Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/1999
07/20/1999US5925901 Field effect transistor with plated heat sink on a fet chip
07/20/1999US5925443 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
07/20/1999US5925225 Method of producing smooth titanium nitride films having low resistivity
07/20/1999US5924874 IC socket
07/20/1999US5924482 For electronic components
07/20/1999US5924481 Cooling device for electronic component
07/20/1999US5924290 Optoelectronic element module
07/20/1999US5924191 Forming metal layer, attaching to ceramic surface, forming slit in ceramic layer down to metal layer, bending metal layer near split to form contactors which attach to other ceramic layers
07/20/1999US5924190 Methods and apparatus for manufacturing encapsulated integrated circuits
07/20/1999CA2130225C Interconnection structure for crosstalk reduction to improve off-chip selectivity
07/19/1999CA2259703A1 Electronic power component and manufacturing process
07/15/1999WO1999035691A1 An integrated circuit (ic) package including accompanying ic chip and coil and a method of production therefor
07/15/1999WO1999035689A1 Semiconductor package converter module
07/15/1999WO1999035688A1 Gettering device for ion capture
07/15/1999WO1999035687A1 Low-inductance, gate-controlled thyristor
07/15/1999WO1999035683A1 Semiconductor device, manufacture thereof, and electronic device
07/15/1999WO1999035682A1 Semiconductor device, manufacture thereof, and electronic device
07/15/1999WO1999035681A1 Assembly for and method of packaging integrated display devices
07/15/1999WO1999035611A1 Support element for a semiconductor chip
07/15/1999WO1999035477A1 Micromechanical component
07/15/1999WO1999034970A1 Ceramic composites with improved interfacial properties and methods to make such composites
07/15/1999WO1999025165A3 Modular and multifunctional structure
07/15/1999WO1999017317A8 Microelectronic component carrier and method of its manufacture
07/15/1999DE19900364A1 Integrated circuit device made from wafer
07/15/1999DE19900313A1 Semiconductor device, e.g. insulated gate bipolar transistor device
07/15/1999DE19836614A1 Semiconductor chip having corner connector pads for quality control
07/15/1999DE19800574A1 Mikromechanisches Bauelement Micromechanical component
07/15/1999DE19800469A1 Niederinduktiv angesteuerter, gategesteuerter Thyristor Low inductance is overdriven, gate-controlled thyristor
07/15/1999DE19753148A1 Metal-ceramic substrate for electrical circuit
07/15/1999CA2317537A1 Gettering device for ion capture
07/14/1999EP0929207A2 Multi-layer ceramic substrate and method for producing the same
07/14/1999EP0929097A2 Semiconductor device assembly method and semiconductor device produced by the method
07/14/1999EP0928825A2 Resin composition for use in sealant and liquid sealant using the resin composition
07/14/1999EP0928486A1 Device and method for testing integrated circuit dice in an integrated circuit module
07/14/1999CN1223014A Substrate with conductor formed of low-resistance aluminum alloy
07/14/1999CN1222789A Solid-state relay
07/14/1999CN1222763A Semiconductor device equipped with antifuse elements and method for manufacturing FPGA
07/14/1999CN1222762A Ball grid array type semiconductor apparatus
07/14/1999CN1222761A Moldless semiconductor device and photovoltaic device module making use of same
07/14/1999CN1222758A Semiconductor device assembly method and semiconductor device produced by the method
07/14/1999CN1222686A Flexible printed board
07/13/1999US5924058 Permanently mounted reference sample for a substrate measurement tool
07/13/1999US5924008 Integrated circuit having local interconnect for reducing signal cross coupled noise
07/13/1999US5924006 Trench surrounded metal pattern
07/13/1999US5924003 Method of manufacturing ball grid arrays for improved testability
07/13/1999US5923996 Method to protect alignment mark in CMP process
07/13/1999US5923964 Hydrogenation; coating with silicon nitride, then silicon dioxide
07/13/1999US5923960 Method of making a custom laser conductor linkage for the integrated circuits
07/13/1999US5923958 Method for semiconductor chip packaging
07/13/1999US5923957 Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive
07/13/1999US5923955 Bonding pads with a pitch less than 15 microns on an integrated circuit; using a negative photoimagable polyimide
07/13/1999US5923954 Ball grid array package and fabrication method therefor
07/13/1999US5923952 Method of making a semiconductor device
07/13/1999US5923951 Method of making a flip-chip bonded GaAs-based opto-electronic device
07/13/1999US5923945 Method of preparing coated nitride powder and the coated powder produced thereby
07/13/1999US5923796 Microelectronic module having optical and electrical interconnects
07/13/1999US5923584 Dual poly integrated circuit interconnect
07/13/1999US5923540 Semiconductor unit having semiconductor device and multilayer substrate, in which grounding conductors surround conductors used for signal and power
07/13/1999US5923539 Multilayer circuit substrate with circuit repairing function, and electronic circuit device
07/13/1999US5923538 Support member for mounting a microelectronic circuit package
07/13/1999US5923535 Electronic device assembly
07/13/1999US5923533 Multiple tile scaleable cooling system for semiconductor components
07/13/1999US5923530 Electronic apparatus incorporating a circuit module having a heat sink
07/13/1999US5923393 Liquid crystal display
07/13/1999US5923234 Hermetic feedthrough using three-via transmission lines
07/13/1999US5923092 Wiring between semiconductor integrated circuit chip electrode pads and a surrounding lead frame
07/13/1999US5923090 Microelectronic package and fabrication thereof
07/13/1999US5923089 Efficient routing method and resulting structure for integrated circuits
07/13/1999US5923088 Bond pad structure for the via plug process
07/13/1999US5923087 Semiconductor device comprising bonding pad of barrier metal, silicide and aluminum
07/13/1999US5923086 Apparatus for cooling a semiconductor die
07/13/1999US5923085 Power transistor assembly
07/13/1999US5923084 Semiconductor device for heat discharge
07/13/1999US5923083 Packaging technology for Schottky die
07/13/1999US5923081 Compression layer on the leadframe to reduce stress defects
07/13/1999US5923080 Semiconductor apparatus having a leadframe with coated leads
07/13/1999US5923076 Integrated device with pads
07/13/1999US5923074 Low capacitance interconnect structure for integrated circuits using decomposed polymers
07/13/1999US5923048 Semiconductor integrated circuit device with test element
07/13/1999US5923047 Semiconductor die having sacrificial bond pads for die test
07/13/1999US5922245 A mixture comprising an electrically conductive metal powder and a calcined material capable of forming a crystal phase during sintering, a calcined material of kaolin and an alkaline metal or alkaline earth metal carbonate
07/13/1999US5922167 Bending integrated circuit chips
07/13/1999US5921461 Vacuum package having vacuum-deposited local getter and its preparation
07/13/1999US5921087 Method and apparatus for cooling integrated circuits using a thermoelectric module
07/13/1999CA2147318C Tape carrier for increasing the number of terminals between the tape carrier and a substrate
07/13/1999CA2098330C Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
07/08/1999WO1999034657A2 Hybrid circuit with a heat dissipation system
07/08/1999WO1999034656A1 Molded electronic package, method of preparation and method of shielding
07/08/1999WO1999034445A1 Semiconductor integrated circuit
07/08/1999WO1999034444A1 Semiconductor device and method for manufacturing the same
07/08/1999WO1999034443A1 Ceramic microelectronics package with co-planar waveguide feed-through
07/08/1999WO1999034442A1 A novel passivation structure and its method of fabrication
07/08/1999WO1999034441A1 Multichip module with small overall height
07/08/1999WO1999034440A1 Planar guard ring
07/08/1999WO1999034439A1 Energy-absorbing stable guard ring
07/08/1999WO1999034438A1 Heat sink
07/08/1999WO1999034436A1 Semiconductor device
07/08/1999WO1999034435A1 Circuit board, manufacture thereof, and electronic device using circuit board
07/08/1999WO1999034423A1 Wafer passivation structure and method of fabrication
07/08/1999WO1999034415A1 A single step electroplating process for interconnect via fill and metal line patterning
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