Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1999
05/19/1999EP0915919A1 Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
05/19/1999EP0858578A4 Liquid cooled heat sink for cooling electronic components
05/19/1999EP0855089A4 Solderable transistor clip and heat sink
05/19/1999EP0828688B1 Aluminium nitride granules
05/19/1999EP0673023B1 Vacuum-clamping device using ceramic vacuum-clamping board
05/19/1999EP0438524B1 Flame retardant epoxy molding compound, method and enscapsulated device
05/19/1999EP0348018B1 Method of manufacture of a resin encapsulated semiconductor device
05/19/1999CN2319925Y CPU card casket buckling structure
05/19/1999CN1216892A Method and device for cooling integrated circuit of PC board
05/19/1999CN1043414C Process for metal surface treatment for mfg. electronic device
05/18/1999US5905938 Method of manufacturing a semiconductor substrate material
05/18/1999US5905639 Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds
05/18/1999US5905636 Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
05/18/1999US5905635 Multi-level electronic module assembly
05/18/1999US5905634 Semiconductor package having a heat slug
05/18/1999US5905633 Ball grid array semiconductor package using a metal carrier ring as a heat spreader
05/18/1999US5905614 Device for protection against electrostatic discharges on the terminals of a MOS integrated circuit
05/18/1999US5905401 Device and method for limiting the extent to which circuits in integrated circuit dice electrically load bond pads and other circuit nodes in the dice
05/18/1999US5905383 Multi-chip module development substrate
05/18/1999US5905382 Universal wafer carrier for wafer level die burn-in
05/18/1999US5905308 Bond pad for integrated circuit
05/18/1999US5905307 Semiconductor device incorporating multilayer wiring structure
05/18/1999US5905305 Condensed memory matrix
05/18/1999US5905303 Method for manufacturing bump leaded film carrier type semiconductor device
05/18/1999US5905301 Mold package for sealing a chip
05/18/1999US5905300 Semiconductor assembly
05/18/1999US5905299 Integrated circuit package
05/18/1999US5905298 Semiconductor device having an insulation film of low permittivity and a fabrication process thereof
05/18/1999US5905295 Reduced pitch laser redundancy fuse bank structure
05/18/1999US5905282 Multi-terminal surge protection device
05/18/1999US5904859 Applying etchant solution to metal layer, said etchant solution having a ph of at least 11, and comprising an alkali ferricyanide to etch the copper and chromium, the etchant solution also containing copper complexing agent
05/18/1999US5904796 For improved heat transfer between surface of electronics and a heat sink; planar substrate of a heat resistant material having a layer of adhesive on one surface and a conformable, heat conductive material on the other surface
05/18/1999US5904576 Method of forming wiring structure
05/18/1999US5904565 Low resistance contact between integrated circuit metal levels and method for same
05/18/1999US5904563 Integrated circuits
05/18/1999US5904562 Method of metallizing a semiconductor wafer
05/18/1999US5904558 Fabrication process of semiconductor device
05/18/1999US5904557 Method for forming multilevel interconnection of semiconductor device
05/18/1999US5904556 Method for making semiconductor integrated circuit device having interconnection structure using tungsten film
05/18/1999US5904555 Method for packaging a semiconductor device
05/18/1999US5904545 Apparatus for fabricating self-assembling microstructures
05/18/1999US5904544 Method of making a stable high voltage semiconductor device structure
05/18/1999US5904516 Transistor structure and method for fabricating the same
05/18/1999US5904514 Method for performing anodic oxidation
05/18/1999US5904511 Method of forming a liquid crystal device
05/18/1999US5904507 Programmable anti-fuses using laser writing
05/18/1999US5904506 Semiconductor device suitable for testing
05/18/1999US5904505 Process for producing encapsulated semiconductor device having metal foil material covering and metal foil
05/18/1999US5904503 Method of forming flat inner lead tips on lead frame
05/18/1999US5904501 Hollow package manufacturing method
05/18/1999US5904500 Maleimide polymers
05/18/1999US5904499 Package for power semiconductor chips
05/18/1999US5904498 Connection component with releasable leads
05/18/1999US5904497 Method and apparatus for semiconductor assembly which includes testing of chips and replacement of bad chips prior to final assembly
05/18/1999US5904496 Wafer fabrication of inside-wrapped contacts for electronic devices
05/18/1999US5904490 Method of measuring electron shading damage
05/18/1999US5904488 Semiconductor integrated circuit device
05/18/1999US5904486 Method for performing a circuit edit through the back side of an integrated circuit die
05/18/1999US5903977 Method and an apparatus for manufacturing heatsink devices
05/14/1999WO1999023730A1 Converter socket terminal
05/14/1999WO1999023702A1 Monolithic inductor
05/14/1999WO1999023701A1 A high power prematched mmic transistor with improved ground potential continuity
05/14/1999WO1999023700A1 Chip housing, methods of making same and methods for mounting chips therein
05/14/1999WO1999023698A1 Titanium nitride contact plug formation
05/14/1999WO1999023697A1 Component and method for production thereof
05/14/1999WO1999023696A1 Semiconductor device and method for manufacturing the same______
05/14/1999WO1999023694A1 Wiring structure of semiconductor device, electrode, and method for forming them
05/14/1999WO1999022572A2 Method for producing and controlling electronic components
05/14/1999WO1999022571A2 Three-dimensional flexible electronic module
05/14/1999WO1999008325A3 Electrode means, with or without functional elements and an electrode device formed of said means
05/12/1999EP0915522A2 Semiconductor device comprising a capacitor and method of manufacturing the same
05/12/1999EP0915516A2 Substrate for stacked module and stacked module
05/12/1999EP0915515A2 Electrical signal transmitting arrangement between a thermally isolated module on carrier plate and adjacent neighbouring modules
05/12/1999EP0915514A2 Semiconductor device
05/12/1999EP0915513A1 High quality factor, integrated inductor and production method thereof
05/12/1999EP0915512A2 Ceramic substrate having a metal circuit
05/12/1999EP0915511A2 Arrangement of a layer to be heated on a substrate
05/12/1999EP0915505A1 Semiconductor device package, manufacturing method thereof and circuit board therefor
05/12/1999EP0915504A1 Semiconductor package and method of forming the same
05/12/1999EP0915501A1 Method of forming an Al-Ge alloy with WGe polishing stop
05/12/1999EP0915178A2 Sputtering target of highly purified titanium
05/12/1999EP0915177A1 Highly purified metal and sputtering target using the same
05/12/1999EP0915176A1 Wiring network and semiconductor package
05/12/1999EP0915118A1 Epoxy resin composition and semiconductor device encupsulated therewith
05/12/1999EP0914757A1 Z-axis interconnect method and circuit
05/12/1999EP0914650A2 Method of manufacturing a body having a structure of layers
05/12/1999EP0840660B1 Fluxless contacting of components
05/12/1999EP0572514B1 Method and device for continuous assembling of patterned strips
05/12/1999DE19851810A1 Curable resin material, e.g. for printed circuit boards
05/12/1999DE19849919A1 Active semiconductor module
05/12/1999DE19754860C1 Security relief for objects such as credit cards
05/12/1999DE19747388C1 Contactless chip card manufacturing method
05/12/1999CN1216635A Os rectifying schottky and ohmic junction and W/WC/TiC ohmic contacts on sic
05/12/1999CN1216623A Leadframe for the assembly of an integrated circuit in an injection mounded housing
05/12/1999CN1216403A Semiconductor device and method of manufacturing the same
05/12/1999CN1216402A Low noise ball grid array package
05/12/1999CN1216400A Method of manufacturing semiconductor device having interconnection composed of doped polysilicon layer
05/12/1999CN1216398A Method of manufacturing semiconductor device with copper wiring film
05/12/1999CN1216397A Method for manufacturing semiconductor devices having dual damascene structure
05/12/1999CN1043389C Semiconductor integrated circuit device including a memory device and its producing method
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