Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1999
10/05/1999US5963795 Method of assembling a heat sink assembly
10/05/1999US5963793 Microelectronic packaging using arched solder columns
10/05/1999US5963792 Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
10/05/1999US5963784 Methods of determining parameters of a semiconductor device and the width of an insulative spacer of a semiconductor device
10/05/1999US5963782 Semiconductor component and method of manufacture
10/05/1999US5963781 Technique for determining semiconductor substrate thickness
10/05/1999US5963780 Method for detecting defect sizes in polysilicon and source-drain semiconductor devices
10/05/1999US5963773 Tungsten skeleton structure fabrication method employed in application of copper infiltration and tungsten-copper composite material fabrication method thereof
10/05/1999US5963689 Substrate edge connnector
10/05/1999US5963433 Bottom lead semiconductor package with recessed leads and fabrication method thereof
10/05/1999US5963430 Multi-electronic device package comprising at least two substrates and at least four layers of electrically conductive circuitry
10/05/1999US5963428 Cooling cap method and apparatus for tab packaged integrated circuit
10/05/1999US5963427 Multi-chip module with flexible circuit board
10/05/1999US5963285 Liquid crystal display with improved electrode adhesion and method for manufacturing same
10/05/1999US5963023 Power surge management for high performance integrated circuit
10/05/1999US5962926 Semiconductor device having multiple overlapping rows of bond pads with conductive interconnects and method of pad placement
10/05/1999US5962925 Mounting structure of electronic component having bumps
10/05/1999US5962923 In a multilayer integrated circuit
10/05/1999US5962922 Semiconductor device flat package
10/05/1999US5962920 Semiconductor device and a manufacturing method thereof
10/05/1999US5962919 Formed on a semiconductor substrate
10/05/1999US5962918 Semiconductor device having simple protective structure and process of fabrication thereof
10/05/1999US5962917 Semiconductor device package having end-face halved through-holes and inside-area through-holes
10/05/1999US5962912 Power semiconductor component with monolithically integrated precision resistor and method for the manufacture thereof
10/05/1999US5962911 Integrated circuit device
10/05/1999US5962910 Metal-to-metal via-type antifuse
10/05/1999US5962908 Contact regions for narrow trenches in semiconductor devices and method
10/05/1999US5962899 Electrostatic discharge protection circuit
10/05/1999US5962867 Test device
10/05/1999US5962810 Integrated circuit package employing a transparent encapsulant
10/05/1999US5962151 Method for controlling solderability of a conductor and conductor formed thereby
10/05/1999US5962139 Semiconductor sealant of epoxy resin and organic polymer-grafted silicone polymer
10/05/1999US5962133 Solder, electronic component mounted by soldering, and electronic circuit board
10/05/1999US5962113 Polysiloxane-amide
10/05/1999US5961713 Method for manufacturing a wafer having a microdefect-free layer of a precisely predetermined depth
10/05/1999US5961032 Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold
10/05/1999US5960871 Heat sink for a computer
10/05/1999US5960866 Method for manufacturing cooling unit comprising heat pipes and cooling unit
10/05/1999US5960863 Dissipating device for computer chips
10/05/1999US5960862 CPU heat sink mounting structure
10/05/1999US5960538 Printed circuit board
10/05/1999US5960536 Method for the preparation of a wiring circuit board for mounting of a semiconductor
10/05/1999US5960535 Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
09/1999
09/30/1999WO1999049513A1 An inductance device
09/30/1999WO1999049512A1 Semiconductor device and method of manufacturing the same
09/30/1999WO1999049511A1 Semiconductor device, manufacture of semiconductor device, circuit board and electronic device
09/30/1999WO1999049509A1 Wiring method for producing a vertical, integrated circuit structure and vertical, integrated circuit structure
09/30/1999WO1999049507A1 Flip chip mounting technique
09/30/1999WO1999049499A2 Method for connecting and supporting a csp housing connection with an integrated circuit
09/30/1999DE19832330A1 Test holder for integrated circuit with solder ball connections serving as test points
09/30/1999DE19812921A1 VLSI circuit with temperature monitoring
09/30/1999CA2325535A1 An inductance device
09/29/1999EP0946086A1 Plated leadframes with cantilever leads
09/29/1999EP0944922A1 Chip module and manufacture of same
09/29/1999EP0944917A1 Os RECTIFYING SCHOTTKY AND OHMIC JUNCTION AND W/WC/TiC OHMIC CONTACTS ON SiC
09/29/1999EP0944909A1 Electroceramic component and method for its manufacture
09/29/1999EP0944685A1 Die attach adhesive compositions
09/29/1999EP0944671A1 Thermally reworkable binders for flip-chip devices
09/29/1999CN2341277Y Plastic sealer for semiconductor electric discharge tube
09/29/1999CN1230290A Radio-frequency package with double earth wire
09/29/1999CN1230013A Mfg. method of semiconductor device and semiconductor device
09/28/1999US5960320 Coating contact surface and via side walls with barrier layer prior to chemical vapor deposition of aluminum wiring material to prevent semiconductor substrate material and aluminum from migrating into each other
09/28/1999US5960318 Borderless contact etch process with sidewall spacer and selective isotropic etch process
09/28/1999US5960316 Method to fabricate unlanded vias with a low dielectric constant material as an intraline dielectric
09/28/1999US5960313 Metal wire of semiconductor device and method for forming the same
09/28/1999US5960311 Method for forming controlled voids in interlevel dielectric
09/28/1999US5960310 Polishing methods for forming a contact plug
09/28/1999US5960309 Semiconductor integrated circuit and wiring method
09/28/1999US5960308 Process for making a chip sized semiconductor device
09/28/1999US5960307 Method of forming ball grid array contacts
09/28/1999US5960263 Laser programming of CMOS semiconductor devices using make-link structure
09/28/1999US5960261 Method for manufacturing semiconductor package
09/28/1999US5960260 Semiconductor device, its manufacturing method, and dicing adhesive element therefor
09/28/1999US5960258 Underfill coating for LOC package
09/28/1999US5960254 Methods for the preparation of a semiconductor structure having multiple levels of self-aligned interconnection metallization
09/28/1999US5960253 Method of manufacturing semiconductor memory device capable of readily repairing defective portion resulting from mask defect
09/28/1999US5959846 Modular surface mount circuit device and a manufacturing method thereof
09/28/1999US5959839 Apparatus for heat removal using a flexible backplane
09/28/1999US5959838 Structure of a CPU radiator
09/28/1999US5959363 Semiconductor device with improved encapsulating resin
09/28/1999US5959362 Device mounting a semiconductor element on a wiring substrate including an adhesive material having first and second adhesive components with different cure characteristics
09/28/1999US5959360 Interconnect structure employing equivalent resistance paths to improve electromigration resistance
09/28/1999US5959359 Semiconductor device with a copper wiring pattern
09/28/1999US5959358 Oxidation resistant high conductivity copper layers for microelectronic applications and process of making same
09/28/1999US5959357 Fet array for operation at different power levels
09/28/1999US5959356 Solder ball grid array carrier package with heat sink
09/28/1999US5959355 Semiconductor package having mechanically and electrically bonded supportive elements
09/28/1999US5959354 Connection components with rows of lead bond sections
09/28/1999US5959353 Semiconductor device
09/28/1999US5959352 Chip arrangement and method of producing the same
09/28/1999US5959351 Liquid-cooled electronic device
09/28/1999US5959350 Fixing device for securing a heat sink to a CPU module
09/28/1999US5959349 Transfer molding encapsulation of a semiconductor die with attached heat sink
09/28/1999US5959348 Construction of PBGA substrate for flip chip packing
09/28/1999US5959347 LOC semiconductor assembled with room temperature adhesive
09/28/1999US5959345 Edge termination for zener-clamped power device
09/28/1999US5959320 Semiconductor die having on-die de-coupling capacitance
09/28/1999US5959311 Structure of an antenna effect monitor
09/28/1999US5959310 Multi-chip module system
09/28/1999US5959309 Sensor to monitor plasma induced charging damage
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