Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/23/2013CN103367303A High-power IGBT (Insulated Gate Bipolar Transistor) module with integrated gate pole resistor layout
10/23/2013CN103367302A Substrate device
10/23/2013CN103367301A Elongated bumps in integrated circuit devices
10/23/2013CN103367300A Lead frame, semiconductor device, and method for manufacturing lead frame
10/23/2013CN103367299A Device and method for power interconnection of semiconductor module
10/23/2013CN103367298A Semiconductor packaging structure and packaging method thereof
10/23/2013CN103367297A Package structure having ribbon wire
10/23/2013CN103367296A Electronic substrate and method for manufacturing integrated circuit with electronic substrate
10/23/2013CN103367295A Semiconductor device and manufacturing method for same
10/23/2013CN103367294A Rotated semiconductor device fan-out wafer level packages and methods of manufacturing the same
10/23/2013CN103367293A 半导体封装 The semiconductor package
10/23/2013CN103367292A Electrode body, wiring substrate, and semiconductor device
10/23/2013CN103367291A Package on package structures and methods for forming the same
10/23/2013CN103367290A Bonding pad structure with dense via array
10/23/2013CN103367289A Semiconductor package
10/23/2013CN103367288A An electronic device and a method of manufacturing the same
10/23/2013CN103367287A Packaging substrate, semiconductor package and fabrication method thereof
10/23/2013CN103367286A Semiconductor device and assembly method thereof
10/23/2013CN103367285A Through via structure and manufacturing method thereof
10/23/2013CN103367284A Double-L shaped current sharing stress-resistant IGBT (insulated gate bipolar transistor) module busbar terminal
10/23/2013CN103367283A Semiconductor device and method of fabricating the same
10/23/2013CN103367282A Semiconductor chip and packaging structure and formation method of packaging structure
10/23/2013CN103367281A Semiconductor structure with through silicon via and test circuit and method for manufacturing semiconductor structure
10/23/2013CN103367280A Through silicon via structure and manufacture method thereof
10/23/2013CN103367279A A liquid-cooled power semiconductor wafer plate crimping packaging structure with micro channels on double surfaces
10/23/2013CN103367278A Three-dimensional stacked encapsulation structure of double-face water-cooling semiconductor component with fixing devices
10/23/2013CN103367277A 半导体单元 Semiconductor unit
10/23/2013CN103367276A Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment
10/23/2013CN103367275A Interface conducting strip, preparation method thereof and heat dissipating system
10/23/2013CN103367274A Grid fan-out wafer level package and methods of manufacturing a grid fan-out wafer level package
10/23/2013CN103367273A Method for manufacturing high-heating-flux radiating fin type radiator and radiator thereof
10/23/2013CN103367272A 半导体模块 Semiconductor Modules
10/23/2013CN103367271A Semiconductor packages and methods of formation thereof
10/23/2013CN103367270A Aluminum silicon carbide composite material with laser welding layer and preparing method of aluminum silicon carbide composite material
10/23/2013CN103367269A Separation mixed substrate for radio frequency application
10/23/2013CN103367268A PCB based RF-power package window frame
10/23/2013CN103367267A Solder-mounted board, production method therefor, and semiconductor device
10/23/2013CN103367266A Semiconductor packaging structure with stress buffer body
10/23/2013CN103367265A Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
10/23/2013CN103367264A Package carrier plate capable of avoiding overflow of adhesive material
10/23/2013CN103367263A Improved injection molding packaging structure and packaging method of high-power semiconductor modules
10/23/2013CN103367246A Improved system for electrical testing of through-silicon vias (tsvs), and corresponding manufacturing process
10/23/2013CN103367244A Back-side MOM/MIM devices
10/23/2013CN103367243A Shallow via formation by oxidation
10/23/2013CN103367180A A semiconductor package structure and a manufacture method thereof
10/23/2013CN103367178A Stacked semiconductor package
10/23/2013CN103367176A Manufacturing method for semiconductor device
10/23/2013CN103367174A Method for fabricating a semiconductor device and semiconductor device
10/23/2013CN103367173A Method for manufacturing semiconductor device and semiconductor device
10/23/2013CN103367169A Ultrathin buried die module and method of manufacturing thereof
10/23/2013CN103366798A DRAM (Dynamic Random Access Memory) and production method as well as semiconductor packaging component and packaging method
10/23/2013CN103361582A Preparing process of high-performance copper alloy specially-shaped belt for lead frame
10/23/2013CN103361528A Magnesium alloy radiator die casting of LED lamp bulb and manufacturing method thereof
10/23/2013CN103361508A High-performance copper alloy material for lead frame
10/23/2013CN103361016A Underfill adhesive composition
10/23/2013CN103360601A Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device
10/23/2013CN103359681A Sensor, method for producing sensor and method for mounting sensor
10/23/2013CN102627929B Underfill flowable at room temperature and rapidly solidified at low temperature, and preparation method thereof
10/23/2013CN102472600B Heat sink for electronic or electrical component
10/23/2013CN102388163B Masking jig, substrate heating apparatus, and film formation method
10/23/2013CN102160174B Conductive emissions protection
10/23/2013CN102149655B Manufacturing method of aluminum-diamond composite
10/23/2013CN101930957B Power semiconductor device package and fabrication method
10/23/2013CN101794735B Methods of forming contact structures and semiconductor devices fabricated using contact structures
10/23/2013CN101661936B Semiconductor device and fabricating method for same
10/23/2013CN101645428B 安装结构体以及电子设备 And an electronic device mounting structure
10/23/2013CN101626024B 半导体装置 Semiconductor device
10/23/2013CN101593738B Semiconductor device and method for manufacturing same
10/23/2013CN101414600B Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same
10/22/2013US8564947 Heat exhaustion structure for heat dissipating device
10/22/2013US8564676 Semiconductor device with anti-shake control function
10/22/2013US8564143 Overlay mark for multiple pre-layers and currently layer
10/22/2013US8564142 Radiation curable ink jet ink composition and ink jet recording method
10/22/2013US8564141 Chip unit and stack package having the same
10/22/2013US8564140 Mono-acid hybrid conductive composition and method
10/22/2013US8564139 Semiconductor devices including protected barrier layers
10/22/2013US8564138 Semiconductor integrated circuit having a three-dimensional (3D) stack package structure
10/22/2013US8564137 System for relieving stress and improving heat management in a 3D chip stack having an array of inter-stack connections
10/22/2013US8564136 Semiconductor device and method for fabricating the same
10/22/2013US8564135 Backside illuminated sensor and manufacturing method thereof
10/22/2013US8564134 Semiconductor substrate, semiconductor device, and manufacturing methods thereof
10/22/2013US8564133 Chip package and method for forming the same
10/22/2013US8564132 Tungsten metallization: structure and fabrication of same
10/22/2013US8564131 Semiconductor device and method for manufacturing the same
10/22/2013US8564130 Vertical organic transistor, method for manufacturing the vertical organic transistor, and light emitting element
10/22/2013US8564129 Low resistivity contact
10/22/2013US8564128 Semiconductor device and manufacturing method of the same
10/22/2013US8564127 Semiconductor device
10/22/2013US8564125 Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereof
10/22/2013US8564124 Semiconductor package
10/22/2013US8564123 Chip package and fabrication method thereof
10/22/2013US8564122 Circuit board component shim structure
10/22/2013US8564121 Semiconductor device and manufacturing method of semiconductor device
10/22/2013US8564120 Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside
10/22/2013US8564119 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
10/22/2013US8564118 Power module substrate, power module, and method for manufacturing power module substrate
10/22/2013US8564117 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing
10/22/2013US8564116 Semiconductor device with reinforcement plate and method of forming same
10/22/2013US8564115 Package structure having micro-electromechanical element
10/22/2013US8564114 Semiconductor package thermal tape window frame for heat sink attachment
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