Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1999
08/17/1999US5937515 Reconfigurable circuit fabrication method
08/17/1999US5937514 Method of making a heat-resistant system
08/17/1999US5937512 Method of forming a circuit board
08/17/1999US5937494 Method for assembling an ink-jet pen having a double-sided electrical interconnect flexible circuit
08/17/1999US5937493 Method of manufacturing an electronic multilayer component
08/17/1999CA2156795C An electronic device assembly and a manufacturing method of the same
08/12/1999WO1999040763A1 Microelectronic lead structures with plural conductors
08/12/1999WO1999040761A1 Components with releasable leads
08/12/1999WO1999040629A1 Quasi-mesh gate structure including plugs connecting source regions with backside for lateral rf mos devices
08/12/1999WO1999040627A1 An electrical connecting element and a method of making such an element
08/12/1999WO1999040626A1 Semiconductor device and method for producing the same, and semiconductor sealing resin composition
08/12/1999WO1999040625A1 Thermal bus bar design for an electronic cartridge
08/12/1999WO1999040624A1 Integrated circuit device
08/12/1999WO1999040173A1 Substrates for immobilizing and amplifying dna, dna-immobilized chips having dna immobilized on the substrates, and method for amplifying dna
08/12/1999DE19755135C1 Semiconductor structure having IC structure, especially an SOI IC, e.g. a CMOS-IC, formed in silicon@ island
08/12/1999CA2320462A1 Substrates for immobilizing and amplifying dna, dna-immobilized chips having dna immobilized on the substrates, and method for amplifying dna
08/12/1999CA2319506A1 Integrated circuit device
08/11/1999EP0935289A2 Substrate marking process
08/11/1999EP0935288A2 Sealed structure of semiconductor circuit and method for production thereof
08/11/1999EP0935287A2 Molding die and marking method for semiconductor devices
08/11/1999EP0935286A1 Copper circuit junction substrate and method of producing the same
08/11/1999EP0935283A2 Silicone polymer insulation film on semiconductor substrate and method for forming the film
08/11/1999EP0934687A1 Assembly consisting of a substrate for power components and a cooling element and method for the production thereof
08/11/1999EP0828774B1 Epoxy resin moulding materials fire-proofed without halogens
08/11/1999EP0745270A4 Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
08/11/1999CN2333091Y Eddy cooling fin
08/11/1999CN1225750A Process for mfg. semiconductor package and circuit board assembly
08/11/1999CN1225724A Wafer-level burn-in and test
08/11/1999CN1225510A Plastic-encapsulated semiconductor device equipped with LOC package structure
08/11/1999CN1225509A 半导体器件 Semiconductor devices
08/11/1999CN1225508A Visual inspection apparatus of tape carrier package
08/11/1999CN1044649C Refractory metal capped low resistivity metal conductor lines and vias formed, and method for mfg. same
08/10/1999US5937327 Method for improving wiring contact in semiconductor devices
08/10/1999US5937326 Method for making semiconductor device having via hole
08/10/1999US5937324 Method for forming a line-on-line multi-level metal interconnect structure for use in integrated circuits
08/10/1999US5937322 Silicon oxide film is formed on a wire array by cvd employing a gas mixture composed of a gas containing silicon atoms and hydrogen peroxide, and the thickness of the silicon oxide film in the region apart from the wire array is formed to be at
08/10/1999US5937321 Method for manufacturing ceramic multilayer circuit
08/10/1999US5937320 Barrier layers for electroplated SnPb eutectic solder joints
08/10/1999US5937281 Method to form metal-to-metal antifuse for field programmable gate array applications using liquid phase deposition (LPD)
08/10/1999US5937279 Semiconductor device, and manufacturing method of the same
08/10/1999US5937278 Method of manufacturing lead frame having inner lead connected to outer lead by metal etch stop layer
08/10/1999US5937277 Semiconductor device with reliable electrodes of projecting shape and method of forming same
08/10/1999US5937276 Bonding lead structure with enhanced encapsulation
08/10/1999US5937270 Method of efficiently laser marking singulated semiconductor devices
08/10/1999US5936849 Text fixture retainer for an integrated circuit package
08/10/1999US5936848 Printed circuit board
08/10/1999US5936847 Low profile electronic circuit modules
08/10/1999US5936845 IC package and IC probe card with organic substrate
08/10/1999US5936843 Printed wiring board with mounted circuit element using a terminal density conversion board
08/10/1999US5936837 Semiconductor component having leadframe with offset ground plane
08/10/1999US5936819 Break display apparatus for semiconductor switching element incorporating overcurrent/overheating protection function
08/10/1999US5936646 Image processing equipment with thermally efficient heat dissipating element
08/10/1999US5936492 Ribbon, bonding wire and microwave circuit package
08/10/1999US5936418 Semiconductor device socket
08/10/1999US5936311 Integrated circuit alignment marks distributed throughout a surface metal line
08/10/1999US5936309 Mounted structure of printed circuit board in semiconductor package
08/10/1999US5936308 Interlocking conductive plug for use with an integrated circuit
08/10/1999US5936307 Surface modification method for film stress reduction
08/10/1999US5936306 TiSi2 /TiN clad interconnect technology
08/10/1999US5936305 Stacked leads-over chip multi-chip module
08/10/1999US5936304 C4 package die backside coating
08/10/1999US5936303 Plastic molded semiconductor package
08/10/1999US5936302 Speaker diaphragm
08/10/1999US5936300 Semiconductor device with film covering
08/10/1999US5936298 Method for realizing magnetic circuits in an integrated circuit
08/10/1999US5936297 Programmable semiconductor element having an antifuse structure
08/10/1999US5936296 Integrated circuits having metallic fuse links
08/10/1999US5936295 Multilevel interconnect structure with air gaps formed between metal leads
08/10/1999US5936289 Semiconductor device
08/10/1999US5936283 MOSFET for input/output protective circuit having a multi-layered contact structure with multiple contact holes on a single diffusion layer
08/10/1999US5936260 Semiconductor reliability test chip
08/10/1999US5935868 Interconnect structure and method to achieve unlanded vias for low dielectric constant materials
08/10/1999US5935766 Method of forming a conductive plug in an interlevel dielectric
08/10/1999US5935764 Method of forming alignment mark and fabricating semiconductor device
08/10/1999US5935502 Method for manufacturing plastic package for electronic device having a fully insulated dissipator
08/10/1999US5935375 Apparatus and method for manufacturing a semiconductor package
08/10/1999US5935314 Inorganic filler, epoxy resin composition, and semiconductor device
08/10/1999US5935294 Method of manufacturing and transferring metallic droplets
08/10/1999US5934914 Microelectronic contacts with asperities and methods of making same
08/10/1999US5934368 Air-cooled electronic apparatus with condensation prevention
08/10/1999CA2157257C Semiconductor device with amorphous carbon layer and method of fabricating the same
08/10/1999CA2156835C Three-layer polyimidesiloxane adhesive tape
08/10/1999CA2072262C Semiconductor device and method for manufacturing the same
08/05/1999WO1999039557A1 Self-balancing thermal control device for integrated circuits
08/05/1999WO1999038903A1 Snap cure adhesive based on anhydride/epoxy resins
08/05/1999WO1999038816A1 Filler powder and process to make the filler powder
08/05/1999WO1999010916A3 Copper electroless deposition on a titanium-containing surface
08/05/1999DE19903342A1 Multiple chip module
08/05/1999DE19841435A1 Semiconductor device has a wiring connection structure of low contact resistance
08/05/1999DE19835442A1 Hollow casing for integrated circuits
08/04/1999EP0933816A2 Hybrid module and methods for manufacturing and mounting thereof
08/04/1999EP0933815A1 A metallization structure on a fluorine-containing dielectric and a method for fabrication thereof
08/04/1999EP0933814A1 A metallization structure on a fluorine-containing dielectric and a method for fabrication thereof
08/04/1999EP0933813A2 Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package
08/04/1999EP0933802A1 Process for the production of semiconductor device
08/04/1999EP0933413A2 Adhesive sheets for semiconductor device and face-mounting type semiconductor device
08/04/1999EP0933012A1 Method and device for positioning and retaining micro-building-blocks
08/04/1999EP0932941A1 Slotline-mounted flip chip structures
08/04/1999EP0932913A1 Electroplated interconnection structures on integrated circuit chips
08/04/1999EP0932500A1 Method to control cavity dimensions of fired multilayer circuit boards on a support
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