| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/21/1999 | US5954124 For effecting heat exchange between two fluids of different temperatures |
| 09/21/1999 | US5953930 For use in a thermosyphon cooling system |
| 09/19/1999 | CA2259547A1 High-gain amplifier |
| 09/16/1999 | WO1999046965A2 Integrated circuit connection using an electrically conductive adhesive |
| 09/16/1999 | WO1999046820A1 Over-voltage protection device for integrated circuits |
| 09/16/1999 | WO1999046819A1 Over-voltage protection system for integrated circuits using the bonding pads and passivation layer |
| 09/16/1999 | WO1999046818A1 IMPROVEMENTS TO THE PROTECTION OF FETs BY MEANS OF TRACKS OF PRINTED CIRCUIT BOARDS |
| 09/16/1999 | WO1999046817A1 Clip-on heat sink |
| 09/16/1999 | WO1999046813A1 Method for fabricating double sided ceramic circuit boards using a titanium support substrate |
| 09/16/1999 | WO1999031731A3 Silicon oxide insulator (soi) semiconductor having selectively linked body |
| 09/16/1999 | DE19906841A1 Vertical spark assembly for microelectronic circuits |
| 09/16/1999 | DE19903104A1 Mounting semiconductor components and modules onto coupling frame |
| 09/16/1999 | DE19819254A1 Semiconductor DRAM component with integral test circuit |
| 09/16/1999 | DE19810919A1 Modulgrundplatte zur Kühlung elektrischer Bauelemente Module base plate for cooling electrical components |
| 09/16/1999 | DE19809073A1 Semiconductor chip module for chip card |
| 09/16/1999 | DE19802854C1 Computer chip heat sink |
| 09/16/1999 | CA2295157A1 Improvements to the protection of fets by means of tracks of printed circuit boards |
| 09/15/1999 | EP0942640A2 Advanced liquid cooling apparatus |
| 09/15/1999 | EP0942636A2 Solder bonding printed circuit board |
| 09/15/1999 | EP0942635A1 A power semiconductor device for "flip-chip" connections |
| 09/15/1999 | EP0942470A2 High-frequency semiconductor device |
| 09/15/1999 | EP0942469A2 Connecting lead for semiconductor devices and method for fabricating the lead |
| 09/15/1999 | EP0942468A2 Module base plate for cooling electric components |
| 09/15/1999 | EP0942462A2 Method and structure for protecting a neighbouring area adjacent to an area to be etched and method for forming a fuse |
| 09/15/1999 | EP0942450A1 Color selection electrode, method of producing color selection electrode and cathode ray tube |
| 09/15/1999 | EP0942072A2 Method for fabricating fluorinated diamond-like carbon layers |
| 09/15/1999 | EP0941643A1 Base for an integrated circuit |
| 09/15/1999 | EP0852809A4 Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions |
| 09/15/1999 | CN2338879Y Holder for connecting high speed internal memory piece |
| 09/15/1999 | CN1228913A 半导体装置 Semiconductor device |
| 09/15/1999 | CN1228872A Thermal grease insertion and retention |
| 09/15/1999 | CN1228853A Semiconductor circuit, particularly for use in integrated module |
| 09/15/1999 | CN1228672A Radiating device for electronic appliances |
| 09/15/1999 | CN1228615A High performance chip packaging and method |
| 09/15/1999 | CN1228614A Encapsulant resin member for semiconductor, and semiconductor element |
| 09/15/1999 | CN1228613A Chip carrier |
| 09/15/1999 | CN1228608A Guard cell for etching |
| 09/15/1999 | CN1228564A Simulation method of wiring temperature rise |
| 09/14/1999 | US5953634 Method of manufacturing semiconductor device |
| 09/14/1999 | US5953632 Method for manufacturing semiconductor device comprising a silicide film |
| 09/14/1999 | US5953628 Method for forming wiring for a semiconductor device |
| 09/14/1999 | US5953625 Air voids underneath metal lines to reduce parasitic capacitance |
| 09/14/1999 | US5953624 Bump forming method |
| 09/14/1999 | US5953623 Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection |
| 09/14/1999 | US5953614 Process for forming self-aligned metal silicide contacts for MOS structure using single silicide-forming step |
| 09/14/1999 | US5953613 High performance MOSFET with a source removed from the semiconductor substrate and fabrication method thereof |
| 09/14/1999 | US5953594 Method of making a circuitized substrate for chip carrier structure |
| 09/14/1999 | US5953593 Method and mold for manufacturing a plastic package for an electronic device having a heat sink |
| 09/14/1999 | US5953592 Fixing semiconductor chip to a polyimide tape by adhesive resin layer, forming at least one hole in the tape to prevent cracking and bulging of the semiconductor device |
| 09/14/1999 | US5953589 Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same |
| 09/14/1999 | US5953588 Stackable layers containing encapsulated IC chips |
| 09/14/1999 | US5953577 Customization of integrated circuits |
| 09/14/1999 | US5953213 Multichip module |
| 09/14/1999 | US5953212 Device for fastening heat sink to CPU |
| 09/14/1999 | US5953210 Reworkable circuit board assembly including a reworkable flip chip |
| 09/14/1999 | US5953208 Heat sink and mounting structure for heat sink |
| 09/14/1999 | US5953206 Thermal dissipation and EMI shielding structure for notebook computers |
| 09/14/1999 | US5953203 A support, a burried screen printed capacitor made from a dielectric selected from barium titanate and lead-magnesium niobiate, a silver conductor layer printed below and above the capacitor, an overlying green tape layer |
| 09/14/1999 | US5952727 Flip-chip interconnection having enhanced electrical connections |
| 09/14/1999 | US5952726 For use on a face of a semiconductor die |
| 09/14/1999 | US5952724 Semiconductor device incorporating a stepped contact hole |
| 09/14/1999 | US5952723 Formed by burying a conductive metal in a via hole formed in an insulating interlayer to connect wiring lines between layers |
| 09/14/1999 | US5952721 Semiconductor device having oxygen-doped silicon layer so as to restrict diffusion from heavily doped silicon layer |
| 09/14/1999 | US5952719 Metal ball grid electronic package having improved solder joint |
| 09/14/1999 | US5952718 Semiconductor devices having protruding contacts |
| 09/14/1999 | US5952717 Semiconductor device and method for producing the same |
| 09/14/1999 | US5952716 Pin attach structure for an electronic package |
| 09/14/1999 | US5952712 Packaged semiconductor device and method of manufacturing the same |
| 09/14/1999 | US5952711 Lead finger immobilization apparatus |
| 09/14/1999 | US5952710 Semiconductor device and method of manufacturing same |
| 09/14/1999 | US5952709 High-frequency semiconductor device and mounted structure thereof |
| 09/14/1999 | US5952694 Semiconductor device made using processing from both sides of a workpiece |
| 09/14/1999 | US5952674 Topography monitor |
| 09/14/1999 | US5952611 Flexible pin location integrated circuit package |
| 09/14/1999 | US5952247 Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate |
| 09/14/1999 | US5952241 Method and apparatus for improving alignment for metal masking in conjuction with oxide and tungsten CMP |
| 09/14/1999 | US5952134 Method for measuring overlay accuracy |
| 09/14/1999 | US5952083 Used for electronic packaging such as substrates for printed circuit boards or ball grid array electronic packages, having conductive circuitry formed on an electrically non-conductive anodic film to avoid short circuiting |
| 09/14/1999 | US5951917 Conductive paste for large greensheet screening including high thixotropic agent content |
| 09/14/1999 | US5951804 Method for simultaneously manufacturing chip-scale package using lead frame strip with a plurality of lead frames |
| 09/14/1999 | US5951720 IC mounting/demounting system and mounting/demounting head therefor |
| 09/14/1999 | US5951304 Fanout interconnection pad arrays |
| 09/14/1999 | US5950908 Solder supplying method, solder supplying apparatus and soldering method |
| 09/14/1999 | US5950721 Heat exchanger for cooling semi-conductor components |
| 09/14/1999 | US5950714 Cooling apparatus for an electronic component |
| 09/14/1999 | US5950687 Lead forming apparatus and lead forming method |
| 09/14/1999 | US5950444 Electronic apparatus |
| 09/14/1999 | US5950304 Methods of making semiconductor chip assemblies |
| 09/14/1999 | CA2147396C Supporting member for cooling means and electronic package using the same |
| 09/13/1999 | CA2265216A1 Epoxy resin composition and resin-encapsulated semiconductor device |
| 09/10/1999 | WO1999045753A1 Method for manufacturing a resistor |
| 09/10/1999 | WO1999045752A1 Electric conductor with a surface structure in the form of flanges and etched grooves |
| 09/10/1999 | WO1999045593A1 Three-dimensional device |
| 09/10/1999 | WO1999045592A1 Semiconductor component with several semiconductor chips |
| 09/10/1999 | WO1999045591A1 An integrated circuit package having interchip bonding and method therefor |
| 09/10/1999 | WO1999045590A1 Flipchip assembly having rigid inner core bumps |
| 09/10/1999 | WO1999045582A1 A method for generation of electrical conducting or semiconducting structures in three dimensions and methods for erasure of the same structures |
| 09/10/1999 | WO1999045571A2 Doping frit appropriate for the production of conductor ceramic enamels |
| 09/10/1999 | WO1999033111A3 Thin-film component comprising a substrate with an elastic coating |
| 09/09/1999 | DE19842441A1 Semiconductor device especially a chip size package for mounting on a printed circuit board |