| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/15/1999 | DE19744297A1 Stackable, encapsulated electronic component |
| 04/15/1999 | DE19743496A1 Insulating layer for an active diamond layer of a microelectronic component |
| 04/15/1999 | DE19743344A1 IC electrical connection method |
| 04/15/1999 | DE19742327A1 Method for coating metal components and other rigid articles |
| 04/14/1999 | EP0908952A2 Chip-on-chip IC packages |
| 04/14/1999 | EP0908951A2 Improved air isolated crossovers |
| 04/14/1999 | EP0908950A2 Integrated circuit |
| 04/14/1999 | EP0908949A1 Mounting structure for heat sink |
| 04/14/1999 | EP0908946A2 Improved gapfill of semiconductor structure using doped silicate glasses |
| 04/14/1999 | EP0908944A1 Electrical characterisation of an insulating layer on a conductive or semiconductive substrate |
| 04/14/1999 | EP0908943A2 Laser-solderable electronic component |
| 04/14/1999 | EP0908939A2 Method of mechanical polishing |
| 04/14/1999 | EP0908934A2 Method of manufacturing a gate electrode |
| 04/14/1999 | EP0908844A1 Card with microcircuit combining the surfaces of external contact and an antenna and manufacturing process of such card |
| 04/14/1999 | EP0908843A1 Contactless electronic card and its manufacturing method |
| 04/14/1999 | EP0908499A1 Curable silicone composition and electronic components |
| 04/14/1999 | EP0908429A1 Metallized silicon nitride ceramic, fabricating process thereof and metallizing composite for the process |
| 04/14/1999 | EP0908080A1 Spray-cooling circuit board apparatus |
| 04/14/1999 | EP0908076A1 Grid array assembly and method of making |
| 04/14/1999 | EP0907966A1 Integrated semiconductor circuit |
| 04/14/1999 | EP0907965A1 Component housing for surface mounting a semiconductor component |
| 04/14/1999 | EP0907963A1 Solder bump apparatus, electronic component and method for forming a solder bump |
| 04/14/1999 | EP0907928A1 Leadframe for the assembly of an integrated circuit in an injection mounded housing |
| 04/14/1999 | EP0829097A4 Method of transfer molding electronic packages and packages produced thereby |
| 04/14/1999 | CN2314476Y Heat radiation fixer of integrated circuit |
| 04/14/1999 | CN1214150A Semiconductor device |
| 04/14/1999 | CN1213997A Method employing UV laser pulses of varied energy density to form blind vias in multilayered targets |
| 04/14/1999 | CN1213879A Protective circuit and electric circuit using protective circuit |
| 04/14/1999 | CN1213856A Method of linear arrange of metallic fuse section used on crystal chips |
| 04/14/1999 | CN1213855A 半导体器件 Semiconductor devices |
| 04/14/1999 | CN1213854A Semiconductor package incorporating heat dispersion plate inside resin molding and fabrication method for the same |
| 04/14/1999 | CN1213852A Semiconductor device and method of manufacturing the same |
| 04/14/1999 | CN1213851A Copper stud structure with refractory metal liner |
| 04/14/1999 | CN1213850A Semiconductor device manufacturing method press die and guide rail |
| 04/14/1999 | CN1213844A Electronic device and its mfg. method |
| 04/14/1999 | CN1213791A Thermal processing apparatus for sheet-like workpieces |
| 04/14/1999 | CN1042986C Method of fabricating semiconductor device |
| 04/13/1999 | US5894410 Perimeter matrix ball grid array circuit package with a populated center |
| 04/13/1999 | US5894173 Stress relief matrix for integrated circuit packaging |
| 04/13/1999 | US5894172 Semiconductor device with identification function |
| 04/13/1999 | US5894171 Semiconductor integrated circuit having a grounding terminal |
| 04/13/1999 | US5894170 Wiring layer in semiconductor device |
| 04/13/1999 | US5894169 Low-leakage borderless contacts to doped regions |
| 04/13/1999 | US5894168 Mask generation technique for producing an integrated circuit with optimal polysilicon interconnect layout for achieving global planarization |
| 04/13/1999 | US5894167 Encapsulant dam standoff for shell-enclosed die assemblies |
| 04/13/1999 | US5894166 Chip mounting scheme |
| 04/13/1999 | US5894165 Leads between chips assembly |
| 04/13/1999 | US5894160 Method of forming a landing pad structure in an integrated circuit |
| 04/13/1999 | US5894108 Plastic package with exposed die |
| 04/13/1999 | US5894107 Chip-size package (CSP) using a multi-layer laminated lead frame |
| 04/13/1999 | US5893952 Apparatus for rapid thermal processing of a wafer |
| 04/13/1999 | US5893765 Compliant contact integrator |
| 04/13/1999 | US5893752 Process for forming a semiconductor device |
| 04/13/1999 | US5893749 Tungsten plug interconnecting an upper level conductor and a diffused region in a substrate |
| 04/13/1999 | US5893744 Method of forming a zero layer mark for alignment in integrated circuit manufacturing process employing shallow trench isolation |
| 04/13/1999 | US5893733 Method of forming an electrostatic-discharge protecting circuit |
| 04/13/1999 | US5893727 Method for manufacturing a massive parallel interconnection attachment using flexible circuit |
| 04/13/1999 | US5893726 Semiconductor package with pre-fabricated cover and method of fabrication |
| 04/13/1999 | US5893725 C4 substrate contact pad which has a layer of NI-B plating |
| 04/13/1999 | US5893724 Method for forming a highly reliable and planar ball grid array package |
| 04/13/1999 | US5893723 Manufacturing method for semiconductor unit |
| 04/13/1999 | US5893623 Structure and method for mounting semiconductor devices, and liquid crystal display |
| 04/13/1999 | US5893511 Pressure sintering method for fastening electronic components on a substrate |
| 04/13/1999 | US5893508 Circuit board having a terminal for detecting disconnection of a bonding wire and a wire bonding apparatus using such a board |
| 04/13/1999 | US5893409 Cooling element for electronic components |
| 04/13/1999 | US5893380 Method for cleaning molding compound tablets |
| 04/08/1999 | WO1999017596A1 Hybrid substrate for cooling an electronic component and method for forming the substrate |
| 04/08/1999 | WO1999017384A1 Housing for piezoelectric transformer device |
| 04/08/1999 | WO1999017368A1 Three-dimensional component stacking using high density multichip interconnect decals |
| 04/08/1999 | WO1999017367A1 Method for coating a silicon chip and electronic card comprising at least one chip coated by such method |
| 04/08/1999 | WO1999017366A1 Semiconductor component and method for the production thereof |
| 04/08/1999 | WO1999017365A1 Metal locking structures to prevent a passivation layer from delaminating |
| 04/08/1999 | WO1999017364A1 Chip-size package using a polyimide pcb interposer |
| 04/08/1999 | WO1999017363A1 Method for producing a multilevel cable carrier (substrate), especially for multichip modules |
| 04/08/1999 | WO1999017362A1 Energy absorbing structures to prevent damage to an integrated circuit |
| 04/08/1999 | WO1999017361A2 Intermediate carrier substrate with high wiring density for electronic components |
| 04/08/1999 | WO1999017359A1 Interconnect structure with a low permittivity dielectric layer |
| 04/08/1999 | WO1999017354A1 A system for identifying defective electronic devices |
| 04/08/1999 | WO1999017353A1 Multiplexed test circuit on a semiconductor chip |
| 04/08/1999 | WO1999017352A1 Method and compositions for metallizing microvias and high density interconnects in photodefined dielectrics |
| 04/08/1999 | WO1999017348A1 Metal staples to prevent interlayer delamination |
| 04/08/1999 | WO1999017347A1 Method for forming a low-impedance conductor path area on a semiconductor substrate |
| 04/08/1999 | WO1999017317A1 Microelectronic component carrier and method of its manufacture |
| 04/08/1999 | WO1999017253A1 Method for making an electronic module or label, resulting electronic module or label and medium containing such a module or label |
| 04/08/1999 | WO1999017125A1 Method and apparatus for probing an integrated circuit through the back side of an integrated circuit die |
| 04/08/1999 | WO1999016601A1 Manufacture of thin metal objects |
| 04/08/1999 | WO1999007196A3 Heat sink |
| 04/08/1999 | WO1999004415A3 Integrated circuit package |
| 04/08/1999 | DE19845050A1 Encapsulating material for semiconductors |
| 04/08/1999 | DE19845021A1 Epoxy resin composition for encapsulation of semiconductor devices |
| 04/08/1999 | DE19823069A1 Semiconductor component with high performance, output transistor chip on semiconductor substrate |
| 04/08/1999 | DE19813525A1 Integrated semiconductor component with chip and numerous connecting points |
| 04/08/1999 | DE19802347A1 Semiconductor substrate with stackable semiconductor module |
| 04/08/1999 | DE19743886A1 Solder paste contains copper or nickel-plated aluminium balls |
| 04/08/1999 | DE19743365A1 Verfahren zur Herstellung eines Mehrebenen-Verdrahtungsträgers (Substrat), insbesondere für Multichipmodule A process for preparing a multi-level wiring support (substrate), especially for multi-chip modules |
| 04/08/1999 | DE19742972A1 Verfahren zur Ausbildung eines niederohmigen Leitbahnbereichs auf einem Halbleitersubstrat A method of forming a low-Leitbahnbereichs on a semiconductor substrate |
| 04/08/1999 | CA2305696A1 Manufacture of thin metal objects |
| 04/08/1999 | CA2305635A1 Method for coating a silicon chip and electronic card comprising at least one chip coated by such method |
| 04/08/1999 | CA2304581A1 Method for making an electronic module or label, resulting electronic module or label and medium containing such a module or label |
| 04/08/1999 | CA2304537A1 Microelectronic component carrier and method of its manufacture |