Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/22/2013US8564113 Electrostatic chucking of an insulator handle substrate
10/22/2013US8564112 Semiconductor device
10/22/2013US8564111 Stacked digital/RF system-on-chip with integral isolation layer
10/22/2013US8564110 Power device with bottom source electrode
10/22/2013US8564109 Illumination apparatus
10/22/2013US8564108 Semiconductor device with heat spreader
10/22/2013US8564107 Lead frame and method for manufacturing the same
10/22/2013US8564106 Wafer level packaging
10/22/2013US8564104 Passivation layer structure of semiconductor device and method for forming the same
10/22/2013US8564102 Semiconductor device having through silicon via (TSV)
10/22/2013US8564100 Semiconductor device
10/22/2013US8564092 Power convertor device and construction methods
10/22/2013US8564090 Semiconductor device and method of manufacturing semiconductor device
10/22/2013US8564089 Electronic fuse structure formed using a metal gate electrode material stack configuration
10/22/2013US8564088 Semiconductor device having variably laterally doped zone with decreasing concentration formed in an edge region
10/22/2013US8564077 Package for electronic component, manufacturing method thereof and sensing apparatus
10/22/2013US8564065 Circuit architecture for metal oxide semiconductor (MOS) output driver electrical overstress self-protection
10/22/2013US8564061 Semiconductor device
10/22/2013US8564023 Integrated circuit with MOSFET fuse element
10/22/2013US8563957 Photoconductive switch package
10/22/2013US8563869 Circuit board and semiconductor module using this, production method for circuit board
10/22/2013US8563404 Process for dividing wafer into individual chips and semiconductor chips
10/22/2013US8563393 Method for manufacturing semiconductor device
10/22/2013US8563365 Air-gap C4 fluidic I/O interconnects and methods of fabricating same
10/22/2013US8563358 Method of producing a chip package, and chip package
10/22/2013CA2430888C Nanosensors
10/17/2013WO2013155470A1 Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features
10/17/2013WO2013155256A1 Wiring substrate with filled vias to accommodate custom terminals
10/17/2013WO2013154718A1 Compositions comprising resin- linear organosiloxane block copolymers and organopolysiloxanes
10/17/2013WO2013154531A1 Optical device having an alignment mechanism
10/17/2013WO2013154497A2 Cte matched interposer and method of making
10/17/2013WO2013153937A1 Semiconductor diode device
10/17/2013WO2013153920A1 Semiconductor device
10/17/2013WO2013153914A1 Cooling structure, vortex-flow forming plate molding apparatus, and method of molding vortex-flow generating unit
10/17/2013WO2013153742A1 Semiconductor device
10/17/2013WO2013153717A1 Electronic apparatus and method for manufacturing same
10/17/2013WO2013153667A1 Heat dissipation structure
10/17/2013WO2013153018A1 Device for producing synthetic fibres
10/17/2013WO2013152760A1 Laser protection device in the shape of a flexible curtain-type element for detecting laser radiation
10/17/2013WO2013152759A1 Laser protection device for shielding from laser radiation, having a sensor layer arrangement of two electrically conductive layers
10/17/2013WO2013152623A1 Heat dissipating coating, sheets and methods for manufacturing same
10/17/2013WO2013052321A3 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
10/17/2013WO2013024129A3 Arrangement with sensor or actuator and modules
10/17/2013US20130273731 Fan-out chip scale package
10/17/2013US20130273730 Method to realize flux free indium bumping
10/17/2013US20130273672 Semiconductor substrate for an optical transmitter apparatus and method
10/17/2013US20130272049 Stacked memory with interface providing offset interconnects
10/17/2013US20130271917 Liquid-cooled arrangement having modular power semiconductor modules and at least one capacitor device, and power semiconductor module therefor
10/17/2013US20130271211 Multi-layered semiconductor apparatus
10/17/2013US20130270721 Enhanced package thermal management using external and internal capacitive thermal material
10/17/2013US20130270720 Semiconductor device and method for manufacturing the same
10/17/2013US20130270719 Microelectronic package and stacked microelectronic assembly and computing system containing same
10/17/2013US20130270717 Semiconductor package and method of fabricating the same
10/17/2013US20130270716 Semiconductor device and method of manufacturing the same
10/17/2013US20130270715 Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (bbul) packages
10/17/2013US20130270714 Contact structure and manufacturing method thereof
10/17/2013US20130270713 Dual damascene structure having through silicon via and manufacturing method thereof
10/17/2013US20130270712 Through silicon via structure and method of fabricating the same
10/17/2013US20130270711 Apparatus and method for integration of through substrate vias
10/17/2013US20130270710 Guard ring design structure for semiconductor devices
10/17/2013US20130270709 Non-bridging contact via structures in proximity
10/17/2013US20130270708 Method for forming buried conductive line and structure of buried conductive line
10/17/2013US20130270707 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
10/17/2013US20130270706 Semiconductor device
10/17/2013US20130270705 Semiconductor Device Packages and Methods
10/17/2013US20130270704 Semiconductor Device with Self-Aligned Interconnects
10/17/2013US20130270703 Electroless filled conductive structures
10/17/2013US20130270702 Copper interconnect structure and method for forming the same
10/17/2013US20130270701 System and methods for wire bonding
10/17/2013US20130270700 Package on package structures and methods for forming the same
10/17/2013US20130270699 Conical-Shaped or Tier-Shaped Pillar Connections
10/17/2013US20130270698 Strain reduced structure for ic packaging
10/17/2013US20130270697 Device with pillar-shaped components
10/17/2013US20130270696 Semiconductor memory modules and methods of fabricating the same
10/17/2013US20130270695 Second Level Interconnect Structures and Methods of Making the Same
10/17/2013US20130270694 Substrates having bumps with holes, semiconductor chips having bumps with holes, semiconductor packages formed using the same, and methods of fabricating the same
10/17/2013US20130270693 Trace Layout Method in Bump-on-Trace Structures
10/17/2013US20130270692 Method for Creating Semiconductor Junctions with Reduced Contact Resistance
10/17/2013US20130270691 Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package
10/17/2013US20130270690 Methods for Forming Silicon-Based Hermetic Thermal Solutions
10/17/2013US20130270689 Semiconductor package, semiconductor module, and mounting structure thereof
10/17/2013US20130270688 Power module
10/17/2013US20130270687 Double side cooling power semiconductor module and multi-stacked power semiconductor module package using the same
10/17/2013US20130270686 Methods and apparatus for heat spreader on silicon
10/17/2013US20130270685 Package-on-package electronic devices including sealing layers and related methods of forming the same
10/17/2013US20130270684 Power module and lead frame for power module
10/17/2013US20130270683 Semiconductor packages with heat dissipation structures and related methods
10/17/2013US20130270675 On-chip capacitors and methods of assembling same
10/17/2013US20130270670 Semiconductor package with through silicon via interconnect
10/17/2013US20130270600 Functionalization of a Substrate
10/17/2013US20130270591 Polycarbonate compositions containing converions material chemistry and having enhanced optical properties, methods of making and articles comprising the same
10/17/2013US20130270588 Lead frame assembly, led package and led light bar
10/17/2013US20130270578 Semiconductor device with heat removal structure and related production method
10/17/2013US20130270562 Semiconductor device and manufacturing method thereof
10/17/2013US20130270558 Semiconductor test and monitoring structure to detect boundaries of safe effective modulus
10/17/2013US20130270557 Test structure for semiconductor process and method for monitoring semiconductor process
10/17/2013US20130270427 Photoelectric device package and detachable package structure
10/17/2013DE112004000219B4 Fluidausstoßvorrichtung The fluid ejection device
10/17/2013DE102013103301A1 Electronic package-on-package device for manufacturing semiconductor assembly utilized for manufacturing electronic components, has seal layers arranged between substrates, and solder connection for providing coupling between substrates
10/17/2013DE102012224355A1 Leistungsmodul Power module
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