Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1999
08/24/1999US5943209 Modularized electronic component cooling apparatus
08/24/1999US5942960 Printed circuit board with a high frequency coupling island
08/24/1999US5942805 Fiducial for aligning an integrated circuit die
08/24/1999US5942804 Circuit structure having a matrix of active devices
08/24/1999US5942802 Semiconductor device and method of producing the same
08/24/1999US5942801 Borderless vias with HSQ gap filled metal patterns having high etching resistance
08/24/1999US5942800 Stress buffered bond pad and method of making
08/24/1999US5942799 High electroconductivity, adhesion; used in semiconductor integrated circuits
08/24/1999US5942796 Package structure for high-power surface-mounted electronic devices
08/24/1999US5942795 Packaged semiconductor device
08/24/1999US5942794 Plastic encapsulated semiconductor device and method of manufacturing the same
08/24/1999US5942781 Tunable threshold SOI device using back gate well
08/24/1999US5942769 Low dielectric constant amorphous fluorinated carbon and method of preparation
08/24/1999US5942766 Article and method for in-process testing of RF products
08/24/1999US5942763 Apparatus and method for identifying an identification mark of a wafer
08/24/1999US5942328 For electronic devices
08/24/1999US5941079 Microminiature stirling cycle cryocoolers and engines
08/24/1999US5940964 Fabrication process for circuit substrate having interconnection leads
08/21/1999CA2261970A1 Vertical spark gap for microelectronic circuits
08/20/1999CA2262043A1 Spark gap for hermetically packaged integrated circuits
08/19/1999WO1999041960A1 Electronic module with semiconductors, with liquid-cooling system and transmitter comprising at least one such module
08/19/1999WO1999041957A1 Method of making microwave, multifunction modules using fluoropolymer composite substrates
08/19/1999WO1999041784A1 Method and apparatus for coupling circuit components
08/19/1999WO1999041783A1 Semiconductor module
08/19/1999WO1999041782A2 Module tape with modules for dual-mode data carriers
08/19/1999WO1999041781A1 Base sheet for semiconductor module, method for manufacturing base sheet for semiconductor module, and semiconductor module
08/19/1999WO1999041778A1 Apparatus for controlling temperature of substrate
08/19/1999WO1999041770A2 Routing topology for identical connector point layouts on primary and secondary sides of a substrate
08/19/1999WO1999041314A1 Resin composition, molded article thereof, and process for producing resin composition
08/19/1999WO1999035688B1 Gettering device for ion capture
08/19/1999WO1999033114A3 Semiconductor substrate with embedded isolating layer for integrated circuits
08/19/1999DE19905220A1 Multichip module on intermediate support
08/19/1999DE19843173A1 Semiconductor device copper wiring production especially for highly integrated power semiconductor device
08/19/1999DE19827237A1 Substrate for chip scale casing
08/19/1999DE19826546A1 Dual damascene structure with improved control of the etching stop
08/18/1999EP0936851A2 Socket for integrated circuit chip
08/18/1999EP0936671A1 Resin-moulded semiconductor hybrid module and manufacturing method thereof
08/18/1999EP0936670A2 Power semiconductor module
08/18/1999EP0936669A1 Semiconductor device and method of manufacturing the same
08/18/1999EP0936282A2 Low-k fluorinated amorphous carbon dielectric and method of making the same
08/18/1999EP0935526A1 Metal ceramic composites with improved interfacial properties
08/18/1999EP0750597B1 Method of producing ceramic composite bodies
08/18/1999CN1226313A Spray-cooling electronic component
08/18/1999CN1226105A Improvement of activation speed of signal wiring line in semiconductor integrated circuit
08/18/1999CN1226084A Semiconductor device and method of manufacturing it
08/18/1999CN1226081A Method of manufacturing semiconductor device
08/18/1999CN1226080A Interconnect structure in semiconductor device and method of formation
08/18/1999CN1226077A Method for manufacturing semiconductor device
08/17/1999US5940733 Sequentially forming doped and undoped layers of polysilicon over integrated circuit structure in a first deposition chamber, then transferring structure without oxidation into second deposition chamber for subsequent siliciding
08/17/1999US5940730 Method of forming a contact hole of a semiconductor device
08/17/1999US5940729 Method of planarizing a curved substrate and resulting structure
08/17/1999US5940727 Technique for producing interconnecting conductive links
08/17/1999US5940688 Epoxy resin composition and semiconductor device encapsulated therewith
08/17/1999US5940687 To an electronic circuit package
08/17/1999US5940686 Method for manufacturing multi-chip modules utilizing direct lead attach
08/17/1999US5940682 Method of measuring electron shading damage
08/17/1999US5940681 Method and apparatus for automatically checking position data of J-leads
08/17/1999US5940679 Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage
08/17/1999US5940570 Curable composition comprising an epoxy-functional compound, a hydroxy-functional compound, and a curative catalyst, cables
08/17/1999US5940279 Metal support element for electronic components or circuit supports
08/17/1999US5940277 Semiconductor device including combed bond pad opening, assemblies and methods
08/17/1999US5940273 Semiconductor clamping device
08/17/1999US5940271 Stiffener with integrated heat sink attachment
08/17/1999US5940269 Heat sink assembly for an electronic device
08/17/1999US5940268 Heat sink and electronic device employing the same
08/17/1999US5940267 Heat sink for cooling a heat producing element and application
08/17/1999US5939954 Equivalent circuit of package ground terminal paddle
08/17/1999US5939891 Socket for IC package
08/17/1999US5939792 Resin-mold type semiconductor device
08/17/1999US5939790 Integrated circuit pad structures
08/17/1999US5939788 Copper diffusion barrier, aluminum wetting layer and improved methods for filling openings in silicon substrates with cooper
08/17/1999US5939787 Semiconductor device having a multi-layer contact structure
08/17/1999US5939786 Palladium dendrites are electrodeposited on circuitry
08/17/1999US5939784 For an electronic device
08/17/1999US5939783 For being electrically coupled to a printed circuit board
08/17/1999US5939782 Package construction for integrated circuit chip with bypass capacitor
08/17/1999US5939781 Thermally enhanced integrated circuit packaging system
08/17/1999US5939780 Power supply circuit for a semiconductor integrated circuit
08/17/1999US5939779 Bottom lead semiconductor chip stack package
08/17/1999US5939778 Integrated circuit chip package
08/17/1999US5939777 High aspect ratio integrated circuit chip and method for producing the same
08/17/1999US5939776 Lead frame structure having non-removable dam bars for semiconductor package
08/17/1999US5939775 Leadframe structure and process for packaging intergrated circuits
08/17/1999US5939774 Semiconductor lead frame
08/17/1999US5939772 For a circuit die
08/17/1999US5939771 Polyimide resin and a fluoropolymer
08/17/1999US5939766 High quality capacitor for sub-micrometer integrated circuits
08/17/1999US5939748 In a semiconductor memory device
08/17/1999US5939745 Dynamic access memory using silicon-on-insulator
08/17/1999US5939739 Separation of thermal and electrical paths in flip chip ballasted power heterojunction bipolar transistors
08/17/1999US5939617 Method and apparatus for testing the filtration efficiency of cloth materials intended for use in a clean room environment
08/17/1999US5939509 Epoxy resin, resin composition, and resin-encapsulated semiconductor device
08/17/1999US5939473 Epoxy resin, resin composition, and resin-encapsulated semiconductor device
08/17/1999US5939214 Thermal performance package for integrated circuit chip
08/17/1999US5938956 Circuit and method for heating an adhesive to package or rework a semiconductor die
08/17/1999US5938452 Flexible interface structures for electronic devices
08/17/1999US5938104 Direct metal bonding
08/17/1999US5937937 Heat sink and method for removing heat from a plurality of components
08/17/1999US5937936 Heat sink for portable electronic devices
08/17/1999US5937517 Method of manufacturing bonded dual extruded, high fin density heat sinks
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