| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/27/1999 | US5897728 Integrated circuit test structure and test process |
| 04/27/1999 | US5897724 Plating copper directly on a portion of a porous conductive material on a sintered substrate so that the copper extends to the substrate surface, preventing exposure of the conductive material; forming conductor terminal |
| 04/27/1999 | US5897381 Method of forming a layer and semiconductor substrate |
| 04/27/1999 | US5897370 High aspect ratio low resistivity lines/vias by surface diffusion |
| 04/27/1999 | US5897369 Method for forming interconnection of a semiconductor device |
| 04/27/1999 | US5897345 Semiconductor device and process for fabricating the same |
| 04/27/1999 | US5897342 Multilayer interconnection technique |
| 04/27/1999 | US5897340 Hybrid frame with lead-lock tape |
| 04/27/1999 | US5897339 Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same |
| 04/27/1999 | US5897338 Method for encapsulating an integrated semi-conductor circuit |
| 04/27/1999 | US5897337 Process for adhesively bonding a semiconductor chip to a carrier film |
| 04/27/1999 | US5897336 Direct chip attach for low alpha emission interconnect system |
| 04/27/1999 | US5897334 Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards |
| 04/27/1999 | US5897326 Method of exercising semiconductor devices |
| 04/27/1999 | US5897193 Semiconductor wafer |
| 04/27/1999 | US5897049 Method for wire-bonding a covered wire |
| 04/27/1999 | US5896917 Active heat sink structure with flow augmenting rings and method for removing heat |
| 04/27/1999 | US5896869 Semiconductor package having etched-back silver-copper braze |
| 04/27/1999 | US5896651 Method of mounting microelectronic circuit package |
| 04/22/1999 | WO1999019910A1 Porous silicon oxycarbide integrated circuit insulator |
| 04/22/1999 | WO1999019909A1 Thermally conductive polytetrafluoroethylene article |
| 04/22/1999 | WO1999019908A1 Thermal conductive unit and thermal connection structure using same |
| 04/22/1999 | WO1999019907A1 Method and construction for thermally enhancing a microelectronic package |
| 04/22/1999 | WO1999019905A1 Semiconductor device having fuse and fabrication method thereof |
| 04/22/1999 | WO1999019832A1 Carrier element for a semiconductor chip for installing in chip cards |
| 04/22/1999 | WO1999019755A1 Optical device having optical component isolated from housing |
| 04/22/1999 | WO1999019531A1 Method to improve adhesion of dielectric on metal |
| 04/22/1999 | WO1999019139A1 Bumped substrate assembly |
| 04/22/1999 | DE19844717A1 Large scale integrated circuit (LSI) with external coupling electrode on chip |
| 04/22/1999 | DE19830158A1 Zwischenträgersubstrat mit hoher Verdrahtungsdichte für elektronische Bauelemente Between the carrier substrate with high wiring density for electronic components |
| 04/22/1999 | DE19743289A1 High density multilevel interconnect substrate, especially for multi-chip modules, has insulation levels of different materials |
| 04/22/1999 | CA2306475A1 Method and construction for thermally enhancing a microelectronic package |
| 04/22/1999 | CA2305346A1 Optical device having optical component isolated from housing |
| 04/21/1999 | EP0910235A1 Composite heat sink |
| 04/21/1999 | EP0910125A1 Method and device for sealing ic chip |
| 04/21/1999 | EP0910121A1 Semiconductor device |
| 04/21/1999 | EP0910005A2 Thermal dissipation and EMI shielding structure for notebook computers |
| 04/21/1999 | EP0909462A1 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules |
| 04/21/1999 | EP0909460A1 Hex metal on rectangular cells; metal or metal two is hex |
| 04/21/1999 | EP0806063A4 Array of electrical components with leads attached |
| 04/21/1999 | EP0780007B1 Radio frequency circuit and memory in thin flexible package |
| 04/21/1999 | CN1214850A Fan attachment clip for heat sink |
| 04/21/1999 | CN1214549A Improved laser fuse links and methods therefor |
| 04/21/1999 | CN1214548A 多芯片模块 A multi-chip module |
| 04/21/1999 | CN1214547A 多芯片模块 A multi-chip module |
| 04/21/1999 | CN1214545A Semiconductor encapsulation and its manufacture |
| 04/21/1999 | CN1214544A Discrete semiconductor device and method for producing the same |
| 04/21/1999 | CN1214543A Semiconductor device having simple protective structure and process of fabrication thereof |
| 04/21/1999 | CN1214541A Semiconductor device and producing method thereof |
| 04/21/1999 | CN1043102C Method for forming micro contacts of semicodnuctor device |
| 04/20/1999 | US5896276 Electronic assembly package including connecting member between first and second substrates |
| 04/20/1999 | US5896271 Integrated circuit with a chip on dot and a heat sink |
| 04/20/1999 | US5896270 Heat sink spring clip |
| 04/20/1999 | US5896269 Positive pressure heat sink conduit |
| 04/20/1999 | US5896259 Preheating device for electronic circuits |
| 04/20/1999 | US5896041 Method and apparatus for programming anti-fuses using internally generated programming voltage |
| 04/20/1999 | US5896036 Carrier for testing semiconductor dice |
| 04/20/1999 | US5895978 High density signal multiplexing interposer |
| 04/20/1999 | US5895977 Bond pad functional layout on die to improve package manufacturability and assembly |
| 04/20/1999 | US5895976 Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same |
| 04/20/1999 | US5895975 Optimized process for creating and passivating a metal pillar via structure located between two metal interconnect structures |
| 04/20/1999 | US5895972 Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug |
| 04/20/1999 | US5895971 Semiconductor device with electrical connection between semiconductor chip and substrate less breakable during shrinkage of adhesive compound |
| 04/20/1999 | US5895970 Semiconductor package having semiconductor element, mounting structure of semiconductor package mounted on circuit board, and method of assembling semiconductor package |
| 04/20/1999 | US5895969 Thin type semiconductor device, module structure using the device and method of mounting the device on board |
| 04/20/1999 | US5895968 Semiconductor device assembly with minimized bond finger connections |
| 04/20/1999 | US5895967 Ball grid array package having a deformable metal layer and method |
| 04/20/1999 | US5895966 Integrated circuit and supply decoupling capacitor therefor |
| 04/20/1999 | US5895965 Semiconductor device |
| 04/20/1999 | US5895964 Thermoelectric cooling system |
| 04/20/1999 | US5895963 Semiconductor device having opening portion for fuse breakage |
| 04/20/1999 | US5895961 Semiconductor device with a planarized interconnect with poly-plug and self-aligned contacts |
| 04/20/1999 | US5895948 Semiconductor device and fabrication process thereof |
| 04/20/1999 | US5895942 Fuse selectable modules |
| 04/20/1999 | US5895887 Semiconductor device |
| 04/20/1999 | US5895766 Method of forming a field effect transistor |
| 04/20/1999 | US5895620 Process for encapsulating an electronic component |
| 04/20/1999 | US5895267 Method to obtain a low resistivity and conformity chemical vapor deposition titanium film |
| 04/20/1999 | US5895265 Improved electromigration and stress migration performance without reducing the patterning precision of the interconnection during photolithographic processing |
| 04/20/1999 | US5895264 Method for forming stacked polysilicon |
| 04/20/1999 | US5895234 Semiconductor device and method for producing the same |
| 04/20/1999 | US5895232 Three-dimensional warp-resistant integrated circuit module method and apparatus |
| 04/20/1999 | US5895231 External terminal fabrication method for semiconductor device package |
| 04/20/1999 | US5895230 Integrated circuit chip package having configurable contacts and method for making the same |
| 04/20/1999 | US5895229 Enhanced reliability solder bump interconnections;dispensing polymeric precursor into mold, curing to encapsulate integrated circuit die |
| 04/20/1999 | US5895226 Method of manufacturing semiconductor device |
| 04/20/1999 | US5895222 Encapsulant dam standoff for shell-enclosed die assemblies |
| 04/20/1999 | US5894990 Synthetic jet actuator and applications thereof |
| 04/20/1999 | US5894984 Structure of electronic parts and method of soldering electronic parts to substrate |
| 04/20/1999 | US5894882 Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure |
| 04/20/1999 | CA2125266C High density and high fiability integrated circuit assembly and manufacturing process for said assembly |
| 04/15/1999 | WO1999018766A1 Method for mounting semiconductor element to circuit board, and semiconductor device |
| 04/15/1999 | WO1999018610A1 Semiconductor device |
| 04/15/1999 | WO1999018609A1 Chip scale ball grid array for integrated circuit package |
| 04/15/1999 | WO1999018030A2 Diamond-based composites with high thermal conductivity |
| 04/15/1999 | WO1999009599A3 Vertical interconnect process for silicon segments with dielectric isolation |
| 04/15/1999 | WO1999008495A3 Method of manufacturing surface-mountable sil hybrid circuit |
| 04/15/1999 | WO1999004414A3 Heat dissipation in lead frames |
| 04/15/1999 | DE19800928A1 Stackable housing for electronic component |
| 04/15/1999 | DE19747177A1 Stackable encased electronic component |