Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1999
05/04/1999US5901039 Mounting device for electronic components
05/04/1999US5901037 For dissipating heat generated in a semiconductor module
05/04/1999US5901036 Cooling device for electrical assemblies
05/04/1999US5901023 Semiconductor input/output circuit
05/04/1999US5901022 Charged device mode ESD protection circuit
05/04/1999US5900738 Method of testing semiconductor devices
05/04/1999US5900735 Device for evaluating reliability of interconnect wires
05/04/1999US5900676 Semiconductor device package structure having column leads and a method for production thereof
05/04/1999US5900675 Integrated circuit chip package
05/04/1999US5900674 Interface structures for electronic devices
05/04/1999US5900673 Low-temperature fusing brazing material, and wiring board and semiconductor device-housing package assembled with the same
05/04/1999US5900672 Electrical connector in an integrated circuit
05/04/1999US5900671 Electronic component including conductor connected to electrode and anodically bonded to insulating coating
05/04/1999US5900670 Stackable heatsink structures for semiconductor devices
05/04/1999US5900669 Semiconductor component
05/04/1999US5900668 Semiconductor device
05/04/1999US5900663 Quasi-mesh gate structure for lateral RF MOS devices
05/04/1999US5900659 Buried bit line DRAM cells
05/04/1999US5900645 Semiconductor device and method of testing the same
05/04/1999US5900644 Test site and a method of monitoring via etch depths for semiconductor devices
05/04/1999US5900643 Integrated circuit chip structure for improved packaging
05/04/1999US5900582 Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
05/04/1999US5900581 Resin sealing structure for elements
05/04/1999US5900468 Epoxy resin composition
05/04/1999US5900312 Integrated circuit chip package assembly
05/04/1999US5900290 Method of making low-k fluorinated amorphous carbon dielectric
05/04/1999US5900072 Planarized dielectric layer having reduced step coverage, improved mechanical strength and little thermal deformation
05/04/1999US5899742 Manufacturing method for self-aligned local interconnects and contacts simultaneously
05/04/1999US5899740 Methods of fabricating copper interconnects for integrated circuits
05/04/1999US5899738 Method for making metal plugs in stacked vias for multilevel interconnections and contact openings while retaining the alignment marks without requiring extra masking steps
05/04/1999US5899736 On a semiconductor substrate
05/04/1999US5899720 Process of fabricating salicide structure from high-purity reproducible cobalt layer without sacrifice of leakage current and breakdown voltage of P-N junction
05/04/1999US5899717 Method for fabricating semiconductor device
05/04/1999US5899708 Method for forming a thin film transistor using an electrostatic shield
05/04/1999US5899707 Method for making doped antifuse structures
05/04/1999US5899706 Method of reducing loading variation during etch processing
05/04/1999US5899705 Stacked leads-over chip multi-chip module
05/04/1999US5899703 Method for chip testing
05/04/1999US5899701 Method for making silica strain test structures
05/04/1999US5899265 Reflux cooler coupled with heat pipes to enhance load-sharing
05/04/1999CA2075462C Bump structure and method for bonding to a semi-conductor device
04/1999
04/30/1999CA2239356A1 Electronic coatings having low dielectric constant
04/29/1999WO1999021402A1 Heat sink mounting assembly for surface mount electronic device packages
04/29/1999WO1999021332A1 Magnetically coupled signal isolator using a faraday shielded mr or gmr receiving element
04/29/1999WO1999021274A2 Integrated electronic circuit comprising an oscillator with passive circuit elements
04/29/1999WO1999021234A1 Thermoelectric module unit
04/29/1999WO1999021228A1 Semiconductor module and power converter comprising it
04/29/1999WO1999021227A1 Connector assembly for accommodating bga-style components
04/29/1999WO1999021226A1 Chip scale package using large ductile solder balls
04/29/1999WO1999021225A1 Mounting arrangement for securing an integrated circuit package to a heat sink
04/29/1999WO1999021224A1 Package substrate
04/29/1999WO1999021132A1 Ic card
04/29/1999WO1999020814A1 Aluminum alloys for electronic components
04/29/1999WO1999008323A9 Rf power device having voltage controlled linearity
04/29/1999WO1999000844A3 Sockets for semiconductor devices with spring contact elements
04/29/1999DE19849340A1 Low thermal expansion cordierite ceramic contains a grain boundary alkaline earth, rare earth, gallium or indium compound
04/29/1999DE19823140A1 Sense FET with main cell array (MCA)
04/29/1999CA2308587A1 Mounting arrangement for securing an integrated circuit package to a heat sink
04/29/1999CA2275387A1 Thermoelectric module unit
04/29/1999CA2252113A1 Substrate and process for producing the same
04/28/1999EP0911878A2 Metalization system
04/28/1999EP0911877A1 Kilowatt power transistor
04/28/1999EP0911876A2 Low thermal expansion circuit board and multilayer wiring circuit board
04/28/1999EP0911874A2 Management of a lateral deflection amount of a metal wire in a semiconductor device
04/28/1999EP0911873A2 A bumped tape and bump sheet used in connecting tab tape to semiconductor chip
04/28/1999EP0739541A4 Chamfered electronic package component
04/28/1999CN1215503A Light emitting element, semiconductor light emitting device, and method for manufacturing them
04/28/1999CN1215501A Semiconductor device and method for manufacturing the same
04/28/1999CN1215230A Metal wire transversal displacement control in semiconductor device
04/28/1999CN1215227A Method for making semiconductor device
04/28/1999CN1043173C Semiconductor diode consisting of groove shape casing component and packaging method
04/27/1999US5898909 Ultra high frequency radio communication apparatus
04/27/1999US5898905 Baseband simulator architecture for testing a radio frequency section of a mobile communications transceiver
04/27/1999US5898575 Support assembly for mounting an integrated circuit package on a surface
04/27/1999US5898571 Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages
04/27/1999US5898570 Enhanced heat transfer in printed circuit boards
04/27/1999US5898557 Switching apparatus
04/27/1999US5898491 Surface defect test method and surface defect tester
04/27/1999US5898228 On-chip misalignment indication
04/27/1999US5898227 Alignment targets having enhanced contrast
04/27/1999US5898226 Semiconductor chip having a bonding window smaller than a wire ball
04/27/1999US5898225 Lead frame bonding power distribution systems
04/27/1999US5898224 Apparatus for packaging flip chip bare die on printed circuit boards
04/27/1999US5898223 Chip-on-chip IC packages
04/27/1999US5898222 Capped copper electrical interconnects
04/27/1999US5898221 Semiconductor device having upper and lower wiring layers
04/27/1999US5898220 Multi-chip device and method of fabrication employing leads over and under processes
04/27/1999US5898219 Custom corner attach heat sink design for a plastic ball grid array integrated circuit package
04/27/1999US5898218 Structure for mounting electronic components and method for mounting the same
04/27/1999US5898217 Semiconductor device including a substrate having clustered interconnects
04/27/1999US5898216 Micromodule with protection barriers and a method for manufacturing the same
04/27/1999US5898215 Microelectronic assembly with connection to a buried electrical element, and method for forming same
04/27/1999US5898213 Semiconductor package bond post configuration
04/27/1999US5898212 Lead frame and semiconductor package
04/27/1999US5898200 Microwave integrated circuit
04/27/1999US5898198 RF power device having voltage controlled linearity
04/27/1999US5898186 Reduced terminal testing system
04/27/1999US5898128 Electronic component
04/27/1999US5897962 Mixing tungsten powder and copper oxide, reducing to alloy; control of particle size
04/27/1999US5897917 Identifying an area of a heat sink component to receive thermoconductive grease, applying thermal grease to this area by silk screening or pad printing, covering the grease with a protective film
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