Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1999
05/11/1999US5903583 Diode laser component with cooling element and diode laser module
05/11/1999US5903488 Semiconductor memory with improved word line structure
05/11/1999US5903443 Electronic system
05/11/1999US5903437 Electronic integrated circuit package
05/11/1999US5903436 Thermal spreader cap
05/11/1999US5903435 Heat dispersing method for IC of PC board and its device
05/11/1999US5903434 CPU heat sink clamping device
05/11/1999US5903068 Electroacoustic transducer
05/11/1999US5903059 Semiconductor structure
05/11/1999US5903058 Semiconductor device
05/11/1999US5903057 Semiconductor device that compensates for package induced delay
05/11/1999US5903055 Aluminum, niobium, zirconium, tantalum; low electrical resistance
05/11/1999US5903053 Semiconductor device
05/11/1999US5903052 Structure for semiconductor package for improving the efficiency of spreading heat
05/11/1999US5903051 Electronic component and method of manufacture
05/11/1999US5903050 Semiconductor package having capacitive extension spokes and method for making the same
05/11/1999US5903049 Semiconductor module comprising semiconductor packages
05/11/1999US5903048 Lead frame for semiconductor device
05/11/1999US5903047 Low temperature-deposited passivation film over semiconductor device
05/11/1999US5903046 Integrated circuit device having cyanate ester buffer coat
05/11/1999US5903045 Semiconductor structure
05/11/1999US5903044 Hermetic chip and method of manufacture
05/11/1999US5903042 Self-aligned antifuse with base
05/11/1999US5903041 Integrated two-terminal fuse-antifuse and fuse and integrated two-terminal fuse-antifuse structures incorporating an air gap
05/11/1999US5903019 Semiconductor device having a plurality of input/output cell areas with reduced pitches therebetween
05/11/1999US5903011 Semiconductor device having monitor pattern formed therein
05/11/1999US5902959 Surface mount semiconductor package
05/11/1999US5902752 Active layer mask with dummy pattern
05/11/1999US5902717 Method of fabricating semiconductor device using half-tone phase shift mask
05/11/1999US5902712 Substrate having circuits disposed thereon, coated with ablatively photodecomposable polymer comprising acrylic polymer with bound photoabsorber
05/11/1999US5902686 Solder structure for microelectronic substrate comprising under bump metallurgy layer on substrate, solder bump on under bump metallurgy layer wherein said solder bump includes oxide layer, intermediate layer between bump layer and solder bump
05/11/1999US5902472 Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath
05/11/1999US5902452 Forming oxide layer on silicon substrate, depositing and patterning photoresist layer, removing oxide layer and predetermined thickness of silicon in single dry etching stepusing gas mixture of carbon tetrafluoride and oxygen
05/11/1999US5902152 Active connector for a chip card
05/11/1999US5902131 Dual-level metalization method for integrated circuit ferroelectric devices
05/11/1999US5902122 Dehydrating a vapor deposited dielectric layer with nitrogen or nitrogen oxide plasma
05/11/1999US5902120 Process for producing spatially patterned components
05/11/1999US5902119 Leadframe tip arrangement designing method
05/11/1999US5901901 Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly
05/11/1999US5901781 Heat radiator for electronic parts
05/11/1999US5901436 Method of manufacturing lead frame
05/11/1999CA2253099A1 Polyfunctional cyanate resin composition and resin-encapsulated type semiconductor device
05/06/1999WO1999022553A1 Transistor clamp
05/06/1999WO1999022411A1 Silicon based conductive material and process for production thereof
05/06/1999WO1999022410A1 Thermoelectric transducing material and method of producing the same
05/06/1999WO1999022405A1 Heat sink for an electronic component
05/06/1999WO1999022404A1 Method for making a locally inhomogeneous substrate of a microwave circuit, resulting substrates, circuits and interconnections
05/06/1999WO1999022212A1 Structure equipped with electric contacts formed through said structure substrate and method for obtaining said structure
05/06/1999WO1999022192A1 Multi-mode, two-phase cooling module
05/06/1999WO1999021708A1 Use of glass laminate as a substrate in semiconductor devices
05/06/1999WO1999021707A1 A laminate comprising a thin borosilicate glass substrate as a constituting layer
05/06/1999WO1999021706A1 Low dielectric constant materials prepared from photon or plasma assisted cvd
05/06/1999WO1999009366A9 Heat sink including pedestal
05/06/1999EP0914032A1 Low-emi circuit board and low-emi cable connector
05/06/1999EP0914031A2 Cooling apparatus
05/06/1999EP0913866A1 Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board
05/06/1999EP0913865A2 Low noise ball grid array package
05/06/1999EP0913864A1 Mounting structure of semiconductor bare chip
05/06/1999EP0913863A2 Method of manufacturing semiconductor device with copper wiring film
05/06/1999EP0913861A2 Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
05/06/1999EP0913719A2 Connection terminal structure for liquid crystal display and semiconductor device, and method of producing the same
05/06/1999EP0913429A2 Siloxane-modified polyamideimide resin composition adhesive film, adhesive sheet and semiconductor device
05/06/1999EP0913372A1 Aluminum nitride substrate and process for producing the same
05/06/1999EP0912997A1 Rf power package with a dual ground
05/06/1999EP0912996A1 Integrated circuit which uses an etch stop for producing staggered interconnect lines
05/06/1999EP0912335A1 Conductive elastomers and methods for fabricating the same
05/06/1999EP0803174A4 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
05/06/1999EP0779904B1 Epoxy resin mixtures for prepregs and composites
05/06/1999EP0757886A4 Thermal management system
05/06/1999DE19829472A1 Semiconductor device has a fusible link portion which can be severed by low energy laser light
05/06/1999DE19810003A1 Semiconductor device production process involves etching a doped polysilicon layer in the presence of carbon-containing and oxygen-containing gases
05/06/1999DE19748173A1 Biodegradable electronic components
05/06/1999DE19747846A1 Bauelement und Verfahren zum Herstellen des Bauelements Device and method for manufacturing the component
05/06/1999DE19747715A1 Clamp for securing electronic component to cooler
05/06/1999DE19747559A1 Multilevel interconnect structure for high density integrated circuit devices, integrated circuit memories
05/06/1999DE19747321A1 Liquid cooler for power semiconductor components
05/06/1999DE19746642A1 Semiconductor component is produced with high circuit complexity to hinder piracy and manipulation
05/06/1999CA2307631A1 Transistor clamp
05/06/1999CA2307239A1 Thermoelectric transducing material and method of producing the same
05/05/1999CN1216213A Spray-cooling circuit board apparatus
05/05/1999CN1216159A Semiconductor device and multilayered lead frame used for same
05/05/1999CN1216158A Electronic component, semiconductor device, mfg method therefor, circuit board and electronic equipment
05/05/1999CN1215974A Electrical tranducing device and heat conduction pipe therefor
05/05/1999CN1215973A Mounted structure of prinited circuit board in semiconductor package
05/05/1999CN1215922A Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
05/05/1999CN1215921A Mold-BGA-type semiconductor device and method for making the same
05/05/1999CN1215920A Electronic package with thermally conductive support member
05/05/1999CN1215919A Semiconductor device
05/05/1999CN1215918A Wiring layout method for semiconductor device and recording medium on which wiring layout program for semiconductor device is recorded
05/05/1999CN1215916A Semiconductor device and process for production thereof
05/05/1999CN1215914A Semiconductor device and method for fabricating the same
05/05/1999CN1215913A Method for manufacturing semiconductor device having multiple wiring layer
05/05/1999CN1215911A Method of fabricating semiconductor device
05/04/1999US5901050 Wired base plate and package for electronic parts
05/04/1999US5901048 Printed circuit board with chip collar
05/04/1999US5901046 Surface mount type package unit and method for manufacturing the same
05/04/1999US5901043 Device and method for reducing thermal cycling in a semiconductor package
05/04/1999US5901042 Package and semiconductor device
05/04/1999US5901041 Flexible integrated circuit package
05/04/1999US5901040 Heat sink and Faraday Cage assembly for a semiconductor module and a power converter
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