Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1999
10/13/1999EP0949672A2 PO Flow for copper metallization
10/13/1999EP0949669A2 Method of fabricating semiconductor device
10/13/1999EP0949663A2 Deposition of an insulating film comprising carbon
10/13/1999EP0949343A1 Copper alloy sheet for electronic parts
10/13/1999EP0948879A1 Ceramic composite wiring structures for semiconductor devices and method of manufacture
10/13/1999EP0948815A1 Chip module and manufacturing process
10/13/1999EP0948814A1 Chip scale ball grid array for integrated circuit package
10/13/1999EP0948813A1 Chip module and method for producing the same
10/13/1999EP0948811A1 Module with integrated circuit comprising a shaping device
10/13/1999EP0948808A1 Integrated circuits and methods for their fabrication
10/13/1999EP0948807A1 Integrated circuit electrode structure and process for fabricating same
10/13/1999EP0948430A1 Super conducting heat transfer medium
10/13/1999EP0799286B1 Mouldings made of polyurethane hot-melt-type adhesives
10/13/1999CN1231765A Chip method especially for implantation in chip card body
10/13/1999CN1231764A Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same
10/13/1999CN1231575A Terminal installation structure for printed circuit board
10/13/1999CN1231513A Semiconductor device and design method and the recording medium and support system for said method
10/13/1999CN1231510A Method for eliminating pin-hole on silicon nitride protective layer
10/13/1999CN1231505A Method and apparatus for making semiconductor device
10/13/1999CN1231504A Semiconductor device and making process thereof
10/13/1999CN1231501A Semiconductor device and making process thereof
10/13/1999CN1045693C Contact structure for interconnections, interposer, semiconductor assembly and method
10/12/1999US5966634 Method of manufacturing semiconductor device having multi-layer wiring structure with diffusion preventing film
10/12/1999US5966628 Process design for wafer edge in vlsi
10/12/1999US5966619 Process for forming a semiconductor device having a conductive member that protects field isolation during etching
10/12/1999US5966613 Consistent alignment mark profiles on semiconductor wafers using metal organic chemical vapor deposition titanium nitride protective
10/12/1999US5966593 Method of forming a wafer level contact sheet having a permanent z-axis material
10/12/1999US5966592 Structure and method for making a compliant lead for a microelectronic device
10/12/1999US5966587 Methods of making semiconductor assemblies with reinforced peripheral regions
10/12/1999US5966580 Process for making a thin film using a metal paste
10/12/1999US5966317 Memory cell
10/12/1999US5966291 Power module for the control of electric motors
10/12/1999US5966290 Electronic packages and a method to improve thermal performance of electronic packages
10/12/1999US5966287 Clip on heat exchanger for a memory module and assembly method
10/12/1999US5966052 Voltage-controlled oscillator with input and output on opposite corners of substrate
10/12/1999US5966024 Sensitive method of evaluating process induced damage in MOSFETs using a differential amplifier operational principle
10/12/1999US5965948 Semiconductor device having doubled pads
10/12/1999US5965947 Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads
10/12/1999US5965946 Package having Au layer semiconductor device having Au layer
10/12/1999US5965945 Lead solder bump shield
10/12/1999US5965944 Printed circuit boards for mounting a semiconductor integrated circuit die
10/12/1999US5965943 Semiconductor device with bonding pad electrode
10/12/1999US5965940 Integrated circuit structure
10/12/1999US5965938 Integrated two-tiered via-plug to improve metal lithography # 4
10/12/1999US5965937 Thermal interface attach mechanism for electrical packages
10/12/1999US5965936 Multi-layer lead frame for a semiconductor device
10/12/1999US5965935 Low loss ridged microstrip line for monolithic microwave integrated circuit (MMIC) applications
10/12/1999US5965934 Multilayer photoresist
10/12/1999US5965933 Semiconductor packaging apparatus
10/12/1999US5965927 Protective coatings over openings in dielectric
10/12/1999US5965924 Semiconductor structure
10/12/1999US5965920 Input protection circuit
10/12/1999US5965903 Device and method of manufacture for an integrated circuit having a BIST circuit and bond pads incorporated therein
10/12/1999US5965637 Use of silicone-modified epoxy resins as sealing compound
10/12/1999US5965270 Voltage programmable, low on-resistance antifuse comprises a substrate, an oxide layer, an aluminum layer an i-a-silicon carbide:h barrier enhancement layer of given thickness and an i-a-silicon:h material as insulation layer of given thickness
10/12/1999US5965193 Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material
10/12/1999US5964552 Method and cutting insert for cutting screw threads in metal work pieces
10/12/1999US5964396 In an electronic module
10/12/1999US5964285 Heat sink
10/12/1999US5964030 Method of forming an integrated circuit package assembly
10/08/1999CA2268769A1 Method of fabricating semiconductor device
10/07/1999WO1999051069A2 Fiber heat sink and fiber heat exchanger
10/07/1999WO1999050912A1 Semiconductor device and manufacture thereof
10/07/1999WO1999050910A1 Integrated circuit package having a thermoelectric cooling element therein
10/07/1999WO1999050909A1 Semiconductor socket converter module
10/07/1999WO1999050907A1 Semiconductor device, method for manufacturing the same, circuit board and electronic apparatus
10/07/1999WO1999050906A1 Semiconductor device and method for manufacturing the same, circuit substrate, and electronic device
10/07/1999WO1999050905A1 Wafer-pair having deposited layer sealed chambers
10/07/1999WO1999050904A1 Integrated circuit package and method of making
10/07/1999WO1999050901A1 Soldering material for die bonding
10/07/1999WO1999050677A1 Burn-in test socket
10/07/1999WO1999050676A1 Test socket lattice
10/07/1999WO1999022572A3 Method for producing and controlling electronic components
10/07/1999DE19914305A1 On-board device relaying digital input signal as complementary signal on transmission line pair
10/07/1999DE19900992A1 Semiconductor device especially an SOI MOSFET
10/07/1999DE19855216A1 Semiconductor component and associated conductor frame
10/07/1999CA2290587A1 Integrated circuit package and method of making
10/06/1999EP0948054A2 Buried patterned conductor planes for semiconductor-on-insulator integrated circuit
10/06/1999EP0948050A1 Electronic semiconductor power device with polycrystalline silicon components
10/06/1999EP0948049A1 Dual-mode microwave/millimeter wave integrated circuit package
10/06/1999EP0948048A1 Chip scale package
10/06/1999EP0948047A2 Electronic component cooling arrangement
10/06/1999EP0947604A1 Method and apparatus for reforming a substrate surface
10/06/1999EP0947593A2 Mo-W material for formation of wiring, Mo-W target and method for production thereof, and Mo-W wiring thin film
10/06/1999EP0946982A1 Tab tape ball grid array package with vias laterally offset from solder ball bond sites
10/06/1999EP0946980A1 Improved integrated circuit structures and methods to facilitate accurate measurement of the ic devices
10/06/1999EP0946646A1 Thermosetting encapsulants for electronics packaging
10/06/1999CN1230790A Semiconductor device with conductor flug and fabrication method thereof
10/06/1999CN1230788A Buried patterned conductor planes for semiconductor-on-insulator integrated circuit
10/06/1999CN1230783A Semiconductor device and lead fram for semiconductor device
10/06/1999CN1230782A Solid state pickup device excellent in heat-resistance and method of manufacturing the device
10/06/1999CN1230725A Design and methodology for manufacturing data processing systems having multiple processors
10/05/1999US5963835 Method of forming aluminum film
10/05/1999US5963832 Removal of metal cusp for improved contact fill
10/05/1999US5963831 Method of making an interconnect structure employing equivalent resistance paths to improve electromigration resistance
10/05/1999US5963827 Method for producing via contacts in a semiconductor device
10/05/1999US5963825 Method of fabrication of semiconductor fuse with polysilicon plate
10/05/1999US5963816 Method for making shallow trench marks
10/05/1999US5963813 Integrated circuitry and method of forming a field effect transistor
10/05/1999US5963796 Of a chip package
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