| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/08/1999 | WO1999034028A1 SPUTTERING TARGET, Al INTERCONNECTION FILM, AND ELECTRONIC COMPONENT |
| 07/08/1999 | WO1999017361A3 Intermediate carrier substrate with high wiring density for electronic components |
| 07/08/1999 | WO1999008325A8 Electrode means, with or without functional elements and an electrode device formed of said means |
| 07/08/1999 | DE19836163A1 Semiconductor device metal line exhibits high heat dissipation and low electromigration |
| 07/08/1999 | DE19835840A1 Structure of semiconductor wafer with several semiconductor chips |
| 07/08/1999 | DE19833955A1 Integrated semiconductor circuit, e.g. a DRAM, exhibits reduced leakage current |
| 07/08/1999 | DE19806817C1 EMC optimised power switch especially MOS power transistor |
| 07/08/1999 | DE19757612C1 Hybridschaltung mit einem System zur Wärmeableitung Hybrid circuit with a system for heat dissipation |
| 07/07/1999 | EP0928029A2 Multi-layer circuit board layout |
| 07/07/1999 | EP0928028A2 Semiconductor device comprising a wiring substrate |
| 07/07/1999 | EP0928027A2 Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same |
| 07/07/1999 | EP0928026A1 Plastic Moulded Package for a Semiconductor Device |
| 07/07/1999 | EP0928025A2 Wiring board and process for the production thereof |
| 07/07/1999 | EP0928024A2 Improvements in or relating to interconnect conducting paths |
| 07/07/1999 | EP0928022A2 Resin package fabrication process |
| 07/07/1999 | EP0928021A1 Process for manufacturing semiconductor device |
| 07/07/1999 | EP0928016A1 Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and ic card |
| 07/07/1999 | EP0928015A2 Method of preventing boron penetration |
| 07/07/1999 | EP0882207A4 Active heat sink structure with flow augmenting rings and method for removing heat |
| 07/07/1999 | EP0862789A4 Semiconductor package with ground or power ring |
| 07/07/1999 | EP0707743B1 Lead frame including an inductor or other such magnetic component |
| 07/07/1999 | CN2328099Y Direct welded flat plastic sealed diode |
| 07/07/1999 | CN1222253A Carrier element for semiconductor chips |
| 07/07/1999 | CN1221982A Semiconductor device and its mfg. method |
| 07/06/1999 | US5920794 Electromigration resistant metallization process microcircuit interconnections with RF-reactively sputtered titanium tungsten and gold |
| 07/06/1999 | US5920793 Method for manufacturing a through hole |
| 07/06/1999 | US5920790 Method of forming a semiconductor device having dual inlaid structure |
| 07/06/1999 | US5920789 Technique for producing interconnecting conductive links |
| 07/06/1999 | US5920771 Method of making antifuse based on silicided single polysilicon bipolar transistor |
| 07/06/1999 | US5920770 Resin seal semiconductor package and manufacturing method of the same |
| 07/06/1999 | US5920768 Manufacturing method for a resin sealed semiconductor device |
| 07/06/1999 | US5920765 IC wafer-probe testable flip-chip architecture |
| 07/06/1999 | US5920481 IC package processing and measuring method and system therefor |
| 07/06/1999 | US5920464 Reworkable microelectronic multi-chip module |
| 07/06/1999 | US5920458 Mounted to a printed circuit board |
| 07/06/1999 | US5920457 Apparatus for cooling electronic devices using a flexible coolant conduit |
| 07/06/1999 | US5920264 Computer system protection device |
| 07/06/1999 | US5920124 Semiconductor device having misalignment resistive interconnect layers |
| 07/06/1999 | US5920123 Multichip module assembly having via contacts and method of making the same |
| 07/06/1999 | US5920122 Contact structure using barrier metal and method of manufacturing the same |
| 07/06/1999 | US5920121 Methods and structures for gold interconnections in integrated circuits |
| 07/06/1999 | US5920120 Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved |
| 07/06/1999 | US5920118 Chip-size package semiconductor |
| 07/06/1999 | US5920117 Semiconductor device and method of forming the device |
| 07/06/1999 | US5920116 Rigidized lead frame for a semiconductor device |
| 07/06/1999 | US5920115 Semiconductor device and display unit using the semiconductor device and notebook-size personal computer |
| 07/06/1999 | US5920114 Leadframe having resilient carrier positioning means |
| 07/06/1999 | US5920113 Leadframe structure having moveable sub-frame |
| 07/06/1999 | US5920112 Circuit including a corral for containing a protective coating, and method of making same |
| 07/06/1999 | US5920110 Antifuse device for use on a field programmable interconnect chip |
| 07/06/1999 | US5920109 Raised tungsten plug antifuse and fabrication processes |
| 07/06/1999 | US5920095 Short channel field effect semiconductor device and method of making |
| 07/06/1999 | US5920081 Structure of a bond pad to prevent testing probe pin contamination |
| 07/06/1999 | US5919868 Acrylate monomeric units and a photoabsorber bound to the monomeric units which is: 1-(dimethylamino)-pyrene, 4-(12-hydroxyethyl)ethylamino)-4-(trifluoromethylsulfonyl)tola ne, or 7-hydroxy-4-methyl-2h-1-benzopyrene-2-one. |
| 07/06/1999 | US5919857 Styrenic copolymer with unsaturated acid comonomer, compound reactive with the carboxyl groups |
| 07/06/1999 | US5919844 Epoxy resin composition |
| 07/06/1999 | US5919843 Epoxy resin moulding compounds having halogen-free flame retardation |
| 07/06/1999 | US5919713 Semiconductor device and method of making |
| 07/06/1999 | US5919546 Porous ceramic impregnated wiring body |
| 07/06/1999 | US5919538 Method of manufacturing TAB tapes and laminated body for producing the same |
| 07/06/1999 | US5919525 Technique for forming resin-impregnated fiberglass sheets using multiple resins |
| 07/06/1999 | US5919329 Method for assembling an integrated circuit chip package having at least one semiconductor device |
| 07/06/1999 | US5919325 Process for producing a ceramic multilayer substrate |
| 07/06/1999 | US5918796 Method of fabricating package for housing semiconductor element |
| 07/06/1999 | US5918794 Solder bonding of dense arrays of microminiature contact pads |
| 07/06/1999 | US5918746 Carrier frame used for circuit boards |
| 07/06/1999 | US5918665 Method of thermal coupling an electronic device to a heat exchange member while said electronic device is being tested |
| 07/06/1999 | US5918364 Method of forming electrically conductive polymer interconnects on electrical substrates |
| 07/06/1999 | US5918363 Method for marking functional integrated circuit chips with underfill material |
| 07/01/1999 | WO1999033327A1 Method and arrangement relating to a grounding area on a circuit board |
| 07/01/1999 | WO1999033114A2 Semiconductor substrate with embedded isolating layer for integrated circuits |
| 07/01/1999 | WO1999033111A2 Thin-film component comprising a substrate with an elastic coating |
| 07/01/1999 | WO1999033110A1 A tailored barrier layer which provides improved copper interconnect electromigration resistance |
| 07/01/1999 | WO1999033109A1 Bga connector with heat activated connection and disconnection means |
| 07/01/1999 | WO1999033108A1 Wireless inter-chip communication system and method |
| 07/01/1999 | WO1999033107A1 Semiconductor wafer with integrated individual components, method and device for the production of said semiconductor wafer |
| 07/01/1999 | WO1999033106A1 Plastic composite body |
| 07/01/1999 | WO1999033098A1 Semiconductor processing method comprising the fabrication of a barrier layer |
| 07/01/1999 | WO1999032936A1 Photoimageable compositions and films for printed wiring board manufacture |
| 07/01/1999 | WO1999032688A1 Metal surface coating, especially for micro electronics |
| 07/01/1999 | WO1999032553A1 Epoxy mold compound and method |
| 07/01/1999 | WO1999032538A1 Process for producing an absorber material |
| 07/01/1999 | WO1999032304A1 Semiconductor device |
| 07/01/1999 | WO1999032208A1 Method for sealing and/or joining an end of a ceramic filter |
| 07/01/1999 | WO1999026460A8 Cooling system for semiconductor die carrier |
| 07/01/1999 | WO1999021274A3 Integrated electronic circuit comprising an oscillator with passive circuit elements |
| 07/01/1999 | DE19835898A1 Semiconductor component with stacked coupling contact(s) |
| 07/01/1999 | DE19757597A1 Multichipmodul mit geringer Bauhöhe Multi-chip module, low profile |
| 07/01/1999 | DE19757513A1 Diode for rectifiers in welding, current supply apparatus, etc. |
| 07/01/1999 | DE19757302A1 Beschichtung von Metalloberflächen insbesondere für die Mikroelektronik Coating of metal surfaces, in particular to the microelectronics |
| 07/01/1999 | DE19756887A1 Kunststoffverbundkörper Plastic composite |
| 07/01/1999 | DE19756325A1 Halbleiterscheibe mit integrierten Einzelbauelementen, Verfahren und Vorrichtung zur Herstellung einer Halbleiterscheibe Semiconductor wafer with integrated individual components, method and apparatus for manufacturing a semiconductor wafer |
| 06/30/1999 | EP0926931A1 Wiring board having vias |
| 06/30/1999 | EP0926736A2 Semiconductor integrated circuit having thereon on-chip capacitors |
| 06/30/1999 | EP0926735A2 Tin-nickel alloy and component surface-treated with alloy |
| 06/30/1999 | EP0926734A2 Method and apparatus for delivering electrical power to a semiconducteur die |
| 06/30/1999 | EP0926733A1 Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink |
| 06/30/1999 | EP0926731A1 Process for the final passivation of intergrated circuits |
| 06/30/1999 | EP0926730A2 Ball grid array package and method of construction thereof |
| 06/30/1999 | EP0926729A2 Semiconductor plastic package and process for the production thereof |