Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1999
09/01/1999CN1227406A Semiconductor device and method of manufacturing the same
09/01/1999CN1044951C Contacting system for electrical device
08/1999
08/31/1999US5946601 Unique α-C:N:H/α-C:Nx film liner/barrier to prevent fluorine outdiffusion from α-FC chemical vapor deposition dielectric layers
08/31/1999US5946600 Metal layer over dielectric, applying a barrier over aluminum and aluminum over barrier, applying photoresist layer, exposure and oxidation
08/31/1999US5946597 Semiconductor chip mounting method
08/31/1999US5946593 Semiconductor device manufacturing method
08/31/1999US5946592 Combined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded therein
08/31/1999US5946590 Coating an organic film on semiconductor substrate, drying, treatment with excimer lasers to form pads
08/31/1999US5946586 Method of manufacturing a glass-covered semiconductor device
08/31/1999US5946583 Method for preventing alignment marks from disappearing after chemical mechanical polishing
08/31/1999US5946570 Process for fabricating semiconductor device having semiconductor layers epitaxially grown from active areas without short-circuit on field insulating layer
08/31/1999US5946563 Semiconductor device and method of manufacturing the same
08/31/1999US5946559 Method of forming a field effect transistor
08/31/1999US5946557 Method of manufacturing a semiconductor device having dummy patterns and an upper insulating layer having cavities
08/31/1999US5946556 Melting wax, covering a layer eith curable resin, curing and vaporization for integrated circuits
08/31/1999US5946555 Method of packaging a semiconductor device
08/31/1999US5946554 Method of producing resin-sealed electronic device
08/31/1999US5946553 Process for manufacturing a semiconductor package with bi-substrate die
08/31/1999US5946552 Universal cost reduced substrate structure method and apparatus
08/31/1999US5946545 Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit
08/31/1999US5946544 Circuit board-mounted IC package cooling and method
08/31/1999US5946543 Semiconductor wafer evaluating method and semiconductor device manufacturing method
08/31/1999US5946195 Semiconductor device, method of making the same and mounting the same, circuit board and flexible substrate
08/31/1999US5946189 For dissipating heat
08/31/1999US5946188 For electronic devices
08/31/1999US5945741 Semiconductor chip housing having a reinforcing plate
08/31/1999US5945740 Semiconductor device
08/31/1999US5945739 Semiconductor device having a conductor through an inter-level layer and a spin-on-glass in the inter-level layer with substantially planar upper surfaces of the conductor, the inter-level layer, and the spin-on-glass
08/31/1999US5945738 Dual landing pad structure in an integrated circuit
08/31/1999US5945737 Thin film or solder ball including a metal and an oxide, nitride, or carbide precipitate of an expandable or contractible element
08/31/1999US5945736 For removing heat from an electronic device package
08/31/1999US5945735 Semiconductor package
08/31/1999US5945734 Wire-bond free input/output interface for GaAs ICs with means of determining known good die
08/31/1999US5945733 Structure for attaching a semiconductor wafer section to a support
08/31/1999US5945732 Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
08/31/1999US5945731 Resin encapsulated semiconductor device and method for manufacturing the same
08/31/1999US5945730 Semiconductor power device
08/31/1999US5945729 Technique for attaching die to leads
08/31/1999US5945728 Lead frame capacitor and capacitively coupled isolator circuit
08/31/1999US5945721 Air-tightly sealed container for photosemiconductor, and photosemiconductor module
08/31/1999US5945719 Substrates with silicon layer over substrates and with barrier layer of nitride, metal silicide and silicon layer
08/31/1999US5945716 Semiconductor wafer and device structure
08/31/1999US5945709 Integrated circuit die having thick bus to reduce distributed resistance
08/31/1999US5945700 Semiconductor device having a semiconductor switch structure
08/31/1999US5945696 Silicon chip having mixed input/output slot structure
08/31/1999US5945692 Semiconductor device and method of fabricating same
08/31/1999US5945688 Optical semiconductor device and lead frame used in such a device
08/31/1999US5945503 Polymaleimide resin composition and laminate plate for semiconductor substrate using it
08/31/1999US5945259 Covering first photoresist pattern with another as etching buffer, etching connector using both patterns as etching mask, then removing second pattern and again etching using first pattern as mask, preventing undercutting, sharp edges
08/31/1999US5945217 Composites having a polytetrafluoroethylene matrix containing a dispersion of thermally conductive particles and a phase change material capable of storing thermal energy as latent heat, heat sinks for electronic equipment
08/31/1999US5945188 Insulating film of adhesive layer, polyamide resin, inorganic filler, epoxy resin layer with siloxane
08/31/1999US5945155 Low dielectric constant amorphous fluorinated carbon and method of preparation
08/31/1999US5945065 Gold, calcium alloy wire; bonding to semiconductor
08/31/1999US5944976 Process for forming adjacent moats or holes
08/31/1999US5944537 Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices
08/31/1999US5944097 Composite substrate carrier for high power electronic devices
08/31/1999US5944093 For holding a heat generating device
08/26/1999WO1999043190A1 Cooling element for electronic power device and power electronic device comprising same
08/26/1999WO1999043084A1 Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves
08/26/1999WO1999043032A2 sEMICONDUCTOR COMPONENT WITH A STRUCTURED LEADFRAME AND METHOD FOR PRODUCING THE SAME
08/26/1999WO1999043027A1 Emc-optimised power switch
08/26/1999WO1999042945A1 Non-lot based method for assembling integrated circuit devices
08/26/1999WO1999042781A1 Heat exchanger and method for producing the heat exchanger
08/26/1999WO1999042449A1 Novel compounds, hardening accelerator, resin composition, and electronic part device
08/26/1999WO1999042200A1 Aerosol method and apparatus for making particulate products
08/26/1999WO1999030363A3 Semiconductor device and method of manufacturing such a device
08/26/1999WO1999030275B1 Authenticity attribute
08/26/1999DE19845858A1 Semiconductor device and method for manufacturing it
08/26/1999DE19844451A1 Barrier layer structure, especially for copper interconnections in a VLSI
08/26/1999DE19840988A1 Method for manufacturing a contact structure for integrated circuits
08/26/1999DE19806978A1 Convection cooled heat sink for electronic components
08/26/1999CA2321473A1 Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves
08/25/1999EP0938139A2 Microwave and millimeter wave device
08/25/1999EP0938138A2 Fet array for operation at different power levels
08/25/1999EP0938137A2 Member for semiconductor device and method for producing the same
08/25/1999EP0879470A4 Over-voltage protection device and method for making same
08/25/1999EP0868778B1 Electronic component, especially one operating with acoustic surface waves (sw component)
08/25/1999EP0868776B1 Electrical component, especially one operating with acoustic surface waves (sw component) and process for its production
08/25/1999CN2335267Y Honeycomb type radiator
08/25/1999CN2335266Y Temperature equalizer
08/25/1999CN2335265Y Base for light emitting diode (LED)
08/25/1999CN1226914A Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith
08/25/1999CN1226903A Perfluorinated hydrocarbon polymer-filled adhesive formulations and use thereof
08/25/1999CN1226758A Testing IC socket
08/25/1999CN1226747A Semiconductor device and manufacturing method thereof
08/25/1999CN1226746A Multi-layer solder seal band for semiconductor substrates and process thereof
08/25/1999CN1226744A Planarization of non-conformal device layer in semiconductor fabrication
08/24/1999US5943602 Method to cure mobile ion contamination in semiconductor processing
08/24/1999US5943601 Depositing group 4a metal underlayer onto substrate; depositing aluminum or aluminum alloy layer which is in electrical contact with metal underlayer
08/24/1999US5943597 Bumped semiconductor device having a trench for stress relief
08/24/1999US5943588 Method of manufacturing and using alignment marks
08/24/1999US5943587 Method for making offset alignment marks
08/24/1999US5943580 Method of forming a capacitor or an inductor on a substrate
08/24/1999US5943558 Method of making an assembly package having an air tight cavity and a product made by the method
08/24/1999US5943557 Method and structure for attaching a semiconductor die to a lead frame
08/24/1999US5943285 Semiconductor memory device
08/24/1999US5943254 Multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes
08/24/1999US5943212 Having external connection terminals; no breaking or peeling at junction portions
08/24/1999US5943211 Heat spreader system for cooling heat generating components
08/24/1999US5943210 Cooling device for central processing unit module
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