| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/30/1999 | EP0926726A1 Fabrication process and electronic device having front-back through contacts for bonding onto boards |
| 06/30/1999 | EP0926723A1 Process for forming front-back through contacts in micro-integrated electronic devices |
| 06/30/1999 | EP0926721A2 Dual damascene with bond pads |
| 06/30/1999 | EP0926720A2 Tape carrier manufacture |
| 06/30/1999 | EP0926348A2 Fan cover |
| 06/30/1999 | EP0926196A1 Epoxy resin compositions for encapsulating semiconductors, and semiconductor devices |
| 06/30/1999 | EP0925861A2 Nickel ultrafine powder |
| 06/30/1999 | EP0925860A2 Nickel ultrafine powder |
| 06/30/1999 | EP0925509A1 Probe structure having a plurality of discrete insulated probe tips |
| 06/30/1999 | CN2327112Y Rectifier radiator of generator for vehicles |
| 06/30/1999 | CN2327070Y Soldering and sealing mould for Jingzhen 49 micron and Jingzhen 49s electronic device |
| 06/30/1999 | CN2327069Y Radiator for flatboard type power semiconductor device |
| 06/30/1999 | CN2327068Y Semiconductor chip radiating device |
| 06/30/1999 | CN1221551A Multi-layer circuit having via matrix interlayer connection and method for fabricating the same |
| 06/30/1999 | CN1221313A Method for manufacture a certain equipment containing a printed-circuit board |
| 06/30/1999 | CN1221310A Tape automated bonding film |
| 06/30/1999 | CN1221309A Terminal electrode for circuit substrate on which chip pachage mounted and method for manufacturing the same |
| 06/30/1999 | CN1221240A Combined resistor-capacitor elements for decoupling in electronic packages |
| 06/30/1999 | CN1221216A Lead frame and method of plating lead frame |
| 06/30/1999 | CN1221215A White-light electroluminescence device with organic multi-quantum pit structure |
| 06/30/1999 | CN1221213A Semiconductor integrated circuit and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 06/30/1999 | CN1221211A Improved gapfill of semiconductor structure using doped silicate glasses |
| 06/30/1999 | CN1221209A Method of implementing electron beam lithography using uniquely positioned alignment marks and wafer with such alignment marks |
| 06/29/1999 | US5918153 High density electronic circuit and process for making |
| 06/29/1999 | US5918150 Method for a chemical vapor deposition of copper on an ion prepared conductive surface |
| 06/29/1999 | US5918149 Fabricating a semiconductor structure on a wafer |
| 06/29/1999 | US5918148 Method for manufacturing semiconductor device |
| 06/29/1999 | US5918146 Method of manufacturing semiconductor device having multilayer wiring structure, with improved version of step of forming interlayer dielectric layer |
| 06/29/1999 | US5918145 Method of forming a microelectronic device incorporating low resistivity straps between regions |
| 06/29/1999 | US5918144 Method of manufacturing a semiconductor device |
| 06/29/1999 | US5918118 Dual deposition methods for forming contact metallizations, capacitors, and memory devices |
| 06/29/1999 | US5918113 Process for producing a semiconductor device using anisotropic conductive adhesive |
| 06/29/1999 | US5918112 Semiconductor component and method of fabrication |
| 06/29/1999 | US5917707 Flexible contact structure with an electrically conductive shell |
| 06/29/1999 | US5917706 Chip card micromodule as a surface-mount device |
| 06/29/1999 | US5917704 Laser-solderable electronic component |
| 06/29/1999 | US5917703 Integrated circuit intercoupling component with heat sink |
| 06/29/1999 | US5917702 Corner heat sink which encloses an integrated circuit of a ball grid array integrated circuit package |
| 06/29/1999 | US5917701 Heat sink hold-down clip |
| 06/29/1999 | US5917700 Heat sink and attachment process for electronic components |
| 06/29/1999 | US5917604 Alignment device and lithographic apparatus provided with such a device |
| 06/29/1999 | US5917388 Compact microwave module |
| 06/29/1999 | US5917336 Circuit for electrostatic discharge (ESD) protection |
| 06/29/1999 | US5917246 Semiconductor package with pocket for sealing material |
| 06/29/1999 | US5917245 Semiconductor device with brazing mount |
| 06/29/1999 | US5917242 Combination of semiconductor interconnect |
| 06/29/1999 | US5917241 High frequency semiconductor device having source, drain, and gate leads |
| 06/29/1999 | US5917240 Semiconductor device socket |
| 06/29/1999 | US5917239 Recessed or raised characters on a ceramic lid |
| 06/29/1999 | US5917237 Semiconductor integrated circuit device and lead frame therefor |
| 06/29/1999 | US5917236 For semiconductor components |
| 06/29/1999 | US5917235 Semiconductor device having LOC structure, a semiconductor device lead frame, TAB leads, and an insulating TAB tape |
| 06/29/1999 | US5917234 Semiconductor device |
| 06/29/1999 | US5917233 Integrated circuit having a parasitic resonance filter |
| 06/29/1999 | US5917231 Semiconductor device including an insulative layer having a gap |
| 06/29/1999 | US5917230 Filter capacitor construction |
| 06/29/1999 | US5917229 Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect |
| 06/29/1999 | US5917209 Semiconductor device including via hole and isolating circumferential member |
| 06/29/1999 | US5917205 Photolithographic alignment marks based on circuit pattern feature |
| 06/29/1999 | US5917198 Gate electrodes and matrix lines made of W/Ta alloy for LCD apparatus |
| 06/29/1999 | US5917197 On a semiconductor wafer |
| 06/29/1999 | US5916944 Silica precursor resin and a filler diluted in a solvent, wherein the filler is one which reacts in an oxidizing atmosphere to liberate heat. |
| 06/29/1999 | US5916858 Washing the metal mask before, during and after completing the solder printing with a liquid cleaning compound containing fluorine based surfactant and isopropyl alcohol |
| 06/29/1999 | US5916696 Crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 mu.m to about 300 mu.m. |
| 06/29/1999 | US5916688 Siloxanepolyimidepolyamic acid copolymers; chemical resistance |
| 06/29/1999 | US5916683 Copper-clad laminate with prepreg of epoxy resin and aryl ester |
| 06/29/1999 | US5916451 Minimal capture pads applied to ceramic vias in ceramic substrates |
| 06/29/1999 | US5916259 Coaxial waveguide applicator for an electromagnetic wave-activated sorption system |
| 06/29/1999 | US5915756 Method to fill via holes between two conductive layers |
| 06/29/1999 | US5915755 Method for forming an interconnect for testing unpackaged semiconductor dice |
| 06/29/1999 | US5915754 Method of mounting an electronic power component |
| 06/29/1999 | US5915753 Method of producing a high-density printed wiring board for mounting |
| 06/29/1999 | US5915752 Method of making connections to a semiconductor chip assembly |
| 06/29/1999 | US5915463 Semiconductor module |
| 06/29/1999 | CA2092371C Integrated circuit packaging |
| 06/29/1999 | CA2004436C Test chip for use in semiconductor fault analysis |
| 06/25/1999 | CA2257042A1 Nickel ultrafine powder |
| 06/24/1999 | WO1999031789A1 Miniature power supply |
| 06/24/1999 | WO1999031733A1 Silicon oxynitride spacer for preventing over-etching during local interconnect formation |
| 06/24/1999 | WO1999031731A2 Silicon oxide insulator (soi) semiconductor having selectively linked body |
| 06/24/1999 | WO1999031725A1 High integrity borderless vias with hsq gap filled patterned conductive layers |
| 06/24/1999 | WO1999031722A1 Barrier layer for copper metallizing |
| 06/24/1999 | WO1999030866A1 Pb-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE |
| 06/24/1999 | WO1999021402A9 Heat sink mounting assembly for surface mount electronic device packages |
| 06/24/1999 | WO1999018030A9 Diamond-based composites with high thermal conductivity |
| 06/24/1999 | DE19847440A1 IC has a local, buried, thick insulation layer region for reducing parasitic capacitance effects |
| 06/24/1999 | DE19831349A1 Semiconductor component with top line or wiring |
| 06/24/1999 | DE19756620A1 Preparation of absorber material |
| 06/24/1999 | DE19755155A1 Electronic module for simple circuits of electronic components |
| 06/24/1999 | DE19754874A1 Converting substrate with edge contacts into ball grid array |
| 06/24/1999 | CA2310251A1 Miniature power supply |
| 06/23/1999 | EP0924764A2 Pinned circuit board with a plurality of semiconductor devices |
| 06/23/1999 | EP0924762A2 Interconnections in integrated circuit devices |
| 06/23/1999 | EP0924761A1 Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same |
| 06/23/1999 | EP0924760A2 Address transition detection circuit |
| 06/23/1999 | EP0924757A2 Fabrication of high power semiconductor device with a heat sink and integration with planar microstrip circuitry |
| 06/23/1999 | EP0924756A2 Method of encapsulating a wire bonded die |
| 06/23/1999 | CN2325870Y Crossflow electric fan cooling means for semiconductor device |
| 06/23/1999 | CN1220778A Conductors for integrated circuits |
| 06/23/1999 | CN1220777A Semiconductor device and method of manufacturing same |