Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1999
06/02/1999CN1218080A Sealing agent and liquid crystal display element using the same
06/01/1999USRE36217 Top load socket for ball grid array devices
06/01/1999US5909637 Copper adhesion to a diffusion barrier surface and method for same
06/01/1999US5909636 Method of forming a landing pad structure in an integrated circuit
06/01/1999US5909635 Cladding of an interconnect for improved electromigration performance
06/01/1999US5909633 Method of manufacturing an electronic component
06/01/1999US5909377 Method for manufacturing a power bus on a chip
06/01/1999US5909358 Electronic module
06/01/1999US5909123 Method for performing reliability screening and burn-in of semi-conductor wafers
06/01/1999US5909122 Integrated circuit package pin marking system
06/01/1999US5909059 Semiconductor device having contact plug and method for manufacturing the same
06/01/1999US5909058 Semiconductor package and semiconductor mounting part
06/01/1999US5909056 High performance heat spreader for flip chip packages
06/01/1999US5909055 Chip package device mountable on a mother board in whichever of facedown and wire bonding manners
06/01/1999US5909054 Semiconductor device having a multiple-terminal integrated circuit formed on a circuit substrate
06/01/1999US5909053 Lead frame and method for manufacturing same
06/01/1999US5909050 Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
06/01/1999US5909035 Thin film transistor array having a static electricity preventing circuit
06/01/1999US5909034 Electronic device for testing bonding wire integrity
06/01/1999US5909010 Chip size package
06/01/1999US5909009 Laminate organic resin wiring board and method of producing the same
06/01/1999US5908813 Method making integrated circuit metallization with superconductor BEOL wiring
06/01/1999US5908799 Apparatus for producing semiconductor using aluminum nitride bodies as substrates
06/01/1999US5908317 Method of forming chip bumps of bump chip scale semiconductor package
06/01/1999US5908316 Method of passivating a semiconductor substrate
06/01/1999US5908315 Method for forming a test structure to determine the effect of LDD length upon transistor performance
06/01/1999US5908304 Mass memory and method for the manufacture of mass memories
05/1999
05/27/1999WO1999026460A1 Cooling system for semiconductor die carrier
05/27/1999WO1999026458A1 Multilayer printed wiring board and method for manufacturing the same
05/27/1999WO1999026457A1 Synthetic jet actuators for cooling heated bodies and environments
05/27/1999WO1999026289A1 Semiconductor device and method for manufacturing the same
05/27/1999WO1999026288A1 Semiconductor device and method for manufacturing the same
05/27/1999WO1999026287A1 Silicon film used as a substrate for semiconductor circuits in cards
05/27/1999WO1999026286A1 Heat pipe thermal management apparatus
05/27/1999WO1999026285A1 Multi-chip module having interconnect dies
05/27/1999WO1999026283A1 Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
05/27/1999WO1999015474A3 Composite based on a porous material
05/27/1999WO1999008317B1 Integrated electric circuit with a passivation layer
05/27/1999WO1999000826A3 Resin molded type semiconductor device and a method of manufacturing the same
05/27/1999WO1998052217A3 Method of forming a chip scale package, and a tool used in forming the chip scale package
05/27/1999DE19854414A1 Light emitting module
05/27/1999DE19750316A1 Silicon foil carrier manufacturing method for chip card
05/27/1999DE19750147A1 One-component epoxy resin for coating electronic components
05/27/1999CA2309630A1 Heat pipe thermal management apparatus
05/26/1999EP0918355A2 Solder bump input/output pad for a surface mount circuit device
05/26/1999EP0918354A2 Wafer-scale assembly of chip-size packages
05/26/1999EP0917737A1 Semiconductor device provided with a metallization with a barrier layer comprising at least titanium, tungsten, or nitrogen, and method of manufacturing same
05/26/1999EP0917597A2 Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same
05/26/1999EP0749640B1 Semiconductor die carrier
05/26/1999CN1217581A Semiconductor device and mfg. method therefor
05/26/1999CN1217570A Method for producing semiconductor package in chip size
05/26/1999CN1217569A Formation method of aluminium film for wiring
05/26/1999CN1217566A Preparation for structuralized protection layer and insulation layer
05/26/1999CN1043462C Aluminium nitride body having graded metallurgy
05/25/1999US5907789 Method of forming a contact-hole of a semiconductor element
05/25/1999US5907787 Process for fabricating multilayer connection
05/25/1999US5907786 Process for manufacturing a flip-chip integrated circuit
05/25/1999US5907785 Method of processing a semiconductor wafer
05/25/1999US5907769 Leads under chip in conventional IC package
05/25/1999US5907763 Method and device to monitor integrated temperature in a heat cycle process
05/25/1999US5907477 Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant
05/25/1999US5907474 Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package
05/25/1999US5907190 Semiconductor device having a cured silicone coating with non uniformly dispersed filler
05/25/1999US5907189 Semiconductor package
05/25/1999US5907187 Electronic component and electronic component connecting structure
05/25/1999US5907186 Lead-on-clip lead frame and semiconductor package using the same
05/25/1999US5907185 Ceramic terminal block, hermetic sealed package, and complex semiconductor device
05/25/1999US5907184 Integrated circuit package electrical enhancement
05/25/1999US5907182 Semiconductor device having element with high breakdown voltage
05/25/1999US5907180 Ballast monitoring for radio frequency power transistors
05/25/1999US5907178 Multi-view imaging apparatus
05/25/1999US5907174 Electrostatic discharge protecting transistor
05/25/1999US5907166 Single deposition layer metal dynamic random access memory
05/25/1999US5906700 Method of manufacturing circuit module
05/25/1999US5906312 Solder bump for flip chip assembly and method of its fabrication
05/25/1999US5906310 Packaging electrical circuits
05/25/1999US5906042 Method and structure to interconnect traces of two conductive layers in a printed circuit board
05/20/1999WO1999025165A2 Modular and multifunctional structure
05/20/1999WO1999025022A1 Non-electrically conductive thermal dissipator for electronic components
05/20/1999WO1999018030A3 Diamond-based composites with high thermal conductivity
05/20/1999DE19852299A1 Metal substrate, to be etched through a resist pattern, has a smooth surface with specified roughness values
05/20/1999DE19843603A1 Marking method of fluoropolymer objects
05/20/1999DE19820488A1 Semiconductor device produced by dry etching a narrow connection via
05/20/1999DE19751109A1 Production of reliable microcircuit packages
05/20/1999DE19750505A1 Heat dissipator for large sized central processing unit
05/20/1999DE19750306A1 Electronic control device for motor vehicle
05/19/1999EP0917418A1 Electronic apparatus
05/19/1999EP0917211A2 Moldless semiconductor device and photovoltaic device module making use of the same
05/19/1999EP0917202A1 Integrated circuit having embedded memory with electromagnetic shield
05/19/1999EP0917199A2 Improvements in or relating to semiconductor devices
05/19/1999EP0917198A1 Semiconductor device packaging process
05/19/1999EP0917197A2 High-frequency integrated circuit and method for manufacturing the same
05/19/1999EP0917196A2 Semiconductor element module and semiconductor device
05/19/1999EP0917195A1 Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
05/19/1999EP0917191A2 Electronic component unit, electronic assembly using the unit, and method for manufacturing the electronic component unit
05/19/1999EP0917190A2 Circuit support board
05/19/1999EP0917184A2 Electronic coatings having low dielectric constant
05/19/1999EP0916711A2 Conductive paste of high thermal conductivity and electronic part using the same
05/19/1999EP0916688A1 Polyfunctional cyanate resin composition and resin-encapsulated type semiconductor device
05/19/1999EP0916158A1 Low dielectric constant material for use as an insulation element in an electronic device
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