Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/1999
07/27/1999US5929526 Removal of metal cusp for improved contact fill
07/27/1999US5929524 Semiconductor device having ring-shaped conductive spacer which connects wiring layers
07/27/1999US5929523 Os rectifying Schottky and ohmic junction and W/WC/TiC ohmic contacts on SiC
07/27/1999US5929522 Semiconductor non-laminate package and method
07/27/1999US5929521 Projected contact structure for bumped semiconductor device and resulting articles and assemblies
07/27/1999US5929519 Semiconductor module including switching device chips and diode chips
07/27/1999US5929518 Circuit board and method
07/27/1999US5929517 Compliant integrated circuit package and method of fabricating the same
07/27/1999US5929516 Polymer stud grid array
07/27/1999US5929515 Gettering enclosure for a semiconductor device
07/27/1999US5929514 Thermally enhanced lead-under-paddle I.C. leadframe
07/27/1999US5929513 Semiconductor device and heat sink used therein
07/27/1999US5929512 Flexibilized urethane polymer of an aliphatic isocyanate reagent, an isocyanate-reactive terminated flexibilizing polymer reagent, and a diamine reagent.
07/27/1999US5929511 Cu, ni, pd, and au layers
07/27/1999US5929510 Integrated electronic circuit
07/27/1999US5929509 Wafer edge seal ring structure
07/27/1999US5929505 Inter-metal-wiring antifuse device provided by self-alignment
07/27/1999US5929498 Semiconductor device
07/27/1999US5929469 Contact holes of a different pitch in an application specific integrated circuit
07/27/1999US5929468 Compound semiconductor device
07/27/1999US5928970 Dustfree prepreg and method for making an article based thereon
07/27/1999US5928791 Low dielectric constant material with improved dielectric strength
07/27/1999US5928769 Aluminum nitride wiring substrate and method for production thereof
07/27/1999US5928768 Silicon nitride circuit board
07/27/1999US5928598 Acoustic wave frequency selection components.
07/27/1999US5928568 Limiting leaching and diffusion during high temperature operation, limiting formation of an intermetallic region
07/27/1999US5928547 Way to interface metal electrodes with a current limiting polymer composition such that a low contact resistance results, plasma etching, circuit breakers
07/27/1999US5928458 Flip chip bonding with non conductive adhesive
07/27/1999US5928440 Method of forming solder film
07/27/1999US5928428 Apparatus and method for manufacturing a semiconductor device
07/27/1999US5927992 Method of forming a dielectric in an integrated circuit
07/27/1999US5927505 Overmolded package body on a substrate
07/27/1999US5927385 Cooling device for the CPU of computer
07/27/1999US5926951 Method of stacking electronic components
07/27/1999CA2254852A1 Electronic apparatus
07/27/1999CA2109462C Method of forming solder film
07/26/1999CA2258438A1 Electronic circuit package with diamond film heat conductor
07/22/1999WO1999036958A1 Semiconductor device and method of production thereof and semiconductor mounting structure and method
07/22/1999WO1999036957A1 Semiconductor package
07/22/1999WO1999036954A1 Semiconductor device and method of manufacturing the same
07/22/1999WO1999036484A1 Curable epoxy-based compositions
07/22/1999WO1999036454A1 Modified polyimide resin and thermosetting resin composition containing the same
07/22/1999WO1999030275A3 Authenticity attribute
07/22/1999DE19902125A1 Thick film circuit board useful as an IC substrate installed in an automobile engine compartment
07/22/1999DE19842800A1 Surface mountable casing for high frequency integrated circuits
07/22/1999DE19802161A1 Stacked vias manufacturing method for microelectronic component with several wiring planes
07/22/1999DE19800646A1 Trägerelement für einen Halbleiterchip A member for a semiconductor chip
07/22/1999DE19758197A1 Semiconductor memory chip stacking arrangement for large memory capacity computer application
07/22/1999CA2318167A1 Curable epoxy-based compositions
07/22/1999CA2259846A1 Press contact type semiconductor device, and converter using same
07/21/1999EP0930815A1 High-power electronic device, and method of manufacturing such device
07/21/1999EP0930814A2 Component mounting arrangement, clip and assembly
07/21/1999EP0930659A2 A package for an electrical device
07/21/1999EP0930653A1 High frequency semiconductor device
07/21/1999EP0930652A1 Portion of metallization of integrated circuit
07/21/1999EP0930650A1 Bi-phase or mono-phase heat exchanger for at least one electronic power device
07/21/1999EP0930649A2 Heatsink and fabrication method thereof
07/21/1999EP0930648A2 Package for semiconductors, and semiconductor module that employs the package
07/21/1999EP0930646A2 Lead-on-chip type semicoductor device having thin plate and method for manufacturing the same
07/21/1999EP0930644A1 Fabrication method of plastic-packaged semiconductor device
07/21/1999EP0930480A2 Heat exchanger
07/21/1999EP0930378A1 Method of processing of CVD diamond coatings
07/21/1999EP0930231A2 Improved heat conductive interface material
07/21/1999EP0929935A1 Coplanar waveguide amplifier
07/21/1999EP0929909A1 Method of manufacturing a semiconductor device, method of cleaning such a device, and cleaning agent for this purpose
07/21/1999EP0929592A1 Thermosetting resin compositions useful as underfill sealants
07/21/1999EP0582605B1 Stabilization of the interface between aluminum and titanium nitride
07/21/1999CN1223541A Printed circuit boards for mounting semiconductor integrated circuit die
07/21/1999CN1223473A Resistance element having flexing portion and its manufacturing method
07/21/1999CN1044294C Semiconductor memory equipment
07/20/1999US5926738 Interconnects using metal spacers and method for forming same
07/20/1999US5926733 Metal layer patterns of a semiconductor device and a method for forming the same
07/20/1999US5926732 Method of making a semiconductor device
07/20/1999US5926731 Method for controlling solder bump shape and stand-off height
07/20/1999US5926720 Consistent alignment mark profiles on semiconductor wafers using PVD shadowing
07/20/1999US5926697 Method of forming a moisture guard ring for integrated circuit applications
07/20/1999US5926696 Ball grid array plastic package
07/20/1999US5926695 Lead frame incorporating material flow diverters
07/20/1999US5926694 Semiconductor device and a manufacturing method thereof
07/20/1999US5926691 Removing moisture by annealing, forming shield film to reduce reintroduction of moisture
07/20/1999US5926380 Lead frame lattice and integrated package fabrication method applied thereto
07/20/1999US5926371 Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device
07/20/1999US5926370 Method and apparatus for a modular integrated apparatus for multi-function components
07/20/1999US5926369 Vertically integrated multi-chip circuit package with heat-sink support
07/20/1999US5926359 Metal-insulator-metal capacitor
07/20/1999US5926358 Lead frame capacitor and capacitively-coupled isolator circuit using same
07/20/1999US5925937 Semiconductor wafer, wafer alignment patterns
07/20/1999US5925936 Semiconductor device for face down bonding to a mounting substrate and a method of manufacturing the same
07/20/1999US5925935 Semiconductor chip with shaped bonding pads
07/20/1999US5925934 Low cost and highly reliable chip-sized package
07/20/1999US5925933 Resists electromigration
07/20/1999US5925932 Borderless vias
07/20/1999US5925931 Semiconductor device having interconnect lines and connection electrodes formed in groove portions of an insulating layer
07/20/1999US5925930 IC contacts with palladium layer and flexible conductive epoxy bumps
07/20/1999US5925929 Cooling apparatus for electronic elements
07/20/1999US5925927 Reinforced thin lead frames and leads
07/20/1999US5925926 Semiconductor device including an inner lead reinforcing pattern
07/20/1999US5925925 Three-dimensional integrated circuit package having conductors at different fixed potentials
07/20/1999US5925921 Geometrical layout technique for a circular capacitor within an array of matched capacitors on a semiconductor device
07/20/1999US5925912 Semiconductor apparatus having a conductive sidewall structure
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