Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1999
06/15/1999US5913134 Method for shielding a circuit
06/15/1999US5913109 Fixtures and methods for lead bonding and deformation
06/15/1999US5913106 Method for testing junction leakage of salicided devices fabricated using shallow trench and refill techniques
06/15/1999US5913100 Mo-W material for formation of wiring, Mo-W target and method for production thereof, and Mo-W wiring thin film
06/15/1999US5912808 Semiconductor component
06/15/1999US5912804 Diode holder with spring clamped heat sink
06/15/1999US5912802 Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
06/15/1999US5912800 Electronic packages and method to enhance the passive thermal management of electronic packages
06/15/1999US5912510 Bonding structure for an electronic device
06/15/1999US5912507 Solderable pad with integral series termination resistor
06/15/1999US5912506 Multi-layer metal sandwich with taper and reduced etch bias and method for forming same
06/15/1999US5912505 Semiconductor package and semiconductor device
06/15/1999US5912490 MOSFET having buried shield plate for reduced gate/drain capacitance
06/15/1999US5912320 Polyphenylene sulfide resin composition and resin-encapsulated semiconductor device
06/15/1999US5912282 Die attach adhesive compositions
06/15/1999US5912068 Epitaxial oxides on amorphous SiO2 on single crystal silicon
06/15/1999US5912066 Silicon nitride circuit board and producing method therefor
06/15/1999US5912047 Borosilicate electronic coatings
06/15/1999US5912046 By placing the liquid having solids in suspension in a centrifuge and spinning it about an axis so that liquid is forced against the surface of component
06/15/1999US5911897 Temperature control for high power burn-in for integrated circuits
06/15/1999US5911850 Separation of diced wafers
06/15/1999CA2050091C Electronic circuit and method with thermal management
06/10/1999WO1999029148A1 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method
06/10/1999WO1999028970A1 Semiconductor device and method for manufacturing the same
06/10/1999WO1999028969A1 Integrated circuit chip package and method of making the same
06/10/1999WO1999010929A3 A method of providing a vertical interconnect between thin film microelectronic devices
06/10/1999WO1999000834A3 Method and apparatus for injection molded flip chip encapsulation
06/10/1999DE19838574A1 Electronic component is encapsulated by a curable resin layer and a thermoplastic resin layer
06/10/1999CA2311800A1 Process for surface-mounting a microwave package on a printed circuit and package and printed circuit for the implementation of the process
06/09/1999EP0921577A1 Light emitting element, semiconductor light emitting device, and method for manufacturing them
06/09/1999EP0921571A1 ESD protection device
06/09/1999EP0921569A1 Integrated circuit package
06/09/1999EP0921567A2 Multi-layer circuit board
06/09/1999EP0921566A1 Microelectromechanical component, such as a microsensor or a microactuator transferable onto a hybrid circuit substrate
06/09/1999EP0921565A2 Package for semiconductor power device and method for assembling the same
06/09/1999EP0921562A2 Improvements in or relating to lead frames
06/09/1999EP0921555A2 A method of implementing electron beam lithography using uniquely positioned alignment marks and a wafer with such alignment marks
06/09/1999EP0920711A1 Interface structures for electronic devices
06/09/1999EP0920710A2 Method of manufacturing a semiconductor device with a multilayer wiring
06/09/1999EP0920659A1 Semiconductor circuit secure against outside accesses
06/09/1999EP0920542A1 Chemical vapor deposition of fluorocarbon polymer thin films
06/09/1999EP0920422A1 Crytalline form of 4-[5-methyl-3-phenylisoxazol-4-yl]benzenesulfonamide
06/09/1999EP0859993B1 Chip module
06/09/1999EP0857355A4 A glass/metal package and method for producing the same
06/09/1999EP0800754A4 Compliant interface for a semiconductor chip
06/09/1999CN1219286A Method and apparatus for manufacturing heat-sink device
06/09/1999CN1219100A Electronic element mounting body and its producing method and electronic apparatus using it
06/09/1999CN1219097A Low thermal expansion circuit board and multi-layer wire circuit board
06/09/1999CN1219095A Flexible printed circuit board unit fixed electronic parts on it
06/09/1999CN1218989A Metallizing system
06/09/1999CN1218980A Semiconductor unit and its producing method
06/08/1999US5911113 Silicon atoms inhibit reaction of metals, minimizing formation of tial3; filling high aspect ratio holes without leaving unfilled voids
06/08/1999US5911112 Method for forming electrical connections between a semiconductor die and a semiconductor package
06/08/1999US5910874 Gate-coupled structure for enhanced ESD input/output pad protection in CMOS ICs
06/08/1999US5910747 Method for optimization of multi-level interconnect RC delay
06/08/1999US5910687 Wafer fabrication of die-bottom contacts for electronic devices
06/08/1999US5910686 Cavity down HBGA package structure
06/08/1999US5910685 Semiconductor memory module having double-sided stacked memory chip layout
06/08/1999US5910684 Integrated circuitry
06/08/1999US5910682 Semiconductor chip stack package
06/08/1999US5910681 Resin sealed semiconductor device
06/08/1999US5910679 Method for fabricating semiconductor device having a crack resistant contact hole and a semiconductor device having a crack resistant hole
06/08/1999US5910678 Raised fuse structure for laser repair
06/08/1999US5910677 Semiconductor device having a protection circuit
06/08/1999US5910641 For interconnecting electronic modules to a wiring carrying substrate
06/08/1999US5910396 Providing damping layer on hard substrate, providing top coating on damping layer, masking top coating, exposing to stream of kinetic particles to pattern top coating
06/08/1999US5910354 Metallurgical interconnect composite
06/08/1999US5910341 Method of controlling the spread of an adhesive on a circuitized organic substrate
06/08/1999US5910020 Method for fabricating a semiconductor device having a refractory metal pillar for electrical connection
06/08/1999US5910010 Semiconductor integrated circuit device, and process and apparatus for manufacturing the same
06/08/1999US5909706 Support table for supporting a module board and screen printing method using the same
06/03/1999WO1999027763A1 A corner heat sink
06/03/1999WO1999027761A1 Cooling element for an unevenly distributed heat load
06/03/1999WO1999027646A1 High-frequency amplifier circuit device and high-frequency transmission system using the same
06/03/1999WO1999027580A1 A novel hole-filling technique using cvd aluminum and pvd aluminum integration
06/03/1999WO1999027571A1 Unlanded via structure and method for making same
06/03/1999WO1999027554A1 Semiconductor element with defined performance characteristics in the case of failure and method for the production thereof
06/02/1999EP0920071A2 Millimeter-wave LTCC package
06/02/1999EP0920058A2 Circuit component built-in module and method for producing the same
06/02/1999EP0920057A2 Secure integrated chip with conductive shield
06/02/1999EP0920056A2 IC card, method and apparatus for producing the same
06/02/1999EP0920055A2 Cooling device for a heat generating componant on a printed board
06/02/1999EP0919113A1 Methods and apparatus for cooling systems for cryogenic power conversion electronics
06/02/1999EP0810910A4 Heat-sinking structures and electrical sockets for use therewith
06/02/1999EP0809924A4 Multiple chip module mounting assembly and computer using same
06/02/1999EP0682808B1 Semiconductor component
06/02/1999DE19855185A1 Integrated circuit connection configuration
06/02/1999DE19817749A1 Semiconductor component has a corrosion resistant connection section inserted in a fusible link
06/02/1999DE19813741A1 Semiconductor device has a stopper layer below a contact via connecting two wiring levels
06/02/1999DE19751911A1 Manufacturing LED with hermetically sealed casing
06/02/1999DE19749987A1 Casing package for semiconductor power components
06/02/1999DE19744281A1 Semiconductor device cooling device for laser diode
06/02/1999CN1218576A Semiconductor device shielded by an array of electrically conducting pins and manufacture thereof
06/02/1999CN1218575A Substrate for semiconductor chip
06/02/1999CN1218292A Semiconductor device
06/02/1999CN1218291A Semiconductor device
06/02/1999CN1218290A Semiconductor integrated circuit device having dummy bonding wires
06/02/1999CN1218289A Semiconductor device
06/02/1999CN1218286A Semiconductor device and method of forming the same
06/02/1999CN1218265A Method of making electronic device
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