Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1999
06/23/1999CN1220776A Substrate for semiconductor device, lead frame, semiconductor device and method for manufacturing the same, circuit board and electronic equipment
06/23/1999CN1220775A Method for manufacturing semicondcutor apparatus, and film carrier tape
06/23/1999CN1220774A Semiconductor device, film carrier tape, and method for manufacturing them
06/23/1999CN1220773A Film carrier tape, semiconductor assembly, semiconudctor device, manufacturing method therefor, mounting board and electronic equipment
06/23/1999CN1220493A Semiconductor device and manfacturing method thereof
06/23/1999CN1220492A Semiconductor device
06/23/1999CN1220488A Improved silica stain test structures and methods therefor
06/22/1999US5915231 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture
06/22/1999US5915203 Method for producing deep submicron interconnect vias
06/22/1999US5915201 Trench surrounded metal pattern
06/22/1999US5915200 Film forming method and semiconductor device manufacturing method
06/22/1999US5915188 Integrated inductor and capacitor on a substrate and method for fabricating same
06/22/1999US5915184 Method of manufacturing semiconductor device having a peak concentration
06/22/1999US5915171 Process of fabricating an antifuse structure
06/22/1999US5915170 Multiple part compliant interface for packaging of a semiconductor chip and method therefor
06/22/1999US5915169 Miniaturization
06/22/1999US5915168 Method for packaging individual die at the wafer level
06/22/1999US5915166 Method of manufacturing a semiconductor integrated circuit device
06/22/1999US5914859 Electronic component mounting base board and method of producing the same
06/22/1999US5914629 Temperature sensing device, semiconductor device having temperature sensing device installed therein and auto-focusing system using this semiconductor device
06/22/1999US5914536 Semiconductor device and soldering portion inspecting method therefor
06/22/1999US5914533 Multilayer module with thinfilm redistribution area
06/22/1999US5914532 Lead frame, method for manufacturing the same, and semiconductor device employing the same
06/22/1999US5914531 Semiconductor device having a ball grid array package structure using a supporting frame
06/22/1999US5914530 Semiconductor device
06/22/1999US5914529 Bus bar structure on lead frame of semiconductor device package
06/22/1999US5914528 Thermally-enhanced lead frame with reduced thermal gap
06/22/1999US5914527 Semiconductor device
06/22/1999US5914526 Semiconductor device
06/22/1999US5914524 Semiconductor device
06/22/1999US5914518 Method of forming a metal contact to landing pad structure in an integrated circuit
06/22/1999US5914508 Two layer hermetic-like coating process for on-wafer encapsulation of GaAs MMIC's
06/22/1999US5914279 Integrated circuits
06/22/1999US5914274 Substrate on which bumps are formed and method of forming the same
06/22/1999US5914218 Spring contact anchored on one end, the free portion compliantly contacts a second contact pad, electrically interconnecting the two contact pads; spring compensates for thermal and mechanical variations
06/22/1999US5914156 Reacting a gaseous molybdenum compound with the carbonaceous material; molybdenum carbide coating protects the carbonaceous material, while providing wetting action for infiltration with molten metal
06/22/1999US5914136 Apparatus for forming semiconductor chip packages
06/22/1999US5914001 In-situ etch of CVD chamber
06/17/1999WO1999030543A1 Method for making circuit elements for a z-axis interconnect
06/17/1999WO1999030366A1 Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
06/17/1999WO1999030365A1 Electromechanical assembly having a pressed joint with low thermal resistance which is residue-free when disassembled
06/17/1999WO1999030363A2 Semiconductor device and method of manufacturing such a device
06/17/1999WO1999030362A1 Method and apparatuses for making z-axis electrical connections
06/17/1999WO1999030354A1 Full face mask for capacitance-voltage measurements
06/17/1999WO1999030275A2 Authenticity attribute
06/17/1999WO1999030174A1 Test system with mechanical alignment for semiconductor chip scale packages and dice
06/17/1999WO1999030090A1 Thermoelectric cooling apparatus with dynamic switching to isolate heat transport mechanisms
06/17/1999WO1999029761A2 Poly(arylene ether) compositions and methods of manufacture thereof
06/17/1999WO1999016132A3 Method for producing a plastic composite body and plastic composite body
06/17/1999WO1998040909A3 Method of forming etched structures comprising implantation steps
06/17/1999DE19822782A1 Monolithic multilayer electronic part exhibits minimal silver diffusion from internal electrodes
06/17/1999DE19814152A1 Electronic component manufacturing method e.g. for SMD
06/17/1999DE19805785C1 Power semiconductor module having temperature dependent lead breaking material
06/17/1999DE19752195A1 Semiconductor component has a two-sided adhesive coated lead-on-chip tape with an aluminum oxide support
06/17/1999CA2280526A1 Authenticity attribute
06/17/1999CA2256141A1 Component mounting arrangement, clip and assembly
06/16/1999EP0923130A1 Electronic circuit, in particular for implantable active medical device, like a heart stimulator or defibrillator, and its manufacturing method
06/16/1999EP0923129A1 A lead frame for electronic semi-conductor devices
06/16/1999EP0923128A1 Semiconductor package and method for manufacturing the same
06/16/1999EP0923127A2 Encapsulating semiconductor chips
06/16/1999EP0923126A1 Integrated electronic device comprising a mechanical stress protection structure
06/16/1999EP0923124A2 A method and system of interconnecting conductors in an integrated circuit
06/16/1999EP0923120A1 Method for manufacturing semiconductor device
06/16/1999EP0923113A2 Low temperature diffusion process for dopant concentration enhancement
06/16/1999EP0922964A1 Socket for inspection of semiconductor device
06/16/1999EP0922915A2 Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms
06/16/1999EP0922379A1 Apparatus for cooling an electronic component
06/16/1999EP0922301A1 Substrate with conductor formed of low-resistance aluminum alloy
06/16/1999EP0922300A1 Semiconductor device provided with low melting point metal bumps and process for producing same
06/16/1999EP0922299A1 Post mounted heat sink method and apparatus
06/16/1999EP0922192A1 Spray-cooling an electronic component
06/16/1999EP0886894A4 Contact carriers (tiles) for populating larger substrates with spring contacts
06/16/1999CN2324637Y Radiator structure
06/16/1999CN2324636Y Element in chip fastener for supporting semi-conductor chip
06/16/1999CN1220057A Electronic component, in particular OFW component using acoustical surface acoustic waves
06/16/1999CN1220028A Semiconductor package and device socket
06/16/1999CN1219838A Attachment of electronic device packages to heat sinks
06/16/1999CN1219837A Built-in circuit device assembly and its manufacturing method
06/16/1999CN1219787A Socket for electronic part
06/16/1999CN1219773A Kilowatt power transistor
06/16/1999CN1219768A Method and apparatus for heat transfer enhancing attachment
06/16/1999CN1219767A Package for semiconductor power device and method for assembling the same
06/16/1999CN1219766A Semiconductor device and method of manufacturing the same
06/16/1999CN1219764A Process for forming inter-level insulating layer and vapor phase deposition system and therein
06/16/1999CN1219763A Semiconductor device having sub-chip-scale package structure and method for forming same
06/16/1999CN1219760A Apparatus and method for manufacturing semiconductor device
06/16/1999CN1219753A Semiconductor device and method for manufacturing the same
06/16/1999CN1219743A Multilayered electronic part with minimum silver diffusion and its manufacturing method
06/16/1999CN1219741A Electrode modification using unzippable polymer paste
06/16/1999CN1219672A Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms
06/16/1999CN1043702C Semiconductor device
06/16/1999CN1043689C Temp-compensating circuit of hall device
06/15/1999US5913147 Method for fabricating copper-aluminum metallization
06/15/1999US5913146 Semiconductor device having aluminum contacts or vias and method of manufacture therefor
06/15/1999US5913144 Oxidized diffusion barrier surface for the adherence of copper and method for same
06/15/1999US5913143 Method of making a multilayer interconnection of semiconductor device using plug
06/15/1999US5913141 Reliable interconnect via structures and methods for making the same
06/15/1999US5913138 Method of manufacturing an antifuse element having a controlled thickness
06/15/1999US5913137 Process ESD protection devices for use with antifuses
06/15/1999US5913136 Process for making a transistor with self-aligned source and drain contacts
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