| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/09/1999 | DE19819861A1 Conductive track surface treatment method |
| 09/09/1999 | DE19808986A1 Halbleiterbauelement mit mehreren Halbleiterchips A semiconductor device comprising a plurality of semiconductor chips |
| 09/08/1999 | EP0940851A1 Integrated circuit security system and method with implanted interconnections |
| 09/08/1999 | EP0940849A1 A low-loss conductive pattern on a substrate and a method for fabrication thereof |
| 09/08/1999 | EP0940848A2 A low-loss conductive pattern and a method for fabrication thereof |
| 09/08/1999 | EP0940065A1 Electrical apparatus |
| 09/08/1999 | EP0903060A4 Apparatus and method for mounting an electronic component to a substrate |
| 09/08/1999 | EP0761017B1 Semiconductor device of the type sealed in glass having a silver-copper bonding layer between slugs and connection conductors |
| 09/08/1999 | EP0729669A4 Dual-sided push-pull amplifier |
| 09/08/1999 | CN2337678Y CUP cooling assembly with air duct |
| 09/08/1999 | CN2337677Y Radiator for power semiconductor |
| 09/08/1999 | CN1227787A Laminate and method of manufacture thereof |
| 09/07/1999 | US5950105 Completely buried contact holes and methods of forming same |
| 09/07/1999 | US5950101 Method for manufacturing a semiconductor device involving forming two silicon oxide layers by CVD and forming HMDS between the silicon oxide layers |
| 09/07/1999 | US5950100 Method of manufacturing semiconductor device and apparatus for the same |
| 09/07/1999 | US5950099 Method of forming an interconnect |
| 09/07/1999 | US5950074 Method of making an integrated circuit package |
| 09/07/1999 | US5950073 Self-adjusting semiconductor package stand-offs |
| 09/07/1999 | US5950072 Low-profile removable ball-grid-array integrated circuit package |
| 09/07/1999 | US5950070 Method of forming a chip scale package, and a tool used in forming the chip scale package |
| 09/07/1999 | US5950069 Quencher clamping operation using an electromagnet |
| 09/07/1999 | US5950066 Graft polysiloxane |
| 09/07/1999 | US5949655 Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device |
| 09/07/1999 | US5949654 Multi-chip module, an electronic device, and production method thereof |
| 09/07/1999 | US5949651 Quad flat pack integrated circuit package |
| 09/07/1999 | US5949649 High power semiconductor device having bolt-down ceramic platform |
| 09/07/1999 | US5949647 Heat pipe to baseplate attachment method |
| 09/07/1999 | US5949547 System for in-line monitoring of photo processing in VLSI fabrication |
| 09/07/1999 | US5949323 Non-uniform width configurable fuse structure |
| 09/07/1999 | US5949312 Suspended monolithic microwave integrated circuit and method of manufacture |
| 09/07/1999 | US5949294 Reference frequency source oscillator formed from first and second containers |
| 09/07/1999 | US5949242 Method and apparatus for testing unpackaged semiconductor dice |
| 09/07/1999 | US5949145 Semiconductor device including alignment marks |
| 09/07/1999 | US5949144 In a bonded wafer |
| 09/07/1999 | US5949143 Semiconductor interconnect structure with air gap for reducing intralayer capacitance in metal layers in damascene metalization process |
| 09/07/1999 | US5949142 Chip size package and method of manufacturing the same |
| 09/07/1999 | US5949140 Microwave semiconductor device with via holes and associated structure |
| 09/07/1999 | US5949139 Semiconductor integrated circuit device capable of achieving reductions in chip area and consumption power |
| 09/07/1999 | US5949138 Heat spreader |
| 09/07/1999 | US5949137 Stiffener ring and heat spreader for use with flip chip packaging assemblies |
| 09/07/1999 | US5949136 High performance debug I/O |
| 09/07/1999 | US5949134 For mounting a semiconductor chip |
| 09/07/1999 | US5949133 Semiconductor interconnect structure for high temperature applications |
| 09/07/1999 | US5949132 Dambarless leadframe for molded component encapsulation |
| 09/07/1999 | US5949130 Semiconductor integrated circuit device employing interlayer insulating film with low dielectric constant |
| 09/07/1999 | US5949127 Electrically programmable interlevel fusible link for integrated circuits |
| 09/07/1999 | US5949125 Semiconductor device having field isolation with a mesa or mesas |
| 09/07/1999 | US5949124 Edge termination structure |
| 09/07/1999 | US5949113 Static RAM having a stable high-resistance load |
| 09/07/1999 | US5949106 FET input/output pad layout |
| 09/07/1999 | US5949104 Source connection structure for lateral RF MOS devices |
| 09/07/1999 | US5949098 Semiconductor integrated circuit having an improved arrangement of power supply lines to reduce noise occurring therein |
| 09/07/1999 | US5949090 MOS TEG structure |
| 09/07/1999 | US5949029 Conductive elastomers and methods for fabricating the same |
| 09/07/1999 | US5948718 Able to be miniaturized and contacted to external circuits when used in a micro-stripline device |
| 09/07/1999 | US5948705 Method of forming interconnection line |
| 09/07/1999 | US5948689 On one substrate forming heat generators on one surface, forming channels/fins on other surface; on another substrate forming channels/fins on surface; interleaving fins forming thermoconductive path to heat sink |
| 09/07/1999 | US5948536 Glass composition for substrates with a built-in lead base dielectric material, and multilayer substrate with a built-in capacitor |
| 09/07/1999 | US5948533 Vertically interconnected electronic assemblies and compositions useful therefor |
| 09/07/1999 | US5948521 Thermally conductive, electrically insulating connection |
| 09/07/1999 | US5948233 Method of manufacturing an electric component which can be mounted on the surface of a printed circuit board |
| 09/07/1999 | US5948192 Glass-ceramic substrate and method of producing the same |
| 09/07/1999 | US5947191 Electronics module heat sink with quick mounting pins |
| 09/07/1999 | US5946799 Multilevel interconnect method of manufacturing |
| 09/07/1999 | US5946794 Method of manufacturing a composite microwave circuit module |
| 09/07/1999 | CA2088821C Cooling structure for integrated circuit |
| 09/02/1999 | WO1999044401A1 Stacking layers containing enclosed ic chips |
| 09/02/1999 | WO1999044241A2 Semiconductor device comprising a mos transistor |
| 09/02/1999 | WO1999044240A1 Bipolar transistor with an insulated gate electrode |
| 09/02/1999 | WO1999044236A1 Method of manufacturing three-dimensional device |
| 09/02/1999 | WO1999044235A1 Multichip semiconductor package and method of making |
| 09/02/1999 | WO1999044234A1 Lead frame device and method for producing the same |
| 09/02/1999 | WO1999044233A1 Low profile ball grid array package |
| 09/02/1999 | WO1999044229A1 A method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating |
| 09/02/1999 | WO1999044228A1 Semiconductor device |
| 09/02/1999 | WO1999044004A1 Heat exchanger |
| 09/02/1999 | DE19907525A1 IC package especially a wafer level chip scale package |
| 09/02/1999 | DE19906856A1 Spark gap assembly for hermetically packaged integrated circuits |
| 09/02/1999 | DE19847641A1 Semiconductor device production process especially for producing a conductive structure e.g. a silicide electrode or connection for a MOS transistor |
| 09/02/1999 | DE19808193A1 Leadframevorrichtung und entsprechendes Herstellungsverfahren Leadframe device and corresponding manufacturing method |
| 09/02/1999 | DE19808154A1 Bipolar transistor with insulated gate (IGBT) |
| 09/02/1999 | CA2330930A1 Heat exchanger |
| 09/01/1999 | EP0939485A1 Chip device and method for producing the same |
| 09/01/1999 | EP0939443A2 Heat sink for cooling a heat producing element and application |
| 09/01/1999 | EP0939442A2 Heat sink for cooling a heat producing element and application |
| 09/01/1999 | EP0939441A2 Encapsulant resin member for semiconductor, and semiconductor element |
| 09/01/1999 | EP0939440A2 Process for producing semiconductor device package and organopolysiloxane composition used therefor |
| 09/01/1999 | EP0939433A2 Method for reforming undercoating surface and method for production of semiconductor device |
| 09/01/1999 | EP0939379A1 Ic module, ic card, sealing resin for ic module, and method for manufacturing ic module |
| 09/01/1999 | EP0939096A2 Functional groups for thermal crosslinking of polymeric systems |
| 09/01/1999 | EP0938749A1 Integrated circuit with housing accommodating the latter |
| 09/01/1999 | EP0938748A1 Power connection for power semiconductor component |
| 09/01/1999 | EP0938639A1 Thin, planar heat spreader |
| 09/01/1999 | EP0812473B1 Arrangement of electronic components on a carrier strip |
| 09/01/1999 | EP0772756B1 Microcomponent sheet architecture |
| 09/01/1999 | CN2336478Y Radiator case using large power semiconductor module |
| 09/01/1999 | CN2336477Y Case fastening type CPU supporter structure |
| 09/01/1999 | CN1227412A Semiconductor device and method of fabricating the same |
| 09/01/1999 | CN1227411A Semiconductor device containing semiconductor element in package |
| 09/01/1999 | CN1227409A Method and structure for contact to copper metallization in insulating via on semiconductor |