and method of manufacturing the same
03/30/1999US5889334 Semiconductor integrated circuit and fabrication method therefor
03/30/1999US5889333 Semiconductor device and method for manufacturing such
03/30/1999US5889330 Semiconductor device whose flattening resin film component has a controlled carbon atom content
03/30/1999US5889329 Tri-directional interconnect architecture for SRAM
03/30/1999US5889328 Refractory metal capped low resistivity metal conductor lines and vias
03/30/1999US5889327 Semiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devices
03/30/1999US5889325 Semiconductor device and method of manufacturing the same
03/30/1999US5889324 Package for a semiconductor device
03/30/1999US5889323 Semiconductor package and method of manufacturing the same
03/30/1999US5889322 Sintered from mixture of glass and silica filler; preventing change in thermal expansion; semiconductor packages
03/30/1999US5889320 Tape application platform and processes therefor
03/30/1999US5889319 RF power package with a dual ground
03/30/1999US5889318 Lead frame including angle iron tie bar and method of making the same
03/30/1999US5889317 Leadframe for integrated circuit package
03/30/1999US5889316 Radiation shielding of plastic integrated circuits
03/30/1999US5889308 Semiconductor device having an electrostatic discharging protection circuit using a non-ohmic material
03/30/1999US5889307 Sacrificial discharge device
03/30/1999US5889306 Bulk silicon voltage plane for SOI applications
03/30/1999US5889293 Electrical contact to buried SOI structures
03/30/1999US5889233 Multilayer wiring structure
03/30/1999US5889232 Ultrahigh-frequency electronic component
03/30/1999US5889220 Contains small amounts of phosphorus, and one or two of cobalt, nickel and iron to help sintering; high transverse rupture strength, purity, sintered density, and thermoconductivity; electrodes, semiconductor circuit board
03/30/1999US5889104 Multilayer; containing dielectric
03/30/1999US5888925 Hydrogen and moisture getter and absorber for sealed devices
03/30/1999US5888911 Hydrogen silsesquioxane
03/30/1999US5888905 Integrated circuit insulator and method
03/30/1999US5888902 Reduction of contact resistance and improved reliability
03/30/1999US5888898 HSQ baking for reduced dielectric constant
03/30/1999US5888897 Second sandwich structure over a first sandwich each having a dielectric spacer surrounded by an insulating layer; removing the second spacer and a portion of the first spacer to form an opening, forming conductive layer in opening; low cost
03/30/1999US5888893 Process for arranging printed conductors on the surface of a semiconductor component
03/30/1999US5888889 Integrated structure pad assembly for lead bonding
03/30/1999US5888884 Electronic device pad relocation, precision placement, and packaging in arrays
03/30/1999US5888872 Method for forming source drain junction areas self-aligned between a sidewall spacer and an etched lateral sidewall
03/30/1999US5888851 Method of manufacturing a semiconductor device having a circuit portion and redundant circuit portion coupled through a meltable connection
03/30/1999US5888850 Immersing a semiconductor chip positioned on a substrate in a solution containing a dielectric such as a fluorinated thermosetting material; hermetic sealing to moisture-proof
03/30/1999US5888848 Heat treatment to structurally harden alloy; fixing electronic device on cut-out alloy plate and connecting it to leads; encapsulating; overmolding; cutting;
03/30/1999US5888838 Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information
03/30/1999US5888631 Method for minimizing warp in the production of electronic assemblies
03/30/1999US5888630 Metal layers with equal coefficients of thermal expansion
03/30/1999US5888591 Chemical vapor deposition of fluorocarbon polymer thin films
03/30/1999US5887342 Method for making an electronic control unit
03/30/1999CA2247688A1 Composite heat sink
03/30/1999CA2153501C Improved thermally conductive interface
03/30/1999CA2134019C Solder ball connections and assembly process
03/30/1999CA2002213C High performance integrated circuit chip package and method of making same
03/26/1999CA2248385A1 Protective layer for integrated circuits and method for the manufacturing thereof
03/25/1999WO1999014807A1 Cooling module for electronic components
03/25/1999WO1999014806A1 Carrier plate for micro-hybrid circuits
03/25/1999WO1999014805A1 Flexible heat transfer device and method
03/25/1999WO1999014804A1 CO-PLANAR Si AND Ge COMPOSITE SUBSTRATE AND METHOD OF PRODUCING SAME
03/25/1999WO1999014404A1 Method of making a structure with improved material properties by moderate heat treatment of a metal deposit
03/25/1999WO1999014036A1 Silica-coated aluminum nitride powders with improved properties and methos for their preparation
03/25/1999WO1999001771A8 Sensor with diaphragm sensor chip
03/25/1999DE19842881A1 Optical sensor has a semiconductor chip in a transparent filler-filled housing
03/25/1999DE19758488A1 Material and process for manufacturing composite plastic components, especially electrical components
03/25/1999DE19740330A1 Ceramic carrier plate for microhybrid circuits
03/25/1999CA2302758A1 Co-planar si and ge composite substrate and method of producing same
03/24/1999EP0903971A1 Liquid cooled dissipator for electronic components equipped with selectively arranged dissipation fins.
03/24/1999EP0903785A2 Advanced rf electronics package
03/24/1999EP0903784A2 Improved techniques for forming electrically blowable fuses on an integrated circuit
03/24/1999EP0903783A1 Realization of an intermetallic capacitor
03/24/1999EP0903781A2 Method of forming embedded copper interconnections and embedded copper interconnection structure
03/24/1999EP0903780A2 Method and apparatus for a wire bonded package for integrated circuits
03/24/1999EP0903639A2 Process of making patterned protective and insulating layers
03/24/1999EP0903429A2 Process for producing heavily doped silicon
03/24/1999EP0903386A1 Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith
03/24/1999EP0903378A1 Dielectric gel for protection of electronic modules
03/24/1999EP0903060A1 Apparatus and method for mounting an electronic component to a substrate
03/24/1999EP0902976A1 High frequency microelectronics package
03/24/1999EP0902975A1 Microelectronics package
03/24/1999EP0902974A1 Conductors for integrated circuits
03/24/1999EP0902973A1 Substrate for a semiconductor chip
03/24/1999EP0902971A1 A method and an apparatus for manufacturing heat-sink devices
03/24/1999EP0882384A4 Metal ball grid electronic package
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