Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1999
08/04/1999EP0862790A4 Electronic control module having fluid-tight seals
08/04/1999EP0740852B1 Method of producing integrated circuit devices
08/04/1999CN1225232A Heat spreader system and method for cooling heat generating components
08/04/1999CN1224929A Electronic component and method of fixing leads thereof
08/03/1999US5933761 Dual damascene structure and its manufacturing method
08/03/1999US5933754 Semiconductor processing method of forming an electrically conductive contact plug
08/03/1999US5933752 Method and apparatus for forming solder bumps for a semiconductor device
08/03/1999US5933744 Alignment method for used in chemical mechanical polishing process
08/03/1999US5933743 Method of improving alignment signal strength by reducing refraction index at interface of materials in semiconductors
08/03/1999US5933725 Word line resistance reduction method and design for high density memory with relaxed metal pitch
08/03/1999US5933714 Double density fuse bank for the laser break-link programming of an integrated circuit
08/03/1999US5933713 Simplification, accuracy
08/03/1999US5933712 Joining edge-pad of each stacked chip to metal conductor line along a flexible plastic tape and joining end of conductor line to single pad on circuit board whereby joining is done with anisotropically conducting adhesive and without solder
08/03/1999US5933711 Fabrication method for chip size semiconductor package
08/03/1999US5933710 Method of providing electrical connection between an integrated circuit die and a printed circuit board
08/03/1999US5933709 Semiconductor package and method for fabricating same
08/03/1999US5933708 Bonding semiconductor chip to inner leads of a lead frame by pressing one side of polyimide film to leads and the other side to a partially cured polyimide coating on the active surface of chip, then fully curing polyimide layers together
08/03/1999US5933707 Crystal substrate processing
08/03/1999US5933704 Method for observing a section of a semiconductor wafer
08/03/1999US5933376 Semiconductor memory device with electrically programmable redundancy
08/03/1999US5933327 Wire bond attachment of a integrated circuit package to a heat sink
08/03/1999US5933326 Clipping device for heat sink
08/03/1999US5933325 Detachable fastening device for use with heat sink
08/03/1999US5933323 Electronic component lid that provides improved thermal dissipation
08/03/1999US5933020 Test structure
08/03/1999US5932929 Semiconductors
08/03/1999US5932928 Semiconductor circuit interconnections and methods of making such interconnections
08/03/1999US5932927 High-frequency device package
08/03/1999US5932926 Microwave semiconductor integrated circuit
08/03/1999US5932925 Adjustable-pressure mount heatsink system
08/03/1999US5932924 Leadframe having continuously reducing width and semiconductor device including such a leadframe
08/03/1999US5932923 Semiconductor device packages having dummy block leads and tie bars with extended portions to prevent formation of air traps in the encapsulate
08/03/1999US5932891 Semiconductor device with test terminal and IC socket
08/03/1999US5932688 Polybenzimidazole material with low metallic concentration and a process for production thereof
08/03/1999US5932668 Liquid organopolysiloxane resins, a process for their preparation, low viscosity polydiorganosiloxane compositions containing liquid organopolysiloxane resins and their use
08/03/1999US5932490 Integrated circuitry having a pair of adjacent conductive lines and method of forming
08/03/1999US5932348 Composite with non-segregating reinforcing elements
08/03/1999US5932345 Thermally fusible adhesive copolymer, articles made therefrom, and method for producing the same
08/03/1999US5932339 Anisotropically electricity conductive film comprising thermosetting adhesive agent and electrically conductive particles
08/03/1999US5932326 Ceramic wiring boards and method for their manufacture
08/03/1999US5930893 Thermally conductive material and method of using the same
08/03/1999US5930890 Structure and fabrication procedure for a stable post
07/1999
07/30/1999CA2260574A1 Ohmic contact and process for producing the same
07/29/1999WO1999038232A1 Small contactor for test probes, chip packaging and the like
07/29/1999WO1999038211A1 Microsystem and method for the production thereof
07/29/1999WO1999038210A1 Method for producing stacked vias
07/29/1999WO1999038204A1 Damascene interconnection and semiconductor device
07/29/1999WO1999038196A2 Electronic devices having thermodynamic encapsulant portions predominating over thermostatic encapsulant portions
07/29/1999WO1999016107A3 Methods for determining on-chip interconnect process parameters
07/29/1999DE19859119A1 Thermally conductive insulating circuit board for a power module useful in electrically driven vehicles
07/29/1999DE19827521C1 Aluminum wire bonded to a substrate having a bondable metallic coating
07/29/1999DE19751738A1 Halogen-free epoxy resin useful as coating for electronic components
07/29/1999DE19751542A1 Plastics material with spherical silicon dioxide filler of specific particle size and having negative coefficient of thermal expansion
07/28/1999EP0932330A1 Electronic apparatus
07/28/1999EP0932328A1 Substrate for mounting electronic part and process for manufacturing the same
07/28/1999EP0932255A2 MCM with high Q overlapping resonator
07/28/1999EP0932204A1 Integrated circuit and method for radio frequency applications
07/28/1999EP0932201A2 Press contact type semiconductor device and converter using same
07/28/1999EP0932200A2 Heat sink device for microprocessor
07/28/1999EP0932199A2 Electronic circuit package with diamond film heat conductor
07/28/1999EP0932198A1 Process for manufacturing semiconductor package and circuit board assembly
07/28/1999EP0932193A2 Method of forming bump electrodes
07/28/1999EP0931344A1 System for protecting semiconductor chips against analysis
07/28/1999EP0931343A1 Chip module especially for implantation in chip card body
07/28/1999EP0775716B1 Novel heat-fusible copolymer, and powder, film, laminated heat insulator, electronic module, and capacitor produced from said copolymer, and process for producing the same
07/28/1999EP0597087B1 Computer-aided design method for multilevel interconnect technologies
07/28/1999EP0536418B1 Method of manufacturing a semiconductor device terminal structure
07/28/1999CN2331085Y Internal-pressed connection type power semiconductor device
07/28/1999CN2331084Y Element for supporting semiconductor chip in non-contact chip card
07/28/1999CN1224242A Transistor overload protection circuit
07/28/1999CN1224241A Lead-on-chip type semiconductor device having thin plate and method for manufacturing the same
07/28/1999CN1224240A Circuit layout for solving integrated circuit electrostatic discharge problem
07/28/1999CN1224239A Semiconductor device with low permittivity interlayer insulating film and method of manufacturing the same
07/27/1999US5930676 Multilayered interconnection substrate and process for fabricating the same
07/27/1999US5930674 Semiconductor device with improved planarization properties
07/27/1999US5930673 Method for forming a metal contact
07/27/1999US5930669 Continuous highly conductive metal wiring structures and method for fabricating the same
07/27/1999US5930668 Process of fabricating embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias
07/27/1999US5930667 Method for fabricating multilevel interconnection structure for semiconductor devices
07/27/1999US5930665 Wide frequency band transition between via RF transmission lines and planar transmission lines
07/27/1999US5930663 Digital circuit with transistor geometry and channel stops providing camouflage against reverse engineering
07/27/1999US5930655 Defluorination of surface region of barrier layer by exposure to ozone plasma prior to printing circuit pattern of metal conductors
07/27/1999US5930653 Method of manufacturing a semiconductor device for surface mounting suitable for comparatively high voltages, and such a semiconductor device
07/27/1999US5930604 Encapsulation method for fine-pitch chip-on-board
07/27/1999US5930603 Method for producing a semiconductor device
07/27/1999US5930602 Method of packaging an integrated circuit die
07/27/1999US5930601 From a heat dissipating circuit
07/27/1999US5930599 Semiconductor device and method of manufacturing the same
07/27/1999US5930597 Reworkable polymer chip encapsulant
07/27/1999US5930596 Semiconductor component for vertical integration and manufacturing method
07/27/1999US5930593 Method for formating device on wafer without peeling
07/27/1999US5930166 For reading and writing data from and into a memory cell
07/27/1999US5930117 Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer
07/27/1999US5930116 Integrated clamping mechanism
07/27/1999US5930115 Apparatus, method and system for thermal management of a semiconductor device
07/27/1999US5930114 Heat sink mounting assembly for surface mount electronic device packages
07/27/1999US5930098 Multichip semiconductor structures with interchip electrostatic discharge protection, and fabrication methods therefore
07/27/1999US5929529 Reticle semiconductor wafer, and semiconductor chip
07/27/1999US5929528 Semiconductor device and method of manufacturing the same
07/27/1999US5929527 Aluminum, silicon nitride
1 ... 1945 1946 1947 1948 1949 1950 1951 1952 1953 1954 1955 1956 1957 1958 1959 1960 1961 1962 1963 1964 1965 ... 2262