| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/07/1999 | EP0907307A1 Heat sink for surface mount power packages |
| 04/07/1999 | EP0907207A2 Semiconductor device having alternating long and short contact pads with a fine pitch |
| 04/07/1999 | EP0907206A1 Substrate through-contact and its fabrication method |
| 04/07/1999 | EP0907205A2 Semiconductor package and method for manufacturing the same |
| 04/07/1999 | EP0907204A2 Chip size package semiconductor device and method of forming the same |
| 04/07/1999 | EP0906945A1 Sprayable thermal grease |
| 04/07/1999 | EP0906944A2 Solventless laminating adhesive with barrier properties |
| 04/07/1999 | EP0597745B1 Fusible circuit for integrated circuit |
| 04/07/1999 | EP0590148B1 Method and apparatus for thin film formation, device, electro-magnetic apparatus, data recording/reproduction apparatus and signal processor |
| 04/07/1999 | CN1213185A Insulating gate type semiconductor device and method of fabricating the same |
| 04/07/1999 | CN1213176A Semiconductor device and method for fabricating same |
| 04/07/1999 | CN1213175A Semiconductor device and method for manufacture thereof |
| 04/07/1999 | CN1213174A CSP type semiconductor device and manufacturing methods for the same |
| 04/07/1999 | CN1213173A 半导体集成电路装置 The semiconductor integrated circuit device |
| 04/07/1999 | CN1213170A Improved multi-level conductive structure and method for forming thereof |
| 04/07/1999 | CN1213166A Stacked via in copper/polyimide BEOL |
| 04/07/1999 | CN1213165A Endpoint detection method and apparatus |
| 04/07/1999 | CN1213162A Soft passivation layer in semiconductor fabrication |
| 04/07/1999 | CN1213160A Process for forming miniature contact holes in semiconductor device without short-circuit |
| 04/07/1999 | CN1213156A Flexible circuit and its preparation method |
| 04/07/1999 | CN1213079A Checking chip |
| 04/07/1999 | CN1213071A Composite heat sink |
| 04/07/1999 | CN1212984A Solventless liminating adhesive with barrier properties |
| 04/06/1999 | US5892558 Wire electrode structure based on 2 or 3 terminal device employed in a liquid crystal display |
| 04/06/1999 | US5892369 Method for the detection of the presence of passivation in an integrated circuit |
| 04/06/1999 | US5892290 Highly reliable and planar ball grid array package |
| 04/06/1999 | US5892288 Semiconductor integrated circuit device |
| 04/06/1999 | US5892287 Semiconductor device including stacked chips having metal patterned on circuit surface and on edge side of chip |
| 04/06/1999 | US5892286 Semiconductor device and manufacturing method thereof |
| 04/06/1999 | US5892285 Semiconductor connection with a top surface having an enlarged recess |
| 04/06/1999 | US5892284 Semiconductor integrated circuit |
| 04/06/1999 | US5892283 Connection of active circuitry via wire bonding procedure |
| 04/06/1999 | US5892282 Barrier-less plug structure |
| 04/06/1999 | US5892281 Tantalum-aluminum-nitrogen material for semiconductor devices |
| 04/06/1999 | US5892280 Semiconductor chip carrier affording a high-density external interface |
| 04/06/1999 | US5892279 Packaging for electronic power devices and applications using the packaging |
| 04/06/1999 | US5892278 Aluminum and aluminum alloy radiator for semiconductor device and process for producing the same |
| 04/06/1999 | US5892277 Tab tape and semiconductor device using the tab tape |
| 04/06/1999 | US5892276 Semiconductor integrated circuit |
| 04/06/1999 | US5892275 High performance power and ground edge connect IC package |
| 04/06/1999 | US5892274 Printed circuit board ground plane and high frequency semiconductor combination |
| 04/06/1999 | US5892273 Semiconductor package integral with semiconductor chip |
| 04/06/1999 | US5892272 Integrated circuit with on-chip ground base |
| 04/06/1999 | US5892271 Semiconductor device |
| 04/06/1999 | US5892270 Chip on board assembly without wire bonding |
| 04/06/1999 | US5892269 Semiconductor device including an intrusion film layer |
| 04/06/1999 | US5892266 Layout structure of capacitive element(s) and interconnections in a semiconductor |
| 04/06/1999 | US5892245 Ball grid array package emulator |
| 04/06/1999 | US5892179 Solder bumps and structures for integrated redistribution routing conductors |
| 04/06/1999 | US5891969 Curable blends of polyepoxide and a polysiloxane/epoxy-containing polysilsesquioxane; storage stability; protective coatings for electronic components, e.g. semiconductors, integrated circuits; adhesion; |
| 04/06/1999 | US5891808 Method for fabricating a die seal |
| 04/06/1999 | US5891804 Process for conductors with selective deposition |
| 04/06/1999 | US5891802 Method for fabricating a metallization stack structure to improve electromigration resistance and keep low resistivity of ULSI interconnects |
| 04/06/1999 | US5891799 Method for making stacked and borderless via structures for multilevel metal interconnections on semiconductor substrates |
| 04/06/1999 | US5891797 Method of forming a support structure for air bridge wiring of an integrated circuit |
| 04/06/1999 | US5891761 Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform |
| 04/06/1999 | US5891760 Lead frame with electrostatic discharge protection |
| 04/06/1999 | US5891759 Method of making a multiple heat sink resin sealing type semiconductor device |
| 04/06/1999 | US5891758 Semiconductor device and method for manufacturing semiconductor device |
| 04/06/1999 | US5891756 Process for converting a wire bond pad to a flip chip solder bump pad and pad formed thereby |
| 04/06/1999 | US5891755 Process for flat plate cooling a semiconductor chip using a thermal paste retainer |
| 04/06/1999 | US5891754 Method of inspecting integrated circuit solder joints with x-ray detectable encapsulant |
| 04/06/1999 | US5891753 Method and apparatus for packaging flip chip bare die on printed circuit boards |
| 04/06/1999 | US5891745 Test and tear-away bond pad design |
| 04/06/1999 | US5891566 Adhesive tapes |
| 04/06/1999 | US5891540 Adhesive tape for electronic parts |
| 04/06/1999 | US5891513 Semiconductors |
| 04/06/1999 | US5891377 Dambarless leadframe for molded component encapsulation |
| 04/06/1999 | US5891354 Methods of etching through wafers and substrates with a composite etch stop layer |
| 04/06/1999 | US5891283 Conductive paste composition and method for producing a ceramic substrate |
| 04/06/1999 | US5890914 Socket for connecting an integrated circuit to a printed wiring board |
| 04/06/1999 | US5890807 Method for identifying an apparatus or device utilizing a randomly produced characteristic thereof |
| 04/06/1999 | US5890644 Apparatus and method of clamping semiconductor devices using sliding finger supports |
| 04/06/1999 | CA2247714A1 Laser-solderable electronic component |
| 04/06/1999 | CA2121301C Multilayer glass ceramic substrate and method of fabricating the same |
| 04/01/1999 | WO1999016133A1 Optical module and lead frame for optical module |
| 04/01/1999 | WO1999016132A2 Method for producing a plastic composite body and plastic composite body |
| 04/01/1999 | WO1999016131A1 Method for wiring semi-conductor components in order to prevent product piracy and manipulation, semi-conductor component made according to this method and use of said semi-conductor component in a chip card |
| 04/01/1999 | WO1999016130A1 Demountable, compliant area array interconnect |
| 04/01/1999 | WO1999016128A1 Semiconductor module |
| 04/01/1999 | WO1999016127A1 Electronic component with improved housing moulding material |
| 04/01/1999 | WO1999016118A1 Process for fabricating semiconductor device including antireflective etch stop layer |
| 04/01/1999 | WO1999016107A2 Methods for determining on-chip interconnect process parameters |
| 04/01/1999 | WO1999015908A1 Method for manufacturing semiconductor integrated circuit device |
| 04/01/1999 | WO1999015582A1 Duro-plastic composite material with expandable hollow microspheres and use of the same for encapsulation |
| 04/01/1999 | WO1999015474A2 Composite based on a porous material |
| 04/01/1999 | WO1999003153A3 Housing for at least one semiconductor body |
| 04/01/1999 | DE19746641A1 Verdrahtungsverfahren für Halbleiter-Bauelemente zur Verhinderung von Produktpiraterie und Produktmanipulation, durch das Verfahren hergestelltes Halbleiter-Bauelement und Verwendung des Halbleiter-Bauelements in einer Chipkarte Wiring method for semiconductor devices to prevent piracy and tampering with products, prepared by the method of semiconductor device and semiconductor device using a smart card |
| 04/01/1999 | DE19741971A1 Direct-wafer-bond silicon-oxide-silicon substrate production |
| 04/01/1999 | DE19741580A1 Verbundwerkstoff Composite material |
| 04/01/1999 | DE19741437A1 Elektronisches Bauteil mit verbesserter Gehäusepreßmasse Electronic component with improved Gehäusepreßmasse |
| 04/01/1999 | CA2272615A1 Optical module and lead frame for optical module |
| 03/31/1999 | EP0905792A2 Stacked-fringe integrated circuit capacitors |
| 03/31/1999 | EP0905791A2 Miniaturization of a semiconductor chip |
| 03/31/1999 | EP0905782A1 Integrated semiconductor circuit including electrostatic discharge protection means |
| 03/31/1999 | EP0905778A2 Improved multi-level conductive structure and methods therefor |
| 03/31/1999 | EP0905777A1 Method for the linear arrangement of metallic fuse sections on wafers |
| 03/31/1999 | EP0905776A1 Semiconductor device comprising two ground contact pads connected to a ground connection lead and testing procedure for the device |
| 03/31/1999 | EP0905775A2 Electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same |
| 03/31/1999 | EP0905774A2 Soft passivation layer in semiconductor fabrication |