| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/28/1999 | US5959247 Low cost protective coating and method for a die-on-board electronic assembly |
| 09/28/1999 | US5959157 Process for making hydroxy-substituted ethynylated biphenyl compounds |
| 09/28/1999 | US5959068 Adhesive tape for electronic parts and liquid adhesive |
| 09/28/1999 | US5959043 Halogen-free flame resistant epoxy resins |
| 09/28/1999 | US5959021 Protection of devices |
| 09/28/1999 | US5958996 Method for producing a diffusion barrier and polymeric article having a diffusion barrier |
| 09/28/1999 | US5958807 High magnesium content glass ceramic having forsterite and cordierite crytstals has very low dissipation factor and thermal coefficient of expansion values compatible with metal or ceramic substrates of circuit boards |
| 09/28/1999 | US5958800 Method for post planarization metal photolithography |
| 09/28/1999 | US5958653 Method of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package |
| 09/28/1999 | US5958636 Pattern drawing method using charged particle beams |
| 09/28/1999 | US5958607 Eliminates intermediate nickel layer that causes metal diffusion and cracking |
| 09/28/1999 | US5958600 Conductor such as copper, chromium or nickel used in combination with an organic insulating material such as polyimide for formation of a thin film circuit on a ceramic board; noncracking, tensile strength |
| 09/28/1999 | US5958572 Multilayer; variations in heat conductivity |
| 09/28/1999 | US5958515 Treating surface of cured silicone with primer selected from mixture of silanol functional polysiloxane and epoxy functional alkoxysilane and/or polysiloxane, sealing with resin sealant, curing |
| 09/28/1999 | US5958505 Applying a silicide layer on a surface of a silicon-based substrate, applying a mask to the silicide layer, and locally oxidizing the silicide layer through the mask on a boundary surface thereof |
| 09/28/1999 | US5958331 Fe-Ni based alloy sheet having superior surface characteristic and superior etchability |
| 09/28/1999 | US5958176 Polysiloxanes |
| 09/28/1999 | US5958100 Process of making a glass semiconductor package |
| 09/28/1999 | US5957704 Socket for electrical connection of an electrical component |
| 09/28/1999 | US5957659 Heat sink apparatus |
| 09/28/1999 | US5957413 Modifications of fluid flow about bodies and surfaces with synthetic jet actuators |
| 09/28/1999 | US5957194 Plate fin heat exchanger having fluid control means |
| 09/28/1999 | US5956840 Low cost hermetic sealed microwave module packaging |
| 09/23/1999 | WO1999048346A1 Electronic equipment |
| 09/23/1999 | WO1999048149A1 Stepper alignment mark formation with dual field oxide process |
| 09/23/1999 | WO1999048145A1 Semiconductor device, method for manufacturing the same, and mounting structure of the same |
| 09/23/1999 | WO1999048143A2 Method of manufacturing semiconductor devices with 'chip size package' |
| 09/23/1999 | WO1999048140A1 Attachment method for stacked integrated circuit (ic) chips |
| 09/23/1999 | WO1999048110A1 Anisotropic conductive film |
| 09/23/1999 | WO1999047994A1 System for cooling device in computer |
| 09/23/1999 | WO1999046970A2 Cover assembly for an ic socket |
| 09/23/1999 | WO1999041770A3 Routing topology for identical connector point layouts on primary and secondary sides of a substrate |
| 09/23/1999 | DE19911916A1 Semiconductor component e.g. an acceleration or pressure sensor chip |
| 09/23/1999 | DE19909524A1 Power module with several power thyristors and integral temperature probe |
| 09/23/1999 | DE19908979A1 Base for positioning semiconductor device on circuit board |
| 09/23/1999 | DE19845294A1 Semiconductor device with silicon-on-insulator structure |
| 09/23/1999 | DE19843650A1 Semiconductor device production process for producing a laser cut device with a rear plated heat sink |
| 09/23/1999 | DE19841764A1 Semiconductor component with a chip having a lead-on-chip structure mounted on a lead structuring substrate |
| 09/23/1999 | DE19828190A1 Terminal arrangement |
| 09/23/1999 | DE19825608C1 Integrated circuit |
| 09/23/1999 | DE19816219C1 Semiconductor element with capacitive storage element |
| 09/23/1999 | DE19814079A1 Quiet CPU cooler with a high degree of efficiency |
| 09/22/1999 | EP0944116A2 Fabrication method of cadmium selenide thin film transistors |
| 09/22/1999 | EP0944115A1 High gain amplifier |
| 09/22/1999 | EP0943931A2 Imaging apparatus |
| 09/22/1999 | EP0943639A2 Epoxy resin composition and resin-encapsulated semiconductor device |
| 09/22/1999 | EP0943170A1 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 09/22/1999 | EP0943157A1 Integrated electronic circuit |
| 09/22/1999 | CN1229525A Semiconductor package and method for manufacturing the same |
| 09/22/1999 | CN1229523A Method of manufacturing semiconductor device with multilayer wiring |
| 09/22/1999 | CN1229330A Hybrid module and making method thereof and mounting method thereof |
| 09/22/1999 | CN1229279A Fastening device |
| 09/22/1999 | CN1229278A Semiconductor device and method for manufacturing same |
| 09/21/1999 | US5956618 Process for producing multi-level metallization in an integrated circuit |
| 09/21/1999 | US5956615 Method of forming a metal contact to landing pad structure in an integrated circuit |
| 09/21/1999 | US5956607 Laser wire bonding for wire embedded dielectrics to integrated circuits |
| 09/21/1999 | US5956606 Method for bumping and packaging semiconductor die |
| 09/21/1999 | US5956605 Use of nitrides for flip-chip encapsulation |
| 09/21/1999 | US5956601 Method of mounting a plurality of semiconductor devices in corresponding supporters |
| 09/21/1999 | US5956596 Method of forming and cleaning a laser marking region at a round zone of a semiconductor wafer |
| 09/21/1999 | US5956592 Method of manufacturing a semiconductor device having polysilicon resistors with a specific resistance ratio resistant to manufacturing processes |
| 09/21/1999 | US5956576 Enhanced protection of semiconductors with dual surface seal |
| 09/21/1999 | US5956575 Microconnectors |
| 09/21/1999 | US5956574 Lead frame flash removing method and apparatus |
| 09/21/1999 | US5956573 Use of argon sputtering to modify surface properties by thin film deposition |
| 09/21/1999 | US5956569 Integrated thermoelectric cooler formed on the backside of a substrate |
| 09/21/1999 | US5956567 Semiconductor chip and semiconductor wafer having power supply pads for probe test |
| 09/21/1999 | US5956566 Method and test site to monitor alignment shift and buried contact trench formation |
| 09/21/1999 | US5956564 Method of making a side alignment mark |
| 09/21/1999 | US5956563 Method for reducing a transient thermal mismatch |
| 09/21/1999 | US5956560 Tungsten-copper composite powder |
| 09/21/1999 | US5956237 Primary printed wiring board |
| 09/21/1999 | US5956232 Chip support arrangement and chip support for the manufacture of a chip casing |
| 09/21/1999 | US5956231 Semiconductor device having power semiconductor elements |
| 09/21/1999 | US5956229 Injection molded thermal interface system |
| 09/21/1999 | US5955789 Ball grid array module |
| 09/21/1999 | US5955788 Semiconductor device having multilevel wiring with improved planarity |
| 09/21/1999 | US5955787 Method for forming intermetal dielectric with SOG etchback and CMP |
| 09/21/1999 | US5955786 Semiconductor device using uniform nonconformal deposition for forming low dielectric constant insulation between certain conductive lines |
| 09/21/1999 | US5955785 Copper-containing plug for connection of semiconductor surface with overlying conductor |
| 09/21/1999 | US5955784 Ball contact for flip-chip device |
| 09/21/1999 | US5955783 High frequency signal processing chip having signal pins distributed to minimize signal interference |
| 09/21/1999 | US5955781 Embedded thermal conductors for semiconductor chips |
| 09/21/1999 | US5955780 Contact converting structure of semiconductor chip and process for manufacturing semiconductor chip having said contact converting structure |
| 09/21/1999 | US5955779 Method of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package, and resist image remover |
| 09/21/1999 | US5955778 Lead frame with notched lead ends |
| 09/21/1999 | US5955777 Lead frame assemblies with voltage reference plane and IC packages including same |
| 09/21/1999 | US5955773 Closely pitched polysilicon fuses and method of forming the same |
| 09/21/1999 | US5955762 Microelectronic package with polymer ESD protection |
| 09/21/1999 | US5955752 Semiconductor module having antenna element therein |
| 09/21/1999 | US5955751 Programmable device having antifuses without programmable material edges and/or corners underneath metal |
| 09/21/1999 | US5955392 Thin, smooth sheet comprising fine zirconia particles in organic binder; good surface quality |
| 09/21/1999 | US5955380 Endpoint detection method and apparatus |
| 09/21/1999 | US5955245 Amidation to polyamic acid; imidation; evaporating solvent; coating; exposure to light |
| 09/21/1999 | US5955192 Polysilane |
| 09/21/1999 | US5955184 Bisphenol a type epoxy resin, novolak type epoxy resin, nitrogen-containing phenolic resin acting as a curing agent which is a reaction product of a phenolic compound, a guanamine compound and an aldehyde compound. |
| 09/21/1999 | US5955179 Coating for the structured production of conductors on the surface of electrically insulating substrates |
| 09/21/1999 | US5955148 Invention can be used as a substrate for integrated circuits and packaging material. |
| 09/21/1999 | US5954978 Heat activated bonding arrangements are made by resistance heating the bonding medium, for example solder, thermal activated adhesive or thermoplastic material, using electrically energized resistance elements |
| 09/21/1999 | US5954824 Test mode matrix circuit for an embedded microprocessor core |